Connecting bonding areas at different heights

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CPC
H01L2224/24105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24105Connecting bonding areas at different heights

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
- Patent number 12,087,654
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 12,074,130
- Issue date Aug 27, 2024
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and semiconductor die
- Patent number 12,021,057
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, display device and control method
- Patent number 11,811,004
- Issue date Nov 7, 2023
- Hubei Yangtze Industrial Innovation Center Of Advanced Display Co., Ltd.
- Liang Xing
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Sensing component encapsulated by an encapsulant with a roughness s...
- Patent number 11,764,124
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,676,928
- Issue date Jun 13, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package and methods of manufacture thereof
- Patent number 11,664,349
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 11,605,607
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of making the same
- Patent number 11,552,014
- Issue date Jan 10, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,508,687
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a first die and a second die and a brid...
- Patent number 11,482,497
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,435,523
- Issue date Sep 6, 2022
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing component encapsulated by an encapsulation layer with a rou...
- Patent number 11,289,396
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging method, image sensor packaging structure, an...
- Patent number 11,282,879
- Issue date Mar 22, 2022
- Inno-Pach Technology Pte Ltd.
- Liping Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 11,133,242
- Issue date Sep 28, 2021
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,121,102
- Issue date Sep 14, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,114,404
- Issue date Sep 7, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,094,641
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 11,081,457
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, electronic component and method of manufactur...
- Patent number 11,069,639
- Issue date Jul 20, 2021
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
- Publication number 20240355698
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240321814
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20240266298
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE AND DISPLAY DEVICE
- Publication number 20240170433
- Publication date May 23, 2024
- LG ELECTRONICS INC.
- Bongseok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
- Publication number 20240145429
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Riccardo VILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079364
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20240014121
- Publication date Jan 11, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
- Publication number 20230369158
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY MICROBUMP ARRAYS WITH ENHANCED ADHESION AND METHODS OF...
- Publication number 20230107847
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Kun LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE
- Publication number 20230063539
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST WAFER LEVEL PACKAGES AND SILICON
- Publication number 20230032887
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20230036283
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230014450
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME
- Publication number 20230006095
- Publication date Jan 5, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hoo Keun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367768
- Publication date Nov 17, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sung Geun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20220302065
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING MICRO LED
- Publication number 20220231002
- Publication date Jul 21, 2022
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Jaekyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A FIRST DIE AND A SECOND DIE AND A BRID...
- Publication number 20220223534
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220223490
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20220189936
- Publication date Jun 16, 2022
- Murata Manufacturing Co., Ltd.
- Takayuki TSUTSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220148987
- Publication date May 12, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT DEVICE
- Publication number 20220084974
- Publication date Mar 17, 2022
- RISING TECHNOLOGIES CO., LTD.
- Shuzo AKEJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...
- Publication number 20210366865
- Publication date Nov 25, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210335765
- Publication date Oct 28, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jong Chan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING POR...
- Publication number 20210335750
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS

Connecting bonding areas at different heights

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensing die encapsulated by an encapsulant with a roughness surface...

Semiconductor package and methods of manufacturing a semiconductor...

Electronic circuit device

Semiconductor device and corresponding method of manufacture

Package structure and method of forming the same

Package structure with bridge die laterally wrapped by insulating e...

Semiconductor structure and semiconductor die

Semiconductor packages using package in package systems and related...

Fan-out package having a main die and a dummy die

Wafer scale bonded active photonics interposer

Semiconductor package and manufacturing method thereof

Display panel, display device and control method

Sensing component encapsulated by an encapsulant with a roughness s...

Electronic device including electrical connections on an encapsulat...

Stacked chip package and methods of manufacture thereof

Semiconductor device and methods of manufacture

Semiconductor package structure and method of making the same

Semiconductor package

Package structure including a first die and a second die and a brid...

Multi-die package with bridge layer

Wafer scale bonded active photonics interposer

Sensing component encapsulated by an encapsulation layer with a rou...

Image sensor packaging method, image sensor packaging structure, an...

Method of manufacturing semiconductor devices, corresponding device...

Bare die integration with printed components on flexible substrate...

Semiconductor package and manufacturing method thereof

Electronic device including electrical connections on an encapsulat...

Fan-out package having a main die and a dummy die

Semiconductor package and methods of manufacturing a semiconductor...

Semiconductor module, electronic component and method of manufactur...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

Fan-Out Package Having a Main Die and a Dummy Die

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

LIGHT EMITTING DEVICE PACKAGE AND DISPLAY DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...

Die Structures and Methods of Forming the Same

ELECTRONIC CIRCUIT MODULE

SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...

DISPLAY PANEL

HIGH-DENSITY MICROBUMP ARRAYS WITH ENHANCED ADHESION AND METHODS OF...

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE

LOW COST WAFER LEVEL PACKAGES AND SILICON

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Methods of Manufacture

METHOD FOR TRANSFERRING MICRO LED

PACKAGE STRUCTURE INCLUDING A FIRST DIE AND A SECOND DIE AND A BRID...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC CIRCUIT DEVICE

ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...

DISPLAY DEVICE

CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING POR...