Connecting bonding areas at the same height

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H01L2224/40101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40101Connecting bonding areas at the same height

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module
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- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Information Patent Grant
Semiconductor module
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- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
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- Issue date Apr 9, 2024
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
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- Illinois Tool Works Inc.
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Information Patent Grant
Process for fabricating circuit components in matrix batches
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- Issue date Dec 6, 2022
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of heat sinks for a semiconductor package
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- Issue date Nov 29, 2022
- Agency for Science, Technology and Research
- Gongyue Tang
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Information Patent Grant
Semiconductor module with temperature detecting element
- Patent number 10,580,754
- Issue date Mar 3, 2020
- Mitsubishi Electric Corporation
- Shinya Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
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- Issue date Aug 21, 2018
- Renesas Electronics Corporation
- Koji Bando
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Common-source packaging structure
- Patent number 10,056,355
- Issue date Aug 21, 2018
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- Chien-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common-source packaging structure
- Patent number 9,997,500
- Issue date Jun 12, 2018
- Taiwan Semiconductor Co., Ltd.
- Chien-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing an electronic module
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- Issue date Sep 19, 2017
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 9,468,993
- Issue date Oct 18, 2016
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip device including a substrate
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- Issue date Jul 5, 2016
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- Ivan Nikitin
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Information Patent Grant
Semiconductor package with multi-level die block
- Patent number 9,275,944
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding material and method for packaging semiconductor chips
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- Issue date Dec 8, 2015
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
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- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
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SANDWICH PACKAGE FOR MICROELECTRONICS
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FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
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- Ning TANG
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SEMICONDUCTOR DEVICE
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- Hiroto SAKAI
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Information Patent Application
SEMICONDUCTOR MODULE
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- ROHM CO., LTD.
- Kenji HAYASHI
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SEMICONDUCTOR MODULE
- Publication number 20230402421
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230343755
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MODULE
- Publication number 20230307411
- Publication date Sep 28, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND SEMICONDUCTOR MODULE
- Publication number 20210288016
- Publication date Sep 16, 2021
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SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
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- Semiconductor Components Industries, LLC
- Inpil YOO
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ELECTRONIC DEVICE
- Publication number 20180331002
- Publication date Nov 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Koji BANDO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COMMON-SOURCE PACKAGING STRUCTURE
- Publication number 20180166423
- Publication date Jun 14, 2018
- TAIWAN SEMICONDUCTOR CO., LTD.
- Chien-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON-SOURCE PACKAGING STRUCTURE
- Publication number 20180166422
- Publication date Jun 14, 2018
- TAIWAN SEMICONDUCTOR CO., LTD.
- Chien-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
- Publication number 20140312497
- Publication date Oct 23, 2014
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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- Publication date Aug 28, 2014
- Tsuyoshi Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE...
- Publication number 20140203420
- Publication date Jul 24, 2014
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130105985
- Publication date May 2, 2013
- Junji TSURUOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Connecting bonding areas at the same height

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module

Semiconductor packages using package in package systems and related...

Semiconductor module

Semiconductor module

Ribbon bond solution for reducing thermal stress on an intermittent...

Process for fabricating circuit components in matrix batches

Plurality of heat sinks for a semiconductor package

Semiconductor module with temperature detecting element

Electronic device

Common-source packaging structure

Common-source packaging structure

Electronic module and method for producing an electronic module

Method for producing semiconductor device

Multichip device including a substrate

Semiconductor package with multi-level die block

Molding material and method for packaging semiconductor chips

Semiconductor device using diffusion soldering

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

SEMICONDUCTOR MODULE

SANDWICH PACKAGE FOR MICROELECTRONICS

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR MODULE

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

Electrical Circuit Body, Power Converter, and Electrical Circuit Bo...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

WIRING STRUCTURE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

ELECTRONIC DEVICE

COMMON-SOURCE PACKAGING STRUCTURE

COMMON-SOURCE PACKAGING STRUCTURE

Molding Material and Method for Packaging Semiconductor Chips

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE...

Semiconductor Device Using Diffusion Soldering

SEMICONDUCTOR DEVICE