Connecting bonding areas at the same height

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CPC
H01L2224/24101

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24101Connecting bonding areas at the same height

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light emitting array structure and display
- Patent number 12,094,861
- Issue date Sep 17, 2024
- Lextar Electronics Corporation
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dipole alignment apparatus for use in manufacturing of display devi...
- Patent number 12,068,279
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,062,832
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
- Patent number 12,033,975
- Issue date Jul 9, 2024
- Olympus Corporation
- Keiichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,848,319
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,810,883
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing semiconductor elements
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- Issue date Sep 12, 2023
- UPPER ELEC. CO., LTD.
- Shih Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
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- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
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- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,652,076
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,646,270
- Issue date May 9, 2023
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 11,610,855
- Issue date Mar 21, 2023
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 11,587,900
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of making the same
- Patent number 11,552,014
- Issue date Jan 10, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, redistribution structure and method for form...
- Patent number 11,545,457
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless transmission module and manufacturing method
- Patent number 11,538,774
- Issue date Dec 27, 2022
- Huawei Technologies Co., Ltd.
- Qijing He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,495,590
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,404,333
- Issue date Aug 2, 2022
- Advanced Semiconductor Engineering, Inc.
- Yuan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,374,303
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,355,467
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, semiconductor package and method of fabric...
- Patent number 11,342,296
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging method, image sensor packaging structure, an...
- Patent number 11,282,879
- Issue date Mar 22, 2022
- Inno-Pach Technology Pte Ltd.
- Liping Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,239,096
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 11,232,957
- Issue date Jan 25, 2022
- PEP INOVATION PTE. LTD.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240387434
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240356199
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
- Publication number 20240332155
- Publication date Oct 3, 2024
- Intel Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
- Publication number 20240282740
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
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SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...
- Publication number 20240178086
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...
- Publication number 20240113087
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105661
- Publication date Mar 28, 2024
- Unimicron Technology Corp.
- Yu-Shen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047288
- Publication date Feb 8, 2024
- InnoLux Corporation
- Sheng-Nan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...
- Publication number 20230411263
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- SooHan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230386949
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jiyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230369273
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20230317693
- Publication date Oct 5, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...
- Publication number 20230307405
- Publication date Sep 28, 2023
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
- Publication number 20230290750
- Publication date Sep 14, 2023
- Sumitomo Electric Industries, Ltd.
- Tatsuya HASHINAGA
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Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...
- Publication number 20230162992
- Publication date May 25, 2023
- TOHOKU UNIVERSITY
- Takafumi FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A DOCUMENT STRUCTURE, AND DOCUMENT STRUCTURE
- Publication number 20230021853
- Publication date Jan 26, 2023
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME
- Publication number 20230006095
- Publication date Jan 5, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hoo Keun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Package
- Publication number 20220384411
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20220278067
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
- Publication number 20220262757
- Publication date Aug 18, 2022
- Samsung Electronics Co., LTD
- Taeho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPOLE ALIGNMENT DEVICE, DIPOLE ALIGNMENT METHOD AND DISPLAY DEVICE...
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- Publication date Aug 11, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TESTING SEMICONDUCTOR ELEMENTS
- Publication number 20220189834
- Publication date Jun 16, 2022
- Upper ELEC. CO., LTD.
- Shih Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157625
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ARRAY STRUCTURE AND DISPLAY
- Publication number 20220093578
- Publication date Mar 24, 2022
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20220077097
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, REDISTRIBUTION STRUCTURE AND METHOD FOR FORM...
- Publication number 20220068869
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Hao Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Connecting bonding areas at the same height

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting array structure and display

Chip packaging method and package structure

Dipole alignment apparatus for use in manufacturing of display devi...

Electronic device and manufacturing method thereof

Semiconductor device, endoscope, and method for manufacturing semic...

Semiconductor packages using package in package systems and related...

Semiconductor package and method of manufacturing the semiconductor...

Multi-chip semiconductor package

Electrical interconnect structure using metal bridges to interconne...

Package structure

Method for testing semiconductor elements

Integrated fan-out package and manufacturing method thereof

Manufacturing method of semiconductor structure

Semiconductor devices including thick pad

Multi-chip package and manufacturing method thereof

Chip packaging method and package structure

Package structure including IPD and method of forming the same

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Semiconductor package structure and method of making the same

Semiconductor package, redistribution structure and method for form...

Wireless transmission module and manufacturing method

Multi-chip semiconductor package

Semiconductor device and method for manufacturing the same

Package structure and method of fabricating the same

Chip package structure and manufacturing method thereof

Semiconductor devices including thick pad

Semiconductor structure, semiconductor package and method of fabric...

Image sensor packaging method, image sensor packaging structure, an...

Integrated fan-out package and manufacturing method thereof

Chip packaging method and package structure

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE

Semiconductor Packages and Methods of Forming RDL and Side and Back...

DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF

ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...

METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

METHOD FOR CREATING A DOCUMENT STRUCTURE, AND DOCUMENT STRUCTURE

LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME

Multi-Chip Semiconductor Package

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICES INCLUDING THICK PAD

DIPOLE ALIGNMENT DEVICE, DIPOLE ALIGNMENT METHOD AND DISPLAY DEVICE...

METHOD FOR TESTING SEMICONDUCTOR ELEMENTS

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING ARRAY STRUCTURE AND DISPLAY

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE, REDISTRIBUTION STRUCTURE AND METHOD FOR FORM...