connecting first both on and outside the semiconductor or solid-state body

Industry

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H01L2224/85191

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85191connecting first both on and outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with a semiconductor chip and a passive compon...
- Patent number 9,159,720
- Issue date Oct 13, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 8,952,551
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,816,514
- Issue date Aug 26, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,759,987
- Issue date Jun 24, 2014
- Nichia Corporation
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system and method of...
- Patent number 8,617,924
- Issue date Dec 31, 2013
- Stats Chippac Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packages providing reduced signal skew and related metho...
- Patent number 8,611,125
- Issue date Dec 17, 2013
- Samsung Electroncis Co., Ltd.
- YoungSeok Hong
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 8,530,278
- Issue date Sep 10, 2013
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a power semiconductor chip and a passive...
- Patent number 8,466,561
- Issue date Jun 18, 2013
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 8,450,150
- Issue date May 28, 2013
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,410,618
- Issue date Apr 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,395,248
- Issue date Mar 12, 2013
- Sharp Kabushiki Kaisha
- Yoshiaki Nozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-on-lead package system having leadfingers positioned between p...
- Patent number 8,362,601
- Issue date Jan 29, 2013
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packages providing reduced signal skew and related metho...
- Patent number 8,331,121
- Issue date Dec 11, 2012
- Samsung Electronics Co., Ltd.
- YoungSeok Hong
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit device and method for the production thereof
- Patent number 8,330,252
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and plural semiconductor elements with suppres...
- Patent number 8,198,728
- Issue date Jun 12, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulated semiconductor device and method for manufacturin...
- Patent number 8,193,091
- Issue date Jun 5, 2012
- Panasonic Corporation
- Fumihiko Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,134,240
- Issue date Mar 13, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power lead-on-chip ball grid array package
- Patent number 8,129,226
- Issue date Mar 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- James P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding over active circuits
- Patent number 8,125,091
- Issue date Feb 28, 2012
- LSI Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 8,105,932
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive systems and devices including wires coupled to anisotrop...
- Patent number 8,097,947
- Issue date Jan 17, 2012
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive layer forming a capacitor dielectric between semiconductor...
- Patent number 8,097,954
- Issue date Jan 17, 2012
- Fujitsu Semiconductor Limited
- Kaname Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package type semiconductor device
- Patent number 8,053,278
- Issue date Nov 8, 2011
- Oki Semiconductor Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package having adhesive/spacer structure and...
- Patent number 8,030,134
- Issue date Oct 4, 2011
- ChipPAC, Inc.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for integrated circuit ball bonding with subs...
- Patent number 8,025,201
- Issue date Sep 27, 2011
- Agere Systems Inc.
- Curtis James Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,008,785
- Issue date Aug 30, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 7,981,788
- Issue date Jul 19, 2011
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-bump bonded ribbon-wire interconnect
- Patent number 7,977,804
- Issue date Jul 12, 2011
- Tektronix, Inc.
- Dale E. Christensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,928,551
- Issue date Apr 19, 2011
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130330879
- Publication date Dec 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module With a Semiconductor Chip and a Passive Compon...
- Publication number 20130285132
- Publication date Oct 31, 2013
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGES PROVIDING REDUCED SIGNAL SKEW AND RELATED METHO...
- Publication number 20130062784
- Publication date Mar 14, 2013
- Samsung Electronics Co., Ltd.
- YoungSeok Hong
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20120193791
- Publication date Aug 2, 2012
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating the Same
- Publication number 20120187562
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
- Publication number 20120091568
- Publication date Apr 19, 2012
- INFINEON TECHNOLOGIES AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...
- Publication number 20120024089
- Publication date Feb 2, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jeremiah Couey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110285020
- Publication date Nov 24, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20110269268
- Publication date Nov 3, 2011
- Renesas Electronics Corporation
- NOBUYASU MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110147953
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100311234
- Publication date Dec 9, 2010
- NEC Electronics Corporation
- Yukinori Tabira
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Lead-on-Chip Ball Grid Array Package
- Publication number 20100270663
- Publication date Oct 28, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGES PROVIDING REDUCED SIGNAL SKEW AND RELATED METHO...
- Publication number 20100265751
- Publication date Oct 21, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- YoungSeok Hong
- G11 - INFORMATION STORAGE
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100261312
- Publication date Oct 14, 2010
- RENESAS TECHNOLOGY CORP.
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244213
- Publication date Sep 30, 2010
- Yoshiaki NOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-ON-LEAD PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF
- Publication number 20100140764
- Publication date Jun 10, 2010
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD OF...
- Publication number 20100044849
- Publication date Feb 25, 2010
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20090321927
- Publication date Dec 31, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL-BUMP BONDED RIBBON-WIRE INTERCONNECT
- Publication number 20090283920
- Publication date Nov 19, 2009
- Tektronix, Inc.
- Dale E. Christensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Pressure Element and Method for Fab...
- Publication number 20090261472
- Publication date Oct 22, 2009
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING OVER ACTIVE CIRCUITS
- Publication number 20090236742
- Publication date Sep 24, 2009
- LSI Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Semiconductor Package
- Publication number 20090189261
- Publication date Jul 30, 2009
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module with Flat Construction and Method for Placing Components
- Publication number 20090174054
- Publication date Jul 9, 2009
- Christian Block
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090096111
- Publication date Apr 16, 2009
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090057891
- Publication date Mar 5, 2009
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090039509
- Publication date Feb 12, 2009
- Matsushita Electric Industrial Co., Ltd.
- Manabu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Wire Semiconductor Lead Frame Package
- Publication number 20090014848
- Publication date Jan 15, 2009
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20080246137
- Publication date Oct 9, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

connecting first both on and outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module with a semiconductor chip and a passive compon...

Mixed wire semiconductor lead frame package

Semiconductor package and method for fabricating the same

Microelectronic assembly with joined bond elements having lowered i...

Semiconductor device and method of manufacturing the semiconductor...

Stacked integrated circuit package-in-package system and method of...

Multi-chip packages providing reduced signal skew and related metho...

Semiconductor device and a manufacturing method of the same

Semiconductor module with a power semiconductor chip and a passive...

Manufacturing method of semiconductor integrated circuit device

Microelectronic assembly with joined bond elements having lowered i...

Semiconductor device and manufacturing method therefor

Wire-on-lead package system having leadfingers positioned between p...

Multi-chip packages providing reduced signal skew and related metho...

Integrated circuit device and method for the production thereof

Semiconductor device and plural semiconductor elements with suppres...

Resin encapsulated semiconductor device and method for manufacturin...

Semiconductor device and manufacturing method for the same

Power lead-on-chip ball grid array package

Wire bonding over active circuits

Mixed wire semiconductor lead frame package

Conductive systems and devices including wires coupled to anisotrop...

Adhesive layer forming a capacitor dielectric between semiconductor...

Multi-chip package type semiconductor device

Stacked semiconductor package having adhesive/spacer structure and...

Methods and apparatus for integrated circuit ball bonding with subs...

Microelectronic assembly with joined bond elements having lowered i...

Semiconductor device and a manufacturing method of the same

Ball-bump bonded ribbon-wire interconnect

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

Semiconductor Module With a Semiconductor Chip and a Passive Compon...

MULTI-CHIP PACKAGES PROVIDING REDUCED SIGNAL SKEW AND RELATED METHO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Package and Method for Fabricating the Same

MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Power Lead-on-Chip Ball Grid Array Package

MULTI-CHIP PACKAGES PROVIDING REDUCED SIGNAL SKEW AND RELATED METHO...

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

WIRE-ON-LEAD PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF

STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD OF...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

BALL-BUMP BONDED RIBBON-WIRE INTERCONNECT

Power Semiconductor Module with Pressure Element and Method for Fab...

WIRE BONDING OVER ACTIVE CIRCUITS

Ultra-Thin Semiconductor Package

Module with Flat Construction and Method for Placing Components

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Mixed Wire Semiconductor Lead Frame Package

INTEGRATED CIRCUIT DEVICE AND METHOD FOR THE PRODUCTION THEREOF