connecting first on the semiconductor or solid-state body

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H01L2224/82181

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82181connecting first on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,507,606
- Issue date Mar 24, 2009
- Renesas Technology Corp.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,160,759
- Issue date Jan 9, 2007
- Hitachi, Ltd.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with pattern leads and method for manufacturi...
- Patent number 7,061,125
- Issue date Jun 13, 2006
- Samsung Electronics, Co. Ltd.
- Sung-Dae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,809,405
- Issue date Oct 26, 2004
- Renesas Technology Corp.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe semiconductor integrated circuit device using the same an...
- Patent number 5,637,913
- Issue date Jun 10, 1997
- Hitachi, Ltd.
- Yujiro Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor integrated circuit device using the same,...
- Patent number 5,378,656
- Issue date Jan 3, 1995
- Hitachi, Ltd.
- Yujiro Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device including multiple semiconductor chip...
- Patent number 5,373,188
- Issue date Dec 13, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 5,259,548
- Issue date Nov 9, 1993
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20060240600
- Publication date Oct 26, 2006
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040232528
- Publication date Nov 25, 2004
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with pattern leads and method for manufacturi...
- Publication number 20040155322
- Publication date Aug 12, 2004
- Sung-Dae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030111717
- Publication date Jun 19, 2003
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS

connecting first on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bare die integration with printed components on flexible substrate...

Bare die integration with printed components on flexible substrate...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor package with pattern leads and method for manufacturi...

Semiconductor device and method of manufacturing the same

Leadframe semiconductor integrated circuit device using the same an...

Leadframe, semiconductor integrated circuit device using the same,...

Packaged semiconductor device including multiple semiconductor chip...

Wire bonding method

Patents Applicationslast 30 patents

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor package with pattern leads and method for manufacturi...

Semiconductor device and method of manufacturing the same