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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,062,621
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 12,046,560
- Issue date Jul 23, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,688,726
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yasunori Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,670,596
- Issue date Jun 6, 2023
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having stacked die structure
- Patent number 11,476,200
- Issue date Oct 18, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,430,740
- Issue date Aug 30, 2022
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,373,954
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having redistribution layer structures
- Patent number 11,158,576
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded substrate package in fan-out wafer level package
- Patent number 10,720,393
- Issue date Jul 21, 2020
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded substrate package in fan-out wafer level package
- Patent number 10,403,580
- Issue date Sep 3, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure element and method for producing a conductor st...
- Patent number 9,456,500
- Issue date Sep 27, 2016
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379575
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE...
- Publication number 20240153921
- Publication date May 9, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Randy Yach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
- Publication number 20240072032
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ASSEMBLY, DISPLAY DEVICE, AND METHOD FOR MAKING LIGH...
- Publication number 20230290758
- Publication date Sep 14, 2023
- Century Technology (Shenzhen) Corporation Limited
- KUANG-HUA LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220328414
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220085003
- Publication date Mar 17, 2022
- KIOXIA Corporation
- Yasunori IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210313271
- Publication date Oct 7, 2021
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210057344
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20190393154
- Publication date Dec 26, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20190206800
- Publication date Jul 4, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor Structural Element and Method for Producing a Conductor S...
- Publication number 20120320549
- Publication date Dec 20, 2012
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS

Connecting portions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Microelectronic device with embedded die substrate on interposer

Microelectronic device with embedded die substrate on interposer

Semiconductor device

Semiconductor package structure

Semiconductor package structure having stacked die structure

Microelectronic device with embedded die substrate on interposer

Semiconductor package

Package structure having redistribution layer structures

Molded substrate package in fan-out wafer level package

Molded substrate package in fan-out wafer level package

Conductor structure element and method for producing a conductor st...

Multichip power semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE...

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...

LIGHT-EMITTING ASSEMBLY, DISPLAY DEVICE, AND METHOD FOR MAKING LIGH...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE

MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE

Conductor Structural Element and Method for Producing a Conductor S...