Connecting the strap to a bond pad of the item

Industry

CPC
H01L2224/40157

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40157Connecting the strap to a bond pad of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,784,155
- Issue date Oct 10, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit architecture
- Patent number 11,527,482
- Issue date Dec 13, 2022
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,289,441
- Issue date Mar 29, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) devices
- Patent number 10,147,698
- Issue date Dec 4, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit leads in packaging for radio frequency devices
- Patent number 9,824,995
- Issue date Nov 21, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 9,768,035
- Issue date Sep 19, 2017
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240120309
- Publication date Apr 11, 2024
- INFINEON TECHNOLOGIES AG
- Oliver Kreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACT...
- Publication number 20240071876
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Akira ISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY
- Publication number 20220216175
- Publication date Jul 7, 2022
- Wolfspeed, Inc.
- Sung Chul JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT ARCHITECTURE
- Publication number 20210233857
- Publication date Jul 29, 2021
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Processes for Increasing Semiconductor Device Reliability
- Publication number 20210111144
- Publication date Apr 15, 2021
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...
- Publication number 20180019222
- Publication date Jan 18, 2018
- NXP USA, Inc.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS

Connecting the strap to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and processes for increasing semiconductor device reliability

Hybrid integrated circuit architecture

Systems and processes for increasing semiconductor device reliability

Radio frequency (RF) devices

Flexible circuit leads in packaging for radio frequency devices

Electronic module and method for producing an electronic module

Patents Applicationslast 30 patents

POWER ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACT...

SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY

HYBRID INTEGRATED CIRCUIT ARCHITECTURE

Systems and Processes for Increasing Semiconductor Device Reliability

FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...