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Connecting the strap to a bond pad of the item

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  • CPC
  • H01L2224/40177
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40177Connecting the strap to a bond pad of the item
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device
    • Patent number 12,046,549
    • Issue date Jul 23, 2024
    • Rohm Co., Ltd.
    • Maiko Hatano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with solder standoff
    • Patent number 11,908,780
    • Issue date Feb 20, 2024
    • Texas Instruments Incorporated
    • Jonathan Almeria Noquil
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 11,621,216
    • Issue date Apr 4, 2023
    • Mitsubishi Electric Corporation
    • Kensuke Takeuchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with solder standoff
    • Patent number 11,177,197
    • Issue date Nov 16, 2021
    • Texas Instruments Incorporated
    • Jonathan Almeria Noquil
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,468,338
    • Issue date Nov 5, 2019
    • Renesas Electronics Corporation
    • Hiroya Shimoyama
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240096843
    • Publication date Mar 21, 2024
    • Kabushiki Kaisha Toshiba
    • Kyo TANABIKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
    • Publication number 20230245994
    • Publication date Aug 3, 2023
    • STMicroelectronics S.r.l
    • Mauro MAZZOLA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220344253
    • Publication date Oct 27, 2022
    • Rohm Co., Ltd.
    • Maiko HATANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
    • Publication number 20220115308
    • Publication date Apr 14, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Jonathan Almeria Noquil
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20210217687
    • Publication date Jul 15, 2021
    • Mitsubishi Electric Corporation
    • Kensuke TAKEUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
    • Publication number 20210090980
    • Publication date Mar 25, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Jonathan Almeria Noquil
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20190088577
    • Publication date Mar 21, 2019
    • RENESAS ELECTRONICS CORPORATION
    • Hiroya SHIMOYAMA
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER