Connecting the strap to a die pad of the item

Industry

CPC
H01L2224/40257

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40257Connecting the strap to a die pad of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked dies electrically connected to a package substrate by lead...
- Patent number 11,227,818
- Issue date Jan 18, 2022
- UTAC HEADQUARTERS PTE. LTD.
- Wing Keung Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module clips with connector bar
- Patent number 9,935,041
- Issue date Apr 3, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and resin-sealed semiconductor device
- Patent number 9,252,086
- Issue date Feb 2, 2016
- Fuji Electric Co., Ltd.
- Atsushi Maruyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240178179
- Publication date May 30, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Providing an Even Current Distribution and St...
- Publication number 20240170377
- Publication date May 23, 2024
- Infineon Technologies Austria AG
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240162205
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Marcus BÖHM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006368
- Publication date Jan 4, 2024
- ROHM CO., LTD.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20210035891
- Publication date Feb 4, 2021
- UTAC Headquarters Pte. Ltd.
- Wing Keung LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE
- Publication number 20130181334
- Publication date Jul 18, 2013
- FUJI ELECTRIC CO., LTD
- Atsushi MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Connecting the strap to a die pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked dies electrically connected to a package substrate by lead...

Multi-chip module clips with connector bar

Connector and resin-sealed semiconductor device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

Semiconductor Package Providing an Even Current Distribution and St...

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE