connecting the wire to a die pad of the item

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CPC
H01L2224/48237

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48237connecting the wire to a die pad of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,009,310
- Issue date Jun 11, 2024
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of making a semiconductor device
- Patent number 11,664,447
- Issue date May 30, 2023
- Nexperia B.V.
- Jeroen Croon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,227,983
- Issue date Jan 18, 2022
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with terminal pattern for increased channel d...
- Patent number 11,211,315
- Issue date Dec 28, 2021
- Texas Instruments Incorporated
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite board, light-emitting device, and manufacturing method of...
- Patent number 11,011,682
- Issue date May 18, 2021
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pad and bond wire or clip
- Patent number 10,971,435
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 10,930,524
- Issue date Feb 23, 2021
- Semiconductor Components Industries, LLC
- Chun-Li Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss substrate for high data rate applications
- Patent number 10,903,152
- Issue date Jan 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Yuan-Hsi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode (LED), LED package and apparatus including the...
- Patent number 10,734,559
- Issue date Aug 4, 2020
- Samsung Electronics Co., Ltd.
- Ha-nul Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat resistant and shock resistant integrated circuit
- Patent number 10,679,960
- Issue date Jun 9, 2020
- Hall Labs LLC
- David R. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device
- Patent number 10,636,940
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Wan Tae Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive shield for semiconductor package
- Patent number 10,586,771
- Issue date Mar 10, 2020
- UTAC HEADQUARTERS PTE, LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite board, light-emitting device, and manufacturing method of...
- Patent number 10,566,504
- Issue date Feb 18, 2020
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and solder bond structure
- Patent number 10,546,988
- Issue date Jan 28, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 10,396,261
- Issue date Aug 27, 2019
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and light-emitting device
- Patent number 10,367,121
- Issue date Jul 30, 2019
- Nichia Corporation
- Tadaaki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and display device having same
- Patent number 10,325,887
- Issue date Jun 18, 2019
- LG Innotek Co., Ltd
- Sun Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor light emitting device
- Patent number 10,304,990
- Issue date May 28, 2019
- Samsung Electronics Co., Ltd.
- Sang Heon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode (LED), LED package and apparatus including the...
- Patent number 10,243,123
- Issue date Mar 26, 2019
- Samsung Electronics Co., Ltd.
- Ha-nul Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor control signal gating
- Patent number 10,236,877
- Issue date Mar 19, 2019
- NAVITAS SEMICONDUCTOR, INC.
- Santosh Sharma
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
LED device
- Patent number 10,170,674
- Issue date Jan 1, 2019
- Citizen Watch Co., Ltd.
- Isao Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor control signal gating
- Patent number 10,110,221
- Issue date Oct 23, 2018
- Navitas Semiconductor, Inc.
- Santosh Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microcapsular quantum dot-polymer composite, method for producing t...
- Patent number 10,069,044
- Issue date Sep 4, 2018
- INDUSTRY-ACADEMIA COOPERATION GROUP OF SEJONG UNIV
- Young Soo Seo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing semiconductor light-emitting device
- Patent number 10,014,451
- Issue date Jul 3, 2018
- Sumitomo Chemical Company, Limited
- Shohei Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor light-emitting device
- Patent number 9,972,756
- Issue date May 15, 2018
- Sumitomo Chemical Company, Limited
- Gaku Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material layer stack, light emitting element, light emitting packag...
- Patent number 9,954,142
- Issue date Apr 24, 2018
- Samsung Electronics Co., Ltd.
- Keon-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite board, light-emitting device, and manufacturing method of...
- Patent number 9,911,904
- Issue date Mar 6, 2018
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and semiconductor package having the same
- Patent number 9,837,592
- Issue date Dec 5, 2017
- Vikiing Tech Corporation
- Chien-Hung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode (LED), LED package and apparatus including the...
- Patent number 9,799,809
- Issue date Oct 24, 2017
- Samsung Electronics Co., Ltd.
- Ha-nul Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030298
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20230378025
- Publication date Nov 23, 2023
- Hitachi, Ltd
- Kyota ASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTIN...
- Publication number 20190334068
- Publication date Oct 31, 2019
- Nichia Corporation.
- Tsuzuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE (LED), LED PACKAGE AND APPARATUS INCLUDING THE...
- Publication number 20190221730
- Publication date Jul 18, 2019
- Samsung Electronics Co., Ltd.
- Ha-nul YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS SUBSTRATE FOR HIGH DATA RATE APPLICATIONS
- Publication number 20190214337
- Publication date Jul 11, 2019
- Advanced Semiconductor Engineering, Inc.
- Yuan-Hsi CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Resistant and Shock Resistant Integrated Circuit
- Publication number 20180301400
- Publication date Oct 18, 2018
- David R. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BOARD, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHOD OF...
- Publication number 20180145229
- Publication date May 24, 2018
- Nichia Corporation.
- Tadao HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE (LED), LED PACKAGE AND APPARATUS INCLUDING THE...
- Publication number 20180013042
- Publication date Jan 11, 2018
- Samsung Electronics Co., Ltd.
- Ha-nul YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-HERMETIC SEMICONDUCTOR PACKAGE
- Publication number 20170062297
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD OF FORMING SAME
- Publication number 20150348895
- Publication date Dec 3, 2015
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE FORMING APPARATUS, CHIP, AND CHIP PACKAGE
- Publication number 20150041968
- Publication date Feb 12, 2015
- Samsung Electronics Co., Ltd.
- Seung-hun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY
- Publication number 20150035160
- Publication date Feb 5, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Layer Coreless Substrate
- Publication number 20140377914
- Publication date Dec 25, 2014
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFA...
- Publication number 20140346670
- Publication date Nov 27, 2014
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR...
- Publication number 20140299995
- Publication date Oct 9, 2014
- DAI NIPPON PRINTING CO., LTD.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ANTENNA SWITCH MODULES
- Publication number 20140300525
- Publication date Oct 9, 2014
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140183547
- Publication date Jul 3, 2014
- KABUSHIKI KAISHA TOSHIBA
- Kentaro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Layer Coreless Substrate
- Publication number 20140167234
- Publication date Jun 19, 2014
- Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20140103798
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiko YAMANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, LIGHTING APPARATUS AND METHOD OF ASSEMBLING A LIGHT SOURCE...
- Publication number 20140043807
- Publication date Feb 13, 2014
- TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
- Soichi Shibusawa
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFA...
- Publication number 20140021636
- Publication date Jan 23, 2014
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE
- Publication number 20140015117
- Publication date Jan 16, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...
- Publication number 20130277846
- Publication date Oct 24, 2013
- ROHDE & SCHWARZ GMBH & CO. KG
- Robert Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY
- Publication number 20130234307
- Publication date Sep 12, 2013
- UTAC Thai Limited
- Somchai Nondhasittichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging an Integrated Circuit Die
- Publication number 20130207246
- Publication date Aug 15, 2013
- ST-ERICSSON SA
- Nedyalko Slavov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER WITH DIGITAL GROUND
- Publication number 20130169320
- Publication date Jul 4, 2013
- NXP B.V.
- Luc van Dijk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHT SOURCE DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20130099276
- Publication date Apr 25, 2013
- Citizen Electronics Co., Ltd.
- Mizue Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Semiconductor Package Us...
- Publication number 20130069241
- Publication date Mar 21, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA SWITCH MODULES AND METHODS OF MAKING THE SAME
- Publication number 20130037924
- Publication date Feb 14, 2013
- SKYWORKS SOLUTIONS, INC.
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a die pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Method of manufacturing a semiconductor device having a bond wire o...

Semiconductor device and a method of making a semiconductor device

Light emitting device and method of manufacturing the light emittin...

Semiconductor package with terminal pattern for increased channel d...

Composite board, light-emitting device, and manufacturing method of...

Semiconductor device including bonding pad and bond wire or clip

Semiconductor component and method of manufacture

Low loss substrate for high data rate applications

Light-emitting diode (LED), LED package and apparatus including the...

Heat resistant and shock resistant integrated circuit

Semiconductor light-emitting device

Conductive shield for semiconductor package

Composite board, light-emitting device, and manufacturing method of...

Light emitting device and solder bond structure

Light emitting device and method of manufacturing the light emittin...

Package and light-emitting device

Light emitting device and display device having same

Method of fabricating semiconductor light emitting device

Light-emitting diode (LED), LED package and apparatus including the...

Power transistor control signal gating

LED device

Power transistor control signal gating

Microcapsular quantum dot-polymer composite, method for producing t...

Method for producing semiconductor light-emitting device

Method for producing semiconductor light-emitting device

Material layer stack, light emitting element, light emitting packag...

Composite board, light-emitting device, and manufacturing method of...

Ceramic substrate and semiconductor package having the same

Light-emitting diode (LED), LED package and apparatus including the...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

POWER CONVERSION DEVICE

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTIN...

LIGHT-EMITTING DIODE (LED), LED PACKAGE AND APPARATUS INCLUDING THE...

LOW LOSS SUBSTRATE FOR HIGH DATA RATE APPLICATIONS

Heat Resistant and Shock Resistant Integrated Circuit

COMPOSITE BOARD, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHOD OF...

LIGHT-EMITTING DIODE (LED), LED PACKAGE AND APPARATUS INCLUDING THE...

SEMI-HERMETIC SEMICONDUCTOR PACKAGE

SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD OF FORMING SAME

IMAGE FORMING APPARATUS, CHIP, AND CHIP PACKAGE

PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY

Single Layer Coreless Substrate

SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFA...

WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR...

METHODS FOR ANTENNA SWITCH MODULES

SEMICONDUCTOR DEVICE

Single Layer Coreless Substrate

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

LIGHT-EMITTING DEVICE

DEVICE, LIGHTING APPARATUS AND METHOD OF ASSEMBLING A LIGHT SOURCE...

SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFA...

VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE

CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...

LEAD FRAME LAND GRID ARRAY

Packaging an Integrated Circuit Die

GATE DRIVER WITH DIGITAL GROUND

LED LIGHT SOURCE DEVICE AND MANUFACTURING METHOD FOR THE SAME

Semiconductor Device and Method of Forming Semiconductor Package Us...

ANTENNA SWITCH MODULES AND METHODS OF MAKING THE SAME