connecting the wire to a potential ring of the item

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H01L2224/48253

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48253connecting the wire to a potential ring of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Transistor outline housing with high return loss
- Patent number 11,088,096
- Issue date Aug 10, 2021
- Schott AG
- Artit Aowudomsuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with first and second chips and connections th...
- Patent number 10,204,899
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Masaki Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,115,658
- Issue date Oct 30, 2018
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including Schottky barrier diode and power MOS...
- Patent number 9,793,265
- Issue date Oct 17, 2017
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 9,496,204
- Issue date Nov 15, 2016
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including Schottky barrier diode and power MOS...
- Patent number 9,461,163
- Issue date Oct 4, 2016
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Manufacturing method of forming an etch-back type semiconductor pac...
- Patent number 9,305,868
- Issue date Apr 5, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including DC-DC converter
- Patent number 9,153,686
- Issue date Oct 6, 2015
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of fabricating a packaged semiconductor
- Patent number 9,117,815
- Issue date Aug 25, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,922,028
- Issue date Dec 30, 2014
- Advanced Semiconductor Engineering, Inc.
- Sung-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 8,853,846
- Issue date Oct 7, 2014
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated circuit packaging system with leads and method of manufa...
- Patent number 8,802,500
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,618,642
- Issue date Dec 31, 2013
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device including Schottky barrier diode
- Patent number 8,592,904
- Issue date Nov 26, 2013
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 8,581,396
- Issue date Nov 12, 2013
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 8,571,229
- Issue date Oct 29, 2013
- MediaTek Inc.
- Chien-Sheng Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a DC-DC converter with schottky barr...
- Patent number 8,519,533
- Issue date Aug 27, 2013
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package
- Patent number 8,482,112
- Issue date Jul 9, 2013
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame ball grid array with traces under die having interlockin...
- Patent number 8,461,694
- Issue date Jun 11, 2013
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with bumped lead and nonbumped lead
- Patent number 8,455,988
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Jose Alvin Caparas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side leaded, bottom exposed pad and bottom exposed lead fusion quad...
- Patent number 8,441,110
- Issue date May 14, 2013
- Amkor Technology, Inc.
- Yeon Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing a support structure wit...
- Patent number 8,422,243
- Issue date Apr 16, 2013
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die pad package with power ring
- Patent number 8,383,962
- Issue date Feb 26, 2013
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,310,034
- Issue date Nov 13, 2012
- Renesas Electronics Corporation
- Shinichi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package including a lead frame
- Patent number 8,288,848
- Issue date Oct 16, 2012
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,288,858
- Issue date Oct 16, 2012
- Kabushiki Kaisha Toshiba
- Taku Tsumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with pad connection and method...
- Patent number 8,241,965
- Issue date Aug 14, 2012
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 8,212,343
- Issue date Jul 3, 2012
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-lead IC packages having integrated heat spreader for electromagn...
- Patent number 8,183,680
- Issue date May 22, 2012
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20170373055
- Publication date Dec 28, 2017
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...
- Publication number 20150111345
- Publication date Apr 23, 2015
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20140332878
- Publication date Nov 13, 2014
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140084440
- Publication date Mar 27, 2014
- HITACHI HOKKAI SEMICONDUCTOR LTD.
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20140054692
- Publication date Feb 27, 2014
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
EXPOSED DIE PAD PACKAGE WITH POWER RING
- Publication number 20130171775
- Publication date Jul 4, 2013
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20120306020
- Publication date Dec 6, 2012
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20120146211
- Publication date Jun 14, 2012
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CHIP PACKAGE
- Publication number 20120052630
- Publication date Mar 1, 2012
- Chang-Chih LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120018862
- Publication date Jan 26, 2012
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120007225
- Publication date Jan 12, 2012
- HITACHI HOKKAI SEMICONDUCTOR LTD.
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120007224
- Publication date Jan 12, 2012
- HITACHI HOKKAI SEMICONDUCTOR LTD.
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE
- Publication number 20110291250
- Publication date Dec 1, 2011
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...
- Publication number 20110267789
- Publication date Nov 3, 2011
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20110198742
- Publication date Aug 18, 2011
- Renesas Electronics Corporation
- Tadatoshi Danno
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110193209
- Publication date Aug 11, 2011
- Advanced Semiconductor Engineering, Inc.
- Sung-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR PACKAGE
- Publication number 20110140250
- Publication date Jun 16, 2011
- Hyung Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...
- Publication number 20110108969
- Publication date May 12, 2011
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110095412
- Publication date Apr 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD...
- Publication number 20110079886
- Publication date Apr 7, 2011
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR T...
- Publication number 20110042794
- Publication date Feb 24, 2011
- Tung-Hsien Hsieh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-Connect Lead
- Publication number 20110012240
- Publication date Jan 20, 2011
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package
- Publication number 20110012244
- Publication date Jan 20, 2011
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package
- Publication number 20110012241
- Publication date Jan 20, 2011
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING
- Publication number 20110003439
- Publication date Jan 6, 2011
- GEM Services
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100314727
- Publication date Dec 16, 2010
- NEC ELECTRONICS CORPORATION
- Shinichi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100308447
- Publication date Dec 9, 2010
- Chien-Sheng Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, lead frame, and wiring board with the same
- Publication number 20100290202
- Publication date Nov 18, 2010
- Renesas Electronics Corporation
- Hideki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING QFN SEMICONDUCTOR PACKAGE
- Publication number 20100285638
- Publication date Nov 11, 2010
- Tung-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a potential ring of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transistor outline housing with high return loss

Semiconductor device

Semiconductor device with first and second chips and connections th...

Semiconductor device

Semiconductor device including Schottky barrier diode and power MOS...

Semiconductor device

Semiconductor device including Schottky barrier diode and power MOS...

Manufacturing method of forming an etch-back type semiconductor pac...

Semiconductor device including DC-DC converter

Method of fabricating a packaged semiconductor

Semiconductor package

Semiconductor device and a manufacturing method of the same

Integrated circuit packaging system with leads and method of manufa...

Semiconductor device

Semiconductor device including Schottky barrier diode

Semiconductor device

Semiconductor device

Semiconductor device including a DC-DC converter with schottky barr...

Semiconductor package

Lead frame ball grid array with traces under die having interlockin...

Integrated circuit package system with bumped lead and nonbumped lead

Side leaded, bottom exposed pad and bottom exposed lead fusion quad...

Integrated circuit package system employing a support structure wit...

Exposed die pad package with power ring

Semiconductor device

Semiconductor chip package including a lead frame

Semiconductor device

Integrated circuit packaging system with pad connection and method...

Semiconductor chip package

No-lead IC packages having integrated heat spreader for electromagn...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

EXPOSED DIE PAD PACKAGE WITH POWER RING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD FOR MANUFACTURING CHIP PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP PACKAGE

ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

LEADFRAME FOR SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD...

QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR T...

Multi-Connect Lead

Semiconductor Chip Package

Semiconductor Chip Package

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor package, lead frame, and wiring board with the same

METHOD FOR FABRICATING QFN SEMICONDUCTOR PACKAGE