connecting the wire to a potential ring of the item

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H01L2224/48233

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48233connecting the wire to a potential ring of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
High power cavity package for light emitters
- Patent number 10,971,892
- Issue date Apr 6, 2021
- II-VI DELAWARE, INC.
- Brent Stapleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit mounting structure and lead frame for system in package (SI...
- Patent number 10,867,979
- Issue date Dec 15, 2020
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including through si...
- Patent number 10,497,619
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for system in package (SIP) devices
- Patent number 10,204,890
- Issue date Feb 12, 2019
- Octavo Systems LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package with internal and external shielding
- Patent number 10,141,268
- Issue date Nov 27, 2018
- Avago Technologies International Sales Pte. Limited
- Domingo Figueredo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device including through si...
- Patent number 10,049,931
- Issue date Aug 14, 2018
- Taiwan Semicondutor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage polymer dielectric capacitor isolation device
- Patent number 9,893,008
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and printed circuit board
- Patent number 9,345,126
- Issue date May 17, 2016
- Canon Kabushiki Kaisha
- Sou Hoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device including through si...
- Patent number 9,287,440
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with through silicon vias
- Patent number 8,946,742
- Issue date Feb 3, 2015
- TSMC Solid State Lighting Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,922,028
- Issue date Dec 30, 2014
- Advanced Semiconductor Engineering, Inc.
- Sung-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-die programming of integrated circuit bond pads
- Patent number 8,841,746
- Issue date Sep 23, 2014
- LSI Corporation
- Akhilesh Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring pattern having a stub wire
- Patent number 8,786,071
- Issue date Jul 22, 2014
- Canon Kabushiki Kaisha
- Yoshitaka Kawase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal ring techniques and configurations
- Patent number 8,749,045
- Issue date Jun 10, 2014
- Marvell International Ltd.
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation by through silicon plugs
- Patent number 8,507,940
- Issue date Aug 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including power ball matrix and power ring ha...
- Patent number 8,502,084
- Issue date Aug 6, 2013
- Samsung Electronics Co., Ltd.
- Eun seok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wiring assembly, semiconductor composite wiring assem...
- Patent number 8,471,371
- Issue date Jun 25, 2013
- Dai Nippon Printing Co., Ltd.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal ring techniques and configurations
- Patent number 8,415,785
- Issue date Apr 9, 2013
- Marvell International Ltd
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package including a lead frame
- Patent number 8,288,848
- Issue date Oct 16, 2012
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal IO unit, associated apparatus and method
- Patent number 8,237,470
- Issue date Aug 7, 2012
- MStar Semiconductor, Inc.
- Hsian-Feng Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power semiconductor module and method for operating a power semicon...
- Patent number 8,228,113
- Issue date Jul 24, 2012
- Infineon Technologies AG
- Daniel Domes
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
No-lead IC packages having integrated heat spreader for electromagn...
- Patent number 8,183,680
- Issue date May 22, 2012
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,183,688
- Issue date May 22, 2012
- Renesas Electronics Corporation
- Yasuhiro Yoshikawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip package
- Patent number 8,018,037
- Issue date Sep 13, 2011
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with different sized ESD protection elements
- Patent number 7,960,823
- Issue date Jun 14, 2011
- Kabushiki Kaisha Toshiba
- Yukinori Uchino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,943,433
- Issue date May 17, 2011
- Renesas Electronics Corporation
- Hideyuki Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,888,795
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Yasuhiro Yoshikawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 7,879,655
- Issue date Feb 1, 2011
- Renesas Electronics Corporation
- Yasumi Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of power ring positioning to minimize crosstalk
- Patent number 7,863,716
- Issue date Jan 4, 2011
- LSI Corporation
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond integrated circuit package for high speed I/O
- Patent number 7,804,167
- Issue date Sep 28, 2010
- LSI Logic Corporation
- Clifford Fishley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE FOR SYSTEM IN PACKAGING (SIP) DEVICES
- Publication number 20190115331
- Publication date Apr 18, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH SI...
- Publication number 20180350678
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE
- Publication number 20160307840
- Publication date Oct 20, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PRINTED CIRCUIT BOARD
- Publication number 20140268586
- Publication date Sep 18, 2014
- Canon Kabushiki Kaisha
- Sou Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Die Programming of Integrated Circuit Bond Pads
- Publication number 20140240033
- Publication date Aug 28, 2014
- LSI Corporation
- Akhilesh Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH SI...
- Publication number 20130302979
- Publication date Nov 14, 2013
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130126866
- Publication date May 23, 2013
- Sumitomo Electric Industries, Ltd.
- Satoshi HATSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME
- Publication number 20130043601
- Publication date Feb 21, 2013
- Seok-Joon MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120261840
- Publication date Oct 18, 2012
- RENESAS ELECTORNICS CORPORATION
- Tetsuya Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120211903
- Publication date Aug 23, 2012
- Canon Kabushiki Kaisha
- Yoshitaka Kawase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CHIP PACKAGE
- Publication number 20120052630
- Publication date Mar 1, 2012
- Chang-Chih LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE
- Publication number 20110291250
- Publication date Dec 1, 2011
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY THROUGH SILICON PLUGS
- Publication number 20110241061
- Publication date Oct 6, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS
- Publication number 20110241040
- Publication date Oct 6, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110193209
- Publication date Aug 11, 2011
- Advanced Semiconductor Engineering, Inc.
- Sung-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal IO Unit, Associated Apparatus and Method
- Publication number 20110128042
- Publication date Jun 2, 2011
- Mstar Semiconductor, Inc.
- Hsian-Feng Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110127671
- Publication date Jun 2, 2011
- Renesas Electronics Corporation
- Yasuhiro Yoshikawa
- G11 - INFORMATION STORAGE
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD FOR OPERATING A POWER SEMICON...
- Publication number 20110102054
- Publication date May 5, 2011
- INFINEON TECHNOLOGIES AG
- Daniel Domes
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor wiring assembly, semiconductor composite wiring assem...
- Publication number 20110006410
- Publication date Jan 13, 2011
- Dai Nippon Printing Co., Ltd.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20100327425
- Publication date Dec 30, 2010
- HON HAI Precision Industry CO., LTD.
- CHING-YAO FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING POWER BALL MATRIX AND POWER RING HA...
- Publication number 20100276189
- Publication date Nov 4, 2010
- Samsung Electronics Co., Ltd.
- Eun seok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE
- Publication number 20100264533
- Publication date Oct 21, 2010
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100244238
- Publication date Sep 30, 2010
- RENESAS TECHNOLOGY CORP.
- Yasuhiro Yoshikawa
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100120207
- Publication date May 13, 2010
- RENESAS TECHNOLOGY CORP.
- Hideyuki ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20100112761
- Publication date May 6, 2010
- RENESAS TECHNOLOGY CORP.
- Yasumi Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100007005
- Publication date Jan 14, 2010
- NEC Electronics Corporation
- Tetsuya Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF POWER RING POSITIONING TO MINIMIZE CROSSTALK
- Publication number 20090321897
- Publication date Dec 31, 2009
- Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF
- Publication number 20090294977
- Publication date Dec 3, 2009
- Che-Yuan Jao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond wire loop for high speed noise isolation
- Publication number 20090273074
- Publication date Nov 5, 2009
- Xiaoming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Improved Power Distribution in Wirebond Semiconductor...
- Publication number 20090191664
- Publication date Jul 30, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Mukul Saran
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a potential ring of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High power cavity package for light emitters

Circuit mounting structure and lead frame for system in package (SI...

Method of manufacturing a semiconductor device including through si...

Substrate for system in package (SIP) devices

Circuit package with internal and external shielding

Method of manufacturing a semiconductor device including through si...

High voltage polymer dielectric capacitor isolation device

Semiconductor package and printed circuit board

Method of manufacturing a semiconductor device including through si...

Semiconductor package with through silicon vias

Semiconductor package

On-die programming of integrated circuit bond pads

Wiring pattern having a stub wire

Metal ring techniques and configurations

Heat dissipation by through silicon plugs

Semiconductor package including power ball matrix and power ring ha...

Semiconductor wiring assembly, semiconductor composite wiring assem...

Metal ring techniques and configurations

Semiconductor chip package including a lead frame

Universal IO unit, associated apparatus and method

Power semiconductor module and method for operating a power semicon...

No-lead IC packages having integrated heat spreader for electromagn...

Semiconductor device

Semiconductor chip package

Semiconductor device with different sized ESD protection elements

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device and a manufacturing method of the same

Method and apparatus of power ring positioning to minimize crosstalk

Wire bond integrated circuit package for high speed I/O

Patents Applicationslast 30 patents

SUBSTRATE FOR SYSTEM IN PACKAGING (SIP) DEVICES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH SI...

HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE

SEMICONDUCTOR PACKAGE AND PRINTED CIRCUIT BOARD

On-Die Programming of Integrated Circuit Bond Pads

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH SI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING CHIP PACKAGE

SEMICONDUCTOR CHIP PACKAGE

HEAT DISSIPATION BY THROUGH SILICON PLUGS

NOVEL SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS

SEMICONDUCTOR PACKAGE

Universal IO Unit, Associated Apparatus and Method

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE AND METHOD FOR OPERATING A POWER SEMICON...

Semiconductor wiring assembly, semiconductor composite wiring assem...

FLAT CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING POWER BALL MATRIX AND POWER RING HA...

SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Semiconductor device

METHOD AND APPARATUS OF POWER RING POSITIONING TO MINIMIZE CROSSTALK

SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF

Bond wire loop for high speed noise isolation

Apparatus for Improved Power Distribution in Wirebond Semiconductor...