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connecting the wire to a via metallisation of the item
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H01L2224/48165
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/48165
connecting the wire to a via metallisation of the item
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last 30 patents
Information
Patent Grant
Sensor package and manufacturing method thereof
Patent number
12,002,725
Issue date
Jun 4, 2024
Amkor Technology Singapore Holding Pte Ltd.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Sensor package and manufacturing method thereof
Patent number
11,682,598
Issue date
Jun 20, 2023
Amkor Technology Singapore Holding Pte.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package including processor chip and memory chip
Patent number
11,309,300
Issue date
Apr 19, 2022
Samsung Electronics Co., Ltd.
Kil-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure, assembly structure and method for manufacturing...
Patent number
11,282,772
Issue date
Mar 22, 2022
Advanced Semiconductor Engineering, Inc.
Hsu-Nan Fang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor package and manufacturing method thereof
Patent number
11,177,187
Issue date
Nov 16, 2021
Amkor Technology Singapore Holding Pte Ltd.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Sensor package and manufacturing method thereof
Patent number
10,672,676
Issue date
Jun 2, 2020
Amkor Technology, Inc.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Fan-out semiconductor package
Patent number
10,438,927
Issue date
Oct 8, 2019
Samsung Electronics Co, Ltd.
Ha Yong Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fingerprint sensor and manufacturing method thereof
Patent number
9,984,947
Issue date
May 29, 2018
Amkor Technology, Inc.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Fingerprint sensor and manufacturing method thereof
Patent number
9,728,476
Issue date
Aug 8, 2017
Amkor Technology, Inc.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Contact arrangements for stackable microelectronic package structur...
Patent number
9,349,707
Issue date
May 24, 2016
Invensas Corporation
Zhuowen Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring board and method for manufacturing the same
Patent number
8,378,230
Issue date
Feb 19, 2013
Ibiden Co., Ltd.
Masahiro Kaneko
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device Package with Die Stackup and Connection Platform
Publication number
20240387461
Publication date
Nov 21, 2024
Western Digital Technologies, Inc.
Rajitha Indla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240321658
Publication date
Sep 26, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
Publication number
20220216193
Publication date
Jul 7, 2022
Samsung Electronics Co., Ltd.
Kil-Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...
Publication number
20210134711
Publication date
May 6, 2021
Advanced Semiconductor Engineering, Inc.
Hsu-Nan FANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
Publication number
20190189589
Publication date
Jun 20, 2019
Samsung Electro-Mechanics Co., Ltd.
Ha Yong JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20190148349
Publication date
May 16, 2019
Samsung Electronics Co., Ltd.
Kil-Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20180269121
Publication date
Sep 20, 2018
Amkor Technology, Inc.
Ji Young Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
Publication number
20170338163
Publication date
Nov 23, 2017
Amkor Technology, Inc.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20110233598
Publication date
Sep 29, 2011
HON HAI Precision Industry CO., LTD.
CHIH-CHEN LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20110067913
Publication date
Mar 24, 2011
IBIDEN CO., LTD.
Masahiro KANEKO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR