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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2924/16251
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Patents Grants
last 30 patents
Information
Patent Grant
Method and device for producing a housing
Patent number
12,261,063
Issue date
Mar 25, 2025
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,218,044
Issue date
Feb 4, 2025
Renesas Electronics Corporation
Nobuhiro Kinoshita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,205,875
Issue date
Jan 21, 2025
Kioxia Corporation
Satoshi Tsukiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded liquid cooling
Patent number
12,199,011
Issue date
Jan 14, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
12,131,974
Issue date
Oct 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Fu Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-component modules (MCMs) including configurable electromagnet...
Patent number
12,100,669
Issue date
Sep 24, 2024
QUALCOMM Incorporated
Jay Scott Salmon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-conductive film sheet and semiconductor package including the same
Patent number
12,062,633
Issue date
Aug 13, 2024
Samsung Electronics Co., Ltd.
Joungphil Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package aligning interposer and substrate
Patent number
12,051,680
Issue date
Jul 30, 2024
Samsung Electronics Co., Ltd.
Tae Hwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded lid for low cost and improved thermal performance
Patent number
12,021,004
Issue date
Jun 25, 2024
Texas Instruments Incorporated
Hiep Xuan Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,002,735
Issue date
Jun 4, 2024
Tien-Chien Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
Patent number
RE49987
Issue date
May 28, 2024
Invensas LLC
Cyprian Emeka Uzoh
Information
Patent Grant
Semiconductor package structure and method for forming the same
Patent number
11,984,381
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor substrate structure and manufacturing method thereof
Patent number
11,948,899
Issue date
Apr 2, 2024
Dyi-Chung Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
Patent number
11,901,247
Issue date
Feb 13, 2024
Kyocera Corporation
Masami Juta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal transfer structures for semiconductor die assemblies
Patent number
11,862,611
Issue date
Jan 2, 2024
Micron Technology, Inc.
Ed A. Schrock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and method of manufacturing the same
Patent number
11,855,034
Issue date
Dec 26, 2023
Advanced Semiconductor Engineering, Inc.
Chung-Hung Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor circuit power delivery
Patent number
11,817,394
Issue date
Nov 14, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
Patent number
11,776,877
Issue date
Oct 3, 2023
Micron Technology, Inc.
Sameer S. Vadhavkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die assemblies having molded underfill structures and...
Patent number
11,749,666
Issue date
Sep 5, 2023
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-component modules (MCMs) including configurable electro-magne...
Patent number
11,721,639
Issue date
Aug 8, 2023
QUALCOMM Incorporated
Jay Scott Salmon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure with redundant electrical connectors and ass...
Patent number
11,626,388
Issue date
Apr 11, 2023
Micron Technology, Inc.
Anilkumar Chandolu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna apparatus and antenna module
Patent number
11,594,814
Issue date
Feb 28, 2023
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Nam Ki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device package with reduced radio frequency losses
Patent number
11,574,879
Issue date
Feb 7, 2023
Infineon Technologies AG
Pedro Augusto Borrego Lambin Torres Amaral
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Exfoliated graphite materials and composite materials and devices f...
Patent number
11,570,933
Issue date
Jan 31, 2023
0908905 B.C. Ltd.
John Kenna
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
Patent number
11,562,986
Issue date
Jan 24, 2023
Micron Technology, Inc.
Jian Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing power semiconductor module arrangement
Patent number
11,557,522
Issue date
Jan 17, 2023
Infineon Technologies AG
Alexander Roth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,501,978
Issue date
Nov 15, 2022
Amkor Technology Singapore Holding Pte Ltd.
Won Chul Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,456,287
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and electronic device having the same
Patent number
11,437,295
Issue date
Sep 6, 2022
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Tae Hyun Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE
Publication number
20250079246
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chieh-Ming CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS O...
Publication number
20250070084
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Company Limited
Tsung-Yen Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20250054853
Publication date
Feb 13, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyun Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
Publication number
20250054819
Publication date
Feb 13, 2025
Intel Corporation
Seok Ling LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
Publication number
20250054841
Publication date
Feb 13, 2025
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Ikuo NAKASHIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250046728
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Dongwon KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...
Publication number
20250038063
Publication date
Jan 30, 2025
Yangtze Memory Technologies Co., Ltd.
Xin Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...
Publication number
20250006572
Publication date
Jan 2, 2025
Taiwan Semiconductor Manufacturing Company Limited
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
Publication number
20240387317
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240379609
Publication date
Nov 14, 2024
Siliconware Precision Industries Co., Ltd.
Wei-Shen HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...
Publication number
20240379494
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu Chen Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20240379491
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Fu Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240321672
Publication date
Sep 26, 2024
Siliconware Precision Industries Co., Ltd.
Cheng-Lun CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240258193
Publication date
Aug 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Chen LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
Publication number
20240250054
Publication date
Jul 25, 2024
NVIDIA Corporation
Malcolm GUTENBURG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240228264
Publication date
Jul 11, 2024
STMicroelectronics International N.V.
Roseanne DUCA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
EMBEDDED LIQUID COOLING
Publication number
20240222222
Publication date
Jul 4, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
Publication number
20240222218
Publication date
Jul 4, 2024
Taiwan Semiconductor Manufacturing Co, LTD.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240186213
Publication date
Jun 6, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jae Jin REE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240178206
Publication date
May 30, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyeon LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240132340
Publication date
Apr 25, 2024
STMicroelectronics (Malta) Ltd.
Roseanne DUCA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240128148
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chang-Jung Hsueh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240120252
Publication date
Apr 11, 2024
RENESAS ELECTRONICS CORPORATION
Nobuhiro KINOSHITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240088093
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Publication number
20240079346
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
Publication number
20240071974
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
Publication number
20240072025
Publication date
Feb 29, 2024
TEXAS INSTRUMENTS INCORPORATED
Rajen M. Murugan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Package with Double-Side...
Publication number
20240063196
Publication date
Feb 22, 2024
STATS ChipPAC Pte Ltd.
TaeKeun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE
Publication number
20240038607
Publication date
Feb 1, 2024
STMicroelectronics (Grenoble 2) SAS
Fanny LAPORTE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
Publication number
20240038627
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS