Connection electrodes of multilayered piezo-electric or electrostrictive parts

Industry

CPC
H01L41/293

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L41/00Piezo-electric devices in general Electrostrictive devices in general Magnetostrictive devices in general Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof

Current Industry

H01L41/293Connection electrodes of multilayered piezo-electric or electrostrictive parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Semiconductor structure and method for manufacturing thereof
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- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
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Fully-wet via patterning method in piezoelectric sensor
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Transducer arrays with air kerfs for intraluminal imaging
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- Koninklijke Philips N.V.
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Microelectromechanical system with piezoelectric film and manufactu...
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- Taiwan Semiconductor Manufacturing Co., Ltd
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Wafer scale ultrasonic sensor assembly and method for manufacturing...
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Multilayer piezoelectric element, piezoelectric vibration apparatus...
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Information Patent Grant
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Information Patent Grant
Multilayer piezoelectric element, piezoelectric vibration apparatus...
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- Taiyo Yuden Co., Ltd.
- Sumiaki Kishimoto
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Electroactive polymer devices, systems, and methods
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- Facebook Technologies, LLC
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Information Patent Grant
Piezoelectric transformer
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- Issue date Dec 7, 2021
- Murata Manufacturing Co., Ltd.
- Shinsuke Ikeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer component and use of outer electrodes
- Patent number 11,145,461
- Issue date Oct 12, 2021
- TDK ELECTRONICS AG
- Martin Galler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ceramic electronic component
- Patent number 11,120,943
- Issue date Sep 14, 2021
- Murata Manufacturing Co., Ltd.
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Piezoelectric actuator having separate frictional portions
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Electronic component
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- SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Manufacturing method for multi-layer PZT microactuator having a pol...
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- Issue date May 18, 2021
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Information Patent Grant
Vertical packaging for ultrasound-on-a-chip and related methods
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Piezoelectric power generation device
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Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic i...
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- Issue date Oct 27, 2020
- Koninklijke Philips N.V.
- Johannes Wilhelmus Weekamp
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Piezoelectric element, vibrator, vibration wave motor, optical devi...
- Patent number 10,811,592
- Issue date Oct 20, 2020
- Canon Kabushiki Kaisha
- Makoto Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric device and method for manufacturing an inkjet head
- Patent number 10,766,258
- Issue date Sep 8, 2020
- FUJIFILM Dimatix, Inc.
- Yoshikazu Hishinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric device
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- Issue date Jun 16, 2020
- TDK Corporation
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Ultrasound transducer and manufacturing method thereof
- Patent number 10,658,563
- Issue date May 19, 2020
- Siemens Medical Solutions USA, Inc.
- DuYeop Kim
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

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- Murata Manufacturing Co., Ltd.
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TRANSDUCER ARRAYS WITH AIR KERFS FOR INTRALUMINAL IMAGING
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- Koninklijke Philips N.V.
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- DAEGU GYEONGBUK INSTITUTE OF SCIENCE & TECHNOLOGY
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MICROELECTROMECHANICAL SYSTEM WITH PIEZOELECTRIC FILM AND MANUFACTU...
- Publication number 20220376165
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Jung CHEN
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FULLY-WET VIA PATTERNING METHOD IN PIEZOELECTRIC SENSOR
- Publication number 20220367784
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID DISCHARGE HEAD
- Publication number 20220305786
- Publication date Sep 29, 2022
- Toshiba Tec Kabushiki Kaisha
- Masashi Shimosato
- H01 - BASIC ELECTRIC ELEMENTS
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PIEZOELECTRIC ELEMENT AND METHOD FOR PRODUCING THE SAME
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- Publication date Jun 23, 2022
- Murata Manufacturing Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATOR AND MANUFACTURING MET...
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- BOE TECHNOLOGY GROUP CO., LTD.
- YuJu Chen
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR MANUFACTURING IMAGING MODULE
- Publication number 20220068986
- Publication date Mar 3, 2022
- Ningbo Semiconductor International Corporation
- Luo GUI
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR PRODUCING A PIEZOELECTRIC STACK ACTUATOR, AND PIEZOELECT...
- Publication number 20220059751
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- PI CERAMIC GmbH
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INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...
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- NINGBO SEMICONDUCTOR INTERTIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan QIN
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EMBEDDED ELECTRODE TUNING FORK
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- Baker Hughes Oilfield Operations LLC
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VERTICAL PACKAGING FOR ULTRASOUND-ON-A-CHIP AND RELATED METHODS
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- Publication date Apr 22, 2021
- Butterfly Network, Inc.
- Keith G. Fife
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
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ULTRASONIC TRANSDUCER CHIP ASSEMBLY, ULTRASOUND PROBE, ULTRASONIC I...
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- Koninklijke Philips N.V.
- JOHANNES WILHELMUS WEEKAMP
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
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SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20210098681
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- H01 - BASIC ELECTRIC ELEMENTS
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PIEZOELECTRIC MEMS DEVICES AND METHODS OF FORMING THEREOF
- Publication number 20210050506
- Publication date Feb 18, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Jia Jie XIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURE AND METHOD FOR PRODUCING SAME
- Publication number 20210013392
- Publication date Jan 14, 2021
- FORSCHUNGSVERBUND BERLIN E.V.
- Konstantin OSIPOV
- H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTROMECHANICAL SYSTEM WITH PIEZOELECTRIC FILM AND MANUFACTU...
- Publication number 20200411749
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS
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- FUJIFILM SONOSITE, INC.
- N. Christopher Chaggares
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WAFER SCALE ULTRASONIC SENSOR ASSEMBLY AND METHOD FOR MANUFACTURING...
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- J-METRICS TECHNOLOGY Co., Ltd. & Peking University Shenzhen Graduate School
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- Taiwan Semiconductor Manufacturing Co., LTD
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PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING AN INKJET HEAD
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Information Patent Application
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Information Patent Application
MULTILAYER ULTRASONIC TRANSDUCER AND ULTRASONIC INSPECTION DEVICE
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Information Patent Application
Multilayer Component
- Publication number 20190189895
- Publication date Jun 20, 2019
- EPCOS AG
- Dieter Somitsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Connection electrodes of multilayered piezo-electric or electrostrictive parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanovoided electroactive polymer devices, systems, and methods

Piezoelectric MEMS devices and methods of forming thereof

Semiconductor structure and method for manufacturing thereof

Fully-wet via patterning method in piezoelectric sensor

Piezoelectric element and liquid ejecting head including piezoelect...

Foil transducer and valve

Transducer arrays with air kerfs for intraluminal imaging

Microelectromechanical system with piezoelectric film and manufactu...

Wafer scale ultrasonic sensor assembly and method for manufacturing...

Multilayer piezoelectric element, piezoelectric vibration apparatus...

Multilayer piezoelectric element, piezoelectric vibration apparatus...

Vertical packaging for ultrasound-on-a-chip and related methods

Stepped piezoelectric actuator

Multilayer ultrasonic transducer and ultrasonic inspection device

Multilayer piezoelectric element, piezoelectric vibration apparatus...

Electroactive polymer devices, systems, and methods

Piezoelectric transformer

Multilayer component and use of outer electrodes

Method for manufacturing ceramic electronic component

Piezoelectric actuator having separate frictional portions

Electronic component

Manufacturing method for multi-layer PZT microactuator having a pol...

Method of fabricating a semiconductor device

Vertical packaging for ultrasound-on-a-chip and related methods

Piezoelectric power generation device

Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic i...

Piezoelectric element, vibrator, vibration wave motor, optical devi...

Piezoelectric device and method for manufacturing an inkjet head

Piezoelectric device

Ultrasound transducer and manufacturing method thereof

Patents Applicationslast 30 patents

EXCITATION ELECTRODE, QUARTZ CRYSTAL VIBRATOR ELEMENT, QUARTZ CRYST...

PIEZOELECTRIC DEVICE

TRANSDUCER ARRAYS WITH AIR KERFS FOR INTRALUMINAL IMAGING

METHOD FOR CHEMICALLY ADHERING A DIENE RUBBER TO A PIEZOELECTRIC PO...

PIEZOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING PIEZOELECTRIC EL...

MICROELECTROMECHANICAL SYSTEM WITH PIEZOELECTRIC FILM AND MANUFACTU...

FULLY-WET VIA PATTERNING METHOD IN PIEZOELECTRIC SENSOR

LIQUID DISCHARGE HEAD

PIEZOELECTRIC ELEMENT AND METHOD FOR PRODUCING THE SAME

PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATOR AND MANUFACTURING MET...

METHOD FOR MANUFACTURING IMAGING MODULE

METHOD FOR PRODUCING A PIEZOELECTRIC STACK ACTUATOR, AND PIEZOELECT...

INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...

Multi-Layer PZT Microactuator Having A Poled But Inactive PZT Const...

EMBEDDED ELECTRODE TUNING FORK

VERTICAL PACKAGING FOR ULTRASOUND-ON-A-CHIP AND RELATED METHODS

ULTRASONIC TRANSDUCER CHIP ASSEMBLY, ULTRASOUND PROBE, ULTRASONIC I...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

PIEZOELECTRIC MEMS DEVICES AND METHODS OF FORMING THEREOF

GATE STRUCTURE AND METHOD FOR PRODUCING SAME

MICROELECTROMECHANICAL SYSTEM WITH PIEZOELECTRIC FILM AND MANUFACTU...

METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS

WAFER SCALE ULTRASONIC SENSOR ASSEMBLY AND METHOD FOR MANUFACTURING...

INTEGRATED HEATER (AND RELATED METHOD) TO RECOVER DEGRADED PIEZOELE...

PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING AN INKJET HEAD

ULTRASONIC SENSING DEVICE, ELECTRONIC DEVICE USING SAME, AND METHOD...

PHASED ARRAY TRANSDUCERS AND WAFER SCALE MANUFACTURING FOR MAKING T...

VERTICAL PACKAGING FOR ULTRASOUND-ON-A-CHIP AND RELATED METHODS

MULTILAYER ULTRASONIC TRANSDUCER AND ULTRASONIC INSPECTION DEVICE

Multilayer Component