Connection or disconnection of other leads to or from bases or plates

Industry

CPC
H01L21/4875

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4875Connection or disconnection of other leads to or from bases or plates

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a thermal contact and method of making
- Patent number 12,142,542
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a thermal contact
- Patent number 12,094,799
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with separate communication and heat dissipation paths
- Patent number 12,040,249
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Sreenivasan Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging chip
- Patent number 12,002,685
- Issue date Jun 4, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,984,377
- Issue date May 14, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation warpage reduction for semiconductor die assemblies an...
- Patent number 11,955,345
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of assembly
- Patent number 11,948,878
- Issue date Apr 2, 2024
- Littelfuse, Inc.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device module with dummy pad die layout
- Patent number 11,935,817
- Issue date Mar 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal substrate contact
- Patent number 11,862,527
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded substrate heat sink for bottom side cooling
- Patent number 11,830,783
- Issue date Nov 28, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded native interconnects and active base die
- Patent number 11,823,906
- Issue date Nov 21, 2023
- Xcelsis Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses exhibiting enhanced stress resistance and planarity, an...
- Patent number 11,769,738
- Issue date Sep 26, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,629
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for fabricating a power semic...
- Patent number 11,652,028
- Issue date May 16, 2023
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and packaging method
- Patent number 11,605,604
- Issue date Mar 14, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 11,551,999
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating circuit components in matrix batches
- Patent number 11,521,862
- Issue date Dec 6, 2022
- Chih-liang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of assembly
- Patent number 11,488,903
- Issue date Nov 1, 2022
- Littelfuse, Inc.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense redistribution layers in semiconductor packages and methods o...
- Patent number 11,417,604
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 11,355,470
- Issue date Jun 7, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded native interconnects and active base die
- Patent number 11,289,333
- Issue date Mar 29, 2022
- Xcelsis Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing power semiconductor device and power semico...
- Patent number 11,270,982
- Issue date Mar 8, 2022
- Mitsubishi Electric Corporation
- Norikazu Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and packaging method
- Patent number 11,211,343
- Issue date Dec 28, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser pretreatment of metal substrates for electrical circuit boards
- Patent number 11,192,209
- Issue date Dec 7, 2021
- AB Mikroelektronik GmbH
- Louis Costa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device module and method of manufacturing the same
- Patent number 11,195,800
- Issue date Dec 7, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Mok Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package
- Patent number 11,189,593
- Issue date Nov 30, 2021
- Analog Devices International Unlimited Company
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics modules including integrated jet cooling
- Patent number 11,101,193
- Issue date Aug 24, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE WITH A SUBSTRATE AND AT LEAST ONE SEMICONDUCTO...
- Publication number 20240363487
- Publication date Oct 31, 2024
- SIEMENS AKTIENGESELLSCHAFT
- VOLKER MÜLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240304464
- Publication date Sep 12, 2024
- OIP Technology Pte Ltd
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20240266191
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT
- Publication number 20240222231
- Publication date Jul 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE RELIABILITY AND PROCESS WITH HIGH TEHRMAL PERFORMANCE IN...
- Publication number 20240170359
- Publication date May 23, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
- Publication number 20240071851
- Publication date Feb 29, 2024
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240030087
- Publication date Jan 25, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING
- Publication number 20230386958
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE
- Publication number 20230386959
- Publication date Nov 30, 2023
- HEFEI SMAT TECHNOLOGY CO.,LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369175
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Arthur Unrau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINED BODY PRODUCTION METHOD, JOINED BODY, AND HOT-MELT ADHESIVE S...
- Publication number 20230307252
- Publication date Sep 28, 2023
- DEXERIALS CORPORATION
- Hiroyuki KUMAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD...
- Publication number 20230097270
- Publication date Mar 30, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Shingo INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230051389
- Publication date Feb 16, 2023
- Fuji Electric Co., Ltd.
- Naoki TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CIRCUIT MODULE
- Publication number 20230052830
- Publication date Feb 16, 2023
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF ASSEMBLY
- Publication number 20230032658
- Publication date Feb 2, 2023
- LITTELFUSE, INC.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST SURFACE MOUNT EMI GASKETS
- Publication number 20230016486
- Publication date Jan 19, 2023
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
- Publication number 20230005827
- Publication date Jan 5, 2023
- Shinko Electric Industries Co., Ltd.
- Jun Izuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CHIP
- Publication number 20220367209
- Publication date Nov 17, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20220359230
- Publication date Nov 10, 2022
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220359347
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dense Redistribution Layers in Semiconductor Packages and Methods o...
- Publication number 20220352086
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A POWER SEMICON...
- Publication number 20220301998
- Publication date Sep 22, 2022
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Manuel NODERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20220262762
- Publication date Aug 18, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Yeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct-Bonded Native Interconnects And Active Base Die
- Publication number 20220238339
- Publication date Jul 28, 2022
- Xcelsis Corporation
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20220157622
- Publication date May 19, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20220093539
- Publication date Mar 24, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20210305121
- Publication date Sep 30, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS

Connection or disconnection of other leads to or from bases or plates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a thermal contact and method of making

Method of making a semiconductor device having a thermal contact

Packages with separate communication and heat dissipation paths

Method for packaging chip

IC die and heat spreaders with solderable thermal interface structu...

Encapsulation warpage reduction for semiconductor die assemblies an...

Semiconductor chip package and method of assembly

Power device module with dummy pad die layout

Thermal substrate contact

Embedded substrate heat sink for bottom side cooling

Direct-bonded native interconnects and active base die

Apparatuses exhibiting enhanced stress resistance and planarity, an...

Package structure and manufacturing method thereof

Power semiconductor device and method for fabricating a power semic...

Fan-out antenna packaging structure and packaging method

Memory device and manufacturing method thereof

Thermal management solutions for integrated circuit packages

Process for fabricating circuit components in matrix batches

Semiconductor chip package and method of assembly

Method for mounting an electrical component in which a hood is used...

Dense redistribution layers in semiconductor packages and methods o...

Semiconductor device and methods of manufacturing semiconductor dev...

Direct-bonded native interconnects and active base die

Method of manufacturing power semiconductor device and power semico...

Fan-out antenna packaging structure and packaging method

Laser pretreatment of metal substrates for electrical circuit boards

Electronic device module and method of manufacturing the same

Integrated device package

Member for semiconductor device

Power electronics modules including integrated jet cooling

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE WITH A SUBSTRATE AND AT LEAST ONE SEMICONDUCTO...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT

BOND WIRE RELIABILITY AND PROCESS WITH HIGH TEHRMAL PERFORMANCE IN...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PACKAGE INCLUDING A GEL

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING

CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

JOINED BODY PRODUCTION METHOD, JOINED BODY, AND HOT-MELT ADHESIVE S...

SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER CIRCUIT MODULE

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF ASSEMBLY

LOW-COST SURFACE MOUNT EMI GASKETS

LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD

METHOD FOR PACKAGING CHIP

ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

Dense Redistribution Layers in Semiconductor Packages and Methods o...

POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A POWER SEMICON...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

Direct-Bonded Native Interconnects And Active Base Die

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...