Connection or disconnection of other leads to or from flat leads

Industry

CPC
H01L21/4825

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4825Connection or disconnection of other leads to or from flat leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,176,302
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Hidetoshi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 12,176,272
- Issue date Dec 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,176,275
- Issue date Dec 24, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with cavities and methods of manufactur...
- Patent number 12,165,942
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor having tubular walled sensing cavity
- Patent number 12,135,303
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding appara...
- Patent number 12,125,803
- Issue date Oct 22, 2024
- STMicroelectronics S.r.l.
- Paolo Crema
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with roughened conductive components
- Patent number 12,119,289
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Yee Gin Tea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated 3D semiconductor device package with transistors attached...
- Patent number 12,074,160
- Issue date Aug 27, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional package for semiconductor devices and external co...
- Patent number 12,062,597
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer and planarization layer and method of forming the...
- Patent number 12,051,622
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating wirebonded members on package surfaces
- Patent number 12,046,542
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with die pads and leads
- Patent number 12,021,010
- Issue date Jun 25, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 12,021,012
- Issue date Jun 25, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die-package and method
- Patent number 12,014,973
- Issue date Jun 18, 2024
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with packaging material and metal member protr...
- Patent number 12,009,287
- Issue date Jun 11, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING SUCH SEM...
- Publication number 20250006597
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS
- Publication number 20240429134
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yee Gin TEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240429135
- Publication date Dec 26, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...
- Publication number 20240413148
- Publication date Dec 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240404927
- Publication date Dec 5, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240395675
- Publication date Nov 28, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395690
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES
- Publication number 20240387341
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE
- Publication number 20240387443
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Daisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Side Molded System...
- Publication number 20240379480
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20240379509
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...
- Publication number 20240371734
- Publication date Nov 7, 2024
- ROHM CO., LTD.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290694
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL ARRANGEMENT WITH A POSITIONING AID, AND PRODUCTION METHOD
- Publication number 20240282602
- Publication date Aug 22, 2024
- ROBERT BOSCH GmbH
- Gerhard Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20240274512
- Publication date Aug 15, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20240274570
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Semiconductor Packages Mounted on Metal Frame
- Publication number 20240258216
- Publication date Aug 1, 2024
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
- Publication number 20240258288
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
- Publication number 20240248058
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith ARIAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20240243040
- Publication date Jul 18, 2024
- DANFOSS SILICON POWER GMBH
- Tobias APPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20240234231
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20240234264
- Publication date Jul 11, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...
- Publication number 20240234263
- Publication date Jul 11, 2024
- STMicroelectronics S.r.l.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240178007
- Publication date May 30, 2024
- STMicroelectronics S.r.l.
- Marco ROVITTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Insert
- Publication number 20240178109
- Publication date May 30, 2024
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A S...
- Publication number 20240178106
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Harold MATEO
- H01 - BASIC ELECTRIC ELEMENTS

Connection or disconnection of other leads to or from flat leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Integrated magnetic assembly with conductive field plates

Floating die package

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package with wettable flank

Semiconductor device and a method of manufacturing a semiconductor...

Lead frame for improving adhesive fillets on semiconductor die corners

Integrated circuit packages with cavities and methods of manufactur...

Leadframe, encapsulated package with punched lead and sawn side fla...

Semiconductor package with nickel-silver pre-plated leadframe

Sensor having tubular walled sensing cavity

Heat slug attached to a die pad for semiconductor package

Method of manufacturing semiconductor devices, corresponding appara...

Electronic device packages with internal moisture barriers

Through-substrate via structure and method of manufacture

Semiconductor packages with roughened conductive components

Leadframe package with pre-applied filler material

QFN device having a mechanism that enables an inspectable solder jo...

Molded packaging for wide band gap semiconductor devices

Spring bar leadframe, method and packaged electronic device with ze...

Semiconductor device and mounting structure thereof

Isolated 3D semiconductor device package with transistors attached...

Three dimensional package for semiconductor devices and external co...

Passivation layer and planarization layer and method of forming the...

Heat-dissipating wirebonded members on package surfaces

Mechanical couplings designed to resolve process constraints

Electronic device with die pads and leads

Semiconductor device

Multi-die-package and method

Semiconductor device with packaging material and metal member protr...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING SUCH SEM...

SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES

SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

Semiconductor Device and Method of Making a Dual-Side Molded System...

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRICAL ARRANGEMENT WITH A POSITIONING AID, AND PRODUCTION METHOD

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

Power Module with Semiconductor Packages Mounted on Metal Frame

SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT

SENSOR HAVING TUBULAR WALLED SENSING CAVITY

LEADFRAME

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

Semiconductor Package with Insert

LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A S...