Connection or disconnection of other leads to or from flat leads

Industry

CPC
H01L21/4825

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4825Connection or disconnection of other leads to or from flat leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging method and chip package unit
- Patent number 11,973,010
- Issue date Apr 30, 2024
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with semiconductor packages mounted on metal frame
- Patent number 11,973,012
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
- Patent number 11,973,052
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,967,507
- Issue date Apr 23, 2024
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 11,942,386
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge semiconductor device
- Patent number 11,942,401
- Issue date Mar 26, 2024
- Nexperia B.V.
- Dilder Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 11,915,998
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,901,316
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kentaro Chikamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a transmitting insulating element
- Patent number 11,894,321
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having outer terminal portions with conductive...
- Patent number 11,887,915
- Issue date Jan 30, 2024
- Amkor Technology Japan, Inc.
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 11,881,398
- Issue date Jan 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical additive manufacturing method using deposition feed...
- Patent number 11,881,412
- Issue date Jan 23, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 11,862,579
- Issue date Jan 2, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mounted in a recess of die pad
- Patent number 11,862,538
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- Chung-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe and semiconductor device package therefrom
- Patent number 11,855,001
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with conductive bumps having a profile with a w...
- Patent number 11,855,027
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package having a conductiv...
- Patent number 11,848,254
- Issue date Dec 19, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for improving heat dissipation and mounting st...
- Patent number 11,842,951
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 11,842,954
- Issue date Dec 12, 2023
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged high voltage MOSFET device with connection clip and manufa...
- Patent number 11,830,794
- Issue date Nov 28, 2023
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 11,810,842
- Issue date Nov 7, 2023
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor with extended head bump bond pillar
- Patent number 11,810,843
- Issue date Nov 7, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUC...
- Publication number 20240145354
- Publication date May 2, 2024
- NEXPERIA B.V.
- Arnel Taduran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...
- Publication number 20240136260
- Publication date Apr 25, 2024
- STMicroelectronics S.r.l.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...
- Publication number 20240096767
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hank Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087996
- Publication date Mar 14, 2024
- ROHM CO., LTD.
- Kazuki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240087912
- Publication date Mar 14, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Die Integrated Circuit System in an Integrated Circuit Package...
- Publication number 20240088112
- Publication date Mar 14, 2024
- TDK - Micronas GmbH
- Paolo Marozzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...
- Publication number 20240087993
- Publication date Mar 14, 2024
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
- Publication number 20240071892
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071877
- Publication date Feb 29, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240071898
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240055330
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Younghwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...
- Publication number 20240047381
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
- Publication number 20240038635
- Publication date Feb 1, 2024
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240030107
- Publication date Jan 25, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240030159
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Hidetoshi ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021541
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-Solderable Leadless Package
- Publication number 20240021504
- Publication date Jan 18, 2024
- SEMTECH CORPORATION
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240006277
- Publication date Jan 4, 2024
- STMicroelectronics S.r.l
- Alberto ARRIGONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME
- Publication number 20230420390
- Publication date Dec 28, 2023
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE
- Publication number 20230411254
- Publication date Dec 21, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230411257
- Publication date Dec 21, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND A METHOD OF MANUFACTURING SUCH S...
- Publication number 20230402351
- Publication date Dec 14, 2023
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230402348
- Publication date Dec 14, 2023
- Rohm Co., Ltd.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES
- Publication number 20230387043
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230378033
- Publication date Nov 23, 2023
- Mitsubishi Electric Corporation
- Kazuki ARATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY
- Publication number 20230369177
- Publication date Nov 16, 2023
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20230369182
- Publication date Nov 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS

Connection or disconnection of other leads to or from flat leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging method and chip package unit

Power module with semiconductor packages mounted on metal frame

Stud bump for wirebonding high voltage isolation barrier connection

Tie bar removal for semiconductor device packaging

Electronic component apparatus having a first lead frame and a seco...

Flip chip packaged devices with thermal pad

Electronic devices in semiconductor package cavities

Half-bridge semiconductor device

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor device having a carrier, semiconductor chip packages...

Semiconductor package with plurality of leads and sealing resin

Semiconductor device

Semiconductor device with a transmitting insulating element

Manufacturing method of semiconductor device and semiconductor device

Semiconductor device having outer terminal portions with conductive...

Semiconductor device and method for supporting ultra-thin semicondu...

Electrochemical additive manufacturing method using deposition feed...

Semiconductor device having cavities at an interface of an encapsul...

Semiconductor die mounted in a recess of die pad

Leadless leadframe and semiconductor device package therefrom

Integrated circuits with conductive bumps having a profile with a w...

Method for manufacturing a semiconductor package having a conductiv...

Semiconductor package with nickel-silver pre-plated leadframe

Semiconductor device for improving heat dissipation and mounting st...

Method of manufacturing semiconductor devices and corresponding sem...

Method of manufacturing a semiconductor device having a bond wire o...

Packaged high voltage MOSFET device with connection clip and manufa...

Side-solderable leadless package

Semiconductor device and method of manufacturing the same

Integrated capacitor with extended head bump bond pillar

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUC...

PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...

VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

SEMICONDUCTOR DEVICE

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

SEMICONDUCTOR PACKAGING METHOD

Dual Die Integrated Circuit System in an Integrated Circuit Package...

MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...

MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Side-Solderable Leadless Package

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME

MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE ASSEMBLY AND A METHOD OF MANUFACTURING SUCH S...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...