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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4825
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
12,354,934
Issue date
Jul 8, 2025
Amkor Technology Singapore Holding Pte Ltd.
Siang Miang Yeo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacture
Patent number
12,347,751
Issue date
Jul 1, 2025
Nexperia B.V.
Ricardo Yandoc
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual die integrated circuit system in an integrated circuit package...
Patent number
12,341,138
Issue date
Jun 24, 2025
TDK-MICRONAS GMBH
Paolo Marozzi
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device having wire pieces in bonding member
Patent number
12,315,825
Issue date
May 27, 2025
Denso Corporation
Daisuke Fukuoka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrochemical additive manufacturing system having conductive see...
Patent number
12,308,251
Issue date
May 20, 2025
FABRIC8LABS, INC.
David Pain
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor device with electrical component for bridging leadfra...
Patent number
12,300,585
Issue date
May 13, 2025
STMicroelectronics S.r.l.
Alberto Arrigoni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including heat sink with exposed side from enc...
Patent number
12,300,584
Issue date
May 13, 2025
Amkor Technology Singapore Holding Pte Ltd.
Hyung Jun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Side-solderable leadless package
Patent number
12,293,960
Issue date
May 6, 2025
Semtech Corporation
Henry Descalzo Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacture for a cascode semiconductor device
Patent number
12,293,961
Issue date
May 6, 2025
Nexperia B.V.
Ricardo Yandoc
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded semiconductor package having an embedded inlay
Patent number
12,283,538
Issue date
Apr 22, 2025
Infineon Technologies AG
Marcus Boehm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a power converter module connected to con...
Patent number
12,266,596
Issue date
Apr 1, 2025
Texas Instruments Incorporated
Rajen Manicon Murugan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,266,627
Issue date
Apr 1, 2025
Mitsubishi Electric Corporation
Shinji Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
12,255,167
Issue date
Mar 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices in semiconductor package cavities
Patent number
12,255,115
Issue date
Mar 18, 2025
Texas Instruments Incorporated
Christopher Daniel Manack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method for manufacturing electronic device
Patent number
12,249,560
Issue date
Mar 11, 2025
Rohm Co., Ltd
Kazunori Fuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package for isolation dies
Patent number
12,243,911
Issue date
Mar 4, 2025
Texas Instruments Incorporated
Matthew David Romig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with wettable flank and related methods
Patent number
12,243,810
Issue date
Mar 4, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Hui Min Ler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming micro interconnect struc...
Patent number
12,230,559
Issue date
Feb 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
Patent number
12,224,251
Issue date
Feb 11, 2025
STMicroelectronics, Inc.
Ian Harvey Arellano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe, semiconductor package and method
Patent number
12,218,038
Issue date
Feb 4, 2025
Infineon Technologies Austria AG
Chau Fatt Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Miniature sensor cavities
Patent number
12,203,776
Issue date
Jan 21, 2025
Texas Instruments Incorporated
Sreenivasan Kalyani Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering a nanoparticle paste for semiconductor chip join
Patent number
12,199,059
Issue date
Jan 14, 2025
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,183,663
Issue date
Dec 31, 2024
Rohm Co., Ltd.
Kazuki Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated magnetic assembly with conductive field plates
Patent number
12,183,693
Issue date
Dec 31, 2024
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Floating die package
Patent number
12,176,298
Issue date
Dec 24, 2024
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
12,176,302
Issue date
Dec 24, 2024
Rohm Co., Ltd.
Hidetoshi Abe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with wettable flank
Patent number
12,176,272
Issue date
Dec 24, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Hui Min Ler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
Patent number
12,176,275
Issue date
Dec 24, 2024
Nexperia B.V.
Ricardo Yandoc
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
Patent number
12,170,240
Issue date
Dec 17, 2024
STMicroelectronics, Inc.
Rennier Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages with cavities and methods of manufactur...
Patent number
12,165,942
Issue date
Dec 10, 2024
Texas Instruments Incorporated
Jesus Bajo Bautista
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH GLASS SUBSTRATE AND PACKAGING...
Publication number
20250233060
Publication date
Jul 17, 2025
Yangtze Memory Technologies Co., Ltd.
Xinru Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250233099
Publication date
Jul 17, 2025
ROHM CO., LTD.
Ryosuke FUKUDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BALL/BUMP AND WIREBOND SEMICONDUCTOR DEVICE PACKAGING
Publication number
20250219009
Publication date
Jul 3, 2025
NXP USA, Inc.
Allen Marfil Descartin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
Publication number
20250218886
Publication date
Jul 3, 2025
TEXAS INSTRUMENTS INCORPORATED
Christopher Daniel MANACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR BATTERY CONNECTION IN MICROELECTRONIC PACKAGES
Publication number
20250210479
Publication date
Jun 26, 2025
NXP USA, Inc.
Namrata Kanth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
Publication number
20250201675
Publication date
Jun 19, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Hui Min LER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20250201753
Publication date
Jun 19, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
Publication number
20250192008
Publication date
Jun 12, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Hyung Jun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20250183217
Publication date
Jun 5, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Publication number
20250183125
Publication date
Jun 5, 2025
ROHM CO., LTD.
Kazunori FUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
Publication number
20250174531
Publication date
May 29, 2025
NXP USA, Inc.
Namrata Kanth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MINIATURE SENSOR CAVITIES
Publication number
20250164296
Publication date
May 22, 2025
TEXAS INSTRUMENTS INCORPORATED
Sreenivasan Kalyani KODURI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
Publication number
20250157982
Publication date
May 15, 2025
STMicroelectronics International N.V.
Guendalina CATALANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME PACKAGE WITH INCREASED ROUTING CAPABILITY
Publication number
20250157895
Publication date
May 15, 2025
Infineon Technologies Austria AG
Hao Zhuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20250149424
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20250149425
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
Publication number
20250140657
Publication date
May 1, 2025
IDEAL SEMICONDUCTOR DEVICES, INC.
Ryan Thorpe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250132232
Publication date
Apr 24, 2025
Advanced Semiconductor Engineering, Inc.
Jen-Hao PAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
Publication number
20250118635
Publication date
Apr 10, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Hui Min LER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE FOR A PCB
Publication number
20250105076
Publication date
Mar 27, 2025
NEXPERIA B.V.
Maria Cristina Estacio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...
Publication number
20250105079
Publication date
Mar 27, 2025
TEXAS INSTRUMENTS INCORPORATED
Jesus Bajo Bautista
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
Publication number
20250087563
Publication date
Mar 13, 2025
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250070051
Publication date
Feb 27, 2025
ROHM CO., LTD.
Hidetoshi ABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250069981
Publication date
Feb 27, 2025
Mitsubishi Electric Corporation
Shogo TOKUMARU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250069995
Publication date
Feb 27, 2025
Realtek Semiconductor Corp.
Nai-Jen Hsuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING
Publication number
20250070042
Publication date
Feb 27, 2025
Qorvo US, Inc.
Thomas Scott Morris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250069997
Publication date
Feb 27, 2025
ROHM CO., LTD.
Kazuki OKUYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
Publication number
20250054843
Publication date
Feb 13, 2025
INFINEON TECHNOLOGIES AG
Frank Singer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE
Publication number
20250029901
Publication date
Jan 23, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Silnore Tejero SABANDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
Publication number
20250020610
Publication date
Jan 16, 2025
TEXAS INSTRUMENTS INCORPORATED
Christlyn Faith ARIAS
G01 - MEASURING TESTING