Connectors having different sizes

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CPC
H01L2224/4103

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4103Connectors having different sizes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with sense terminal
- Patent number 12,113,041
- Issue date Oct 8, 2024
- Renesas Electronics Corporation
- Noriko Okunishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,985,092
- Issue date Apr 20, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module including multiple signal wiring patterns disposed on...
- Patent number 10,734,911
- Issue date Aug 4, 2020
- Rohm Co., Ltd.
- Tatsuya Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 10,229,893
- Issue date Mar 12, 2019
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid packaged lead frame based multi-chip semiconductor device wi...
- Patent number 10,043,736
- Issue date Aug 7, 2018
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and a method of manufacturing the same
- Patent number 9,961,798
- Issue date May 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method of a thin power device
- Patent number 9,854,686
- Issue date Dec 26, 2017
- Alpha and Omega Semiconductor (Cayman) LTD
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,601,453
- Issue date Mar 21, 2017
- MagnaChip Semiconductor, Ltd.
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 9,595,503
- Issue date Mar 14, 2017
- Vishay Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with integrated heat spreader and parti...
- Patent number 9,570,379
- Issue date Feb 14, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information processing apparatus, communication method and storage...
- Patent number 9,462,091
- Issue date Oct 4, 2016
- Canon Kabushiki Kaisha
- Yuji Hara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic component and method
- Patent number 9,443,787
- Issue date Sep 13, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlling apparatus for electric power steering apparatus
- Patent number 9,402,304
- Issue date Jul 26, 2016
- NSK Ltd.
- Naoto Shinkawa
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,397,028
- Issue date Jul 19, 2016
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,397,030
- Issue date Jul 19, 2016
- NSK Ltd.
- Takashi Sunaga
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device
- Patent number 9,362,240
- Issue date Jun 7, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising heat dissipating connector
- Patent number 9,362,192
- Issue date Jun 7, 2016
- Kabushiki Kaisha Toshiba
- Hajime Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,312,234
- Issue date Apr 12, 2016
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,129,949
- Issue date Sep 8, 2015
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312875
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Rie ARIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20240112990
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP INTERCONNECT WITH MICRO CONTACT HEADS
- Publication number 20220181290
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Emmanuel Silvestre RAMOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210020548
- Publication date Jan 21, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20200035656
- Publication date Jan 30, 2020
- ROHM CO., LTD.
- Tatsuya MIYAZAKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20170271304
- Publication date Sep 21, 2017
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140370661
- Publication date Dec 18, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20140361419
- Publication date Dec 11, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PACKAGING MULTI-CHIP SEMICONDUCTOR DEVICE AND PREPARATION ME...
- Publication number 20140361420
- Publication date Dec 11, 2014
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140332939
- Publication date Nov 13, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140301039
- Publication date Oct 9, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20140264806
- Publication date Sep 18, 2014
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Top-side Cooled Semiconductor Package with Stacked Inter...
- Publication number 20140154843
- Publication date Jun 5, 2014
- Alpha and Omega Semiconductor Incorprated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LINKED SEMICONDUCTOR MODULE UNIT AND ELECTRONIC CIRCUIT-INTEGRATED...
- Publication number 20140084722
- Publication date Mar 27, 2014
- DENSO CORPORATION
- Hideki MINATO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device Having a Clip Contact
- Publication number 20140084433
- Publication date Mar 27, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL CHIP PACKAGE HAVING LEVELING PROJECTIONS
- Publication number 20140054758
- Publication date Feb 27, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package Comprising a Laminate and Method of Making...
- Publication number 20140027892
- Publication date Jan 30, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130249103
- Publication date Sep 26, 2013
- Kabushiki Kaisha Toshiba
- Takeshi FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20130221516
- Publication date Aug 29, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE
- Publication number 20130181334
- Publication date Jul 18, 2013
- FUJI ELECTRIC CO., LTD
- Atsushi MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Connectors having different sizes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with sense terminal

Semiconductor device

Semiconductor device

Semiconductor device

Power module including multiple signal wiring patterns disposed on...

Method for fabricating stack die package

Semiconductor devices and methods of making the same

Semiconductor module and conductive member for semiconductor module...

Semiconductor devices and methods of making the same

Dual lead frame semiconductor package and method of manufacture

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Package and a method of manufacturing the same

Preparation method of a thin power device

Semiconductor module

Semiconductor package

Dual lead frame semiconductor package and method of manufacture

Method for fabricating stack die package

Power semiconductor package with integrated heat spreader and parti...

Information processing apparatus, communication method and storage...

Electronic component and method

Stacked synchronous buck converter having chip embedded in outside...

Semiconductor module

Controlling apparatus for electric power steering apparatus

Semiconductor devices and methods of making the same

Semiconductor module

Module comprising a semiconductor chip

Electronic device

Semiconductor device comprising heat dissipating connector

Semiconductor module and method for manufacturing the same

Power semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SANDWICH PACKAGE FOR MICROELECTRONICS

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

CLIP INTERCONNECT WITH MICRO CONTACT HEADS

SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

Dual Lead Frame Semiconductor Package and Method of Manufacture

Dual Lead Frame Semiconductor Package and Method of Manufacture

POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF

HYBRID PACKAGING MULTI-CHIP SEMICONDUCTOR DEVICE AND PREPARATION ME...

Dual Lead Frame Semiconductor Package and Method of Manufacture

PACKAGE AND A METHOD OF MANUFACTURING THE SAME

METHOD FOR FABRICATING STACK DIE PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

Semiconductor Device and Manufacturing Method Thereof

Method for Top-side Cooled Semiconductor Package with Stacked Inter...

Module Comprising a Semiconductor Chip

LINKED SEMICONDUCTOR MODULE UNIT AND ELECTRONIC CIRCUIT-INTEGRATED...

Semiconductor Device Having a Clip Contact

STACKED DUAL CHIP PACKAGE HAVING LEVELING PROJECTIONS

Electric Device Package Comprising a Laminate and Method of Making...

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

Semiconductor Device

CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE