consisting of two or more materials

Industry

CPC
H05K1/0353

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0353consisting of two or more materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,098,257
- Issue date Sep 24, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirosuke Saito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Covering film, and circuit board and manufacturing method
- Patent number 12,048,084
- Issue date Jul 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compositions and methods thereof
- Patent number 12,043,762
- Issue date Jul 23, 2024
- The Boeing Company
- Patrick J. Kinlen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Boron nitride nanotube coated substrates for sintering of metallic...
- Patent number 11,993,719
- Issue date May 28, 2024
- National Research Council of Canada
- Chantal Paquet
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Systems using composite materials
- Patent number 11,974,396
- Issue date Apr 30, 2024
- Advanced American Technologies, LLC
- Robert E. Grigsby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 11,971,760
- Issue date Apr 30, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin composition, prepreg, resin-equipped film, resin-equipped met...
- Patent number 11,958,951
- Issue date Apr 16, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masashi Koda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring member having bending property and electronic device compris...
- Patent number 11,943,888
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for use at 5G frequencies
- Patent number 11,917,753
- Issue date Feb 27, 2024
- Ticona LLC
- Xiaowei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer insulating material and multilayer printed wiring board
- Patent number 11,873,398
- Issue date Jan 16, 2024
- Sekisui Chemical Co., Ltd.
- Tatsushi Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 11,856,694
- Issue date Dec 26, 2023
- National Taiwan University of Science and Technology
- Chen-Hao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board with embedded electronic component and method for man...
- Patent number 11,778,752
- Issue date Oct 3, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Base material for printed circuit board and printed circuit board
- Patent number 11,752,734
- Issue date Sep 12, 2023
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Inhomogeneous dielectric medium high-speed stripline trace system
- Patent number 11,758,647
- Issue date Sep 12, 2023
- Dell Products L.P.
- Arun Reddy Chada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, cured product thereof, and printed...
- Patent number 11,746,227
- Issue date Sep 5, 2023
- TAIYO HOLDINGS CO., LTD.
- Tomotaka Noguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, prepreg, metal foil with resin, laminate, printe...
- Patent number 11,691,389
- Issue date Jul 4, 2023
- Resonac Corporation
- Yuya Hirayama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier with low shrinkage dielectric material
- Patent number 11,688,668
- Issue date Jun 27, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of routing in a singular direction first traces that are ele...
- Patent number 11,662,854
- Issue date May 30, 2023
- Sensel, Inc.
- Ilya Daniel Rosenberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing FCCL capable of controlling flexibility an...
- Patent number 11,665,828
- Issue date May 30, 2023
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate and method for manufacturing resin substrate
- Patent number 11,659,652
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal body formed on a component carrier by additive manufacturing
- Patent number 11,659,648
- Issue date May 23, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Marco Gavagnin
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of processing liquid crystal polymer film
- Patent number 11,649,332
- Issue date May 16, 2023
- AZOTEK CO., LTD.
- Li-Hua Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic device with self-healing properties
- Patent number 11,643,525
- Issue date May 9, 2023
- Korea University Research and Business Foundation
- Jeongsook Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate and method of making the same
- Patent number 11,617,264
- Issue date Mar 28, 2023
- Shinko Electric Industries Co., Ltd.
- Yuji Yukiiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing liquid crystal polymer film and device of proc...
- Patent number 11,597,806
- Issue date Mar 7, 2023
- AZOTEK CO., LTD.
- Li-Hua Wang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...
- Publication number 20240357749
- Publication date Oct 24, 2024
- Yield Engineering Systems, Inc.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-RESIN COMPOSITE, SURFACE TREATMENT METHOD, AND SUBSTRATE OF C...
- Publication number 20240342968
- Publication date Oct 17, 2024
- Nanjing University
- Wei CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITIONS AND METHODS THEREOF
- Publication number 20240336785
- Publication date Oct 10, 2024
- The Boeing Company
- Patrick J. KINLEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DETECTOR FABRICATION METHOD, GAS DETECTOR, AND RAY DETECTION DE...
- Publication number 20240272316
- Publication date Aug 15, 2024
- UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
- Zhiyong ZHANG
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268038
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANODE FOR HIGH-ENERGY BATTERIES
- Publication number 20240258513
- Publication date Aug 1, 2024
- HYDRO-QUEBEC
- Karim ZAGHIB
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE
- Publication number 20240251505
- Publication date Jul 25, 2024
- KYOCERA CORPORATION
- Kazuhiro OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, ME...
- Publication number 20240239974
- Publication date Jul 18, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hirosuke SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board for Use at 5G Frequencies
- Publication number 20240244743
- Publication date Jul 18, 2024
- Ticona LLC
- Xiaowei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215159
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang-min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-DIELECTRIC BOARD MATERIAL
- Publication number 20240206059
- Publication date Jun 20, 2024
- NITTO DENKO CORPORATION
- Taku IMAIZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
Flexible printed circuit, ink and method for obtaining flexible pri...
- Publication number 20240147618
- Publication date May 2, 2024
- UNIVERSIDADE DE COIMBRA
- Mahmoud TAVAKOLI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HA...
- Publication number 20240130041
- Publication date Apr 18, 2024
- Dell Products L.P.
- Peng Lip Goh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BIAXIALLY STRETCHED FILM, FILM WITH CURED RESIN LAYER, AND METAL LA...
- Publication number 20240076489
- Publication date Mar 7, 2024
- MITSUBISHI CHEMICAL CORPORATION
- Taiki Tsuruoka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240032204
- Publication date Jan 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yueh-Kai TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...
- Publication number 20240032209
- Publication date Jan 25, 2024
- Chihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION
- Publication number 20230407082
- Publication date Dec 21, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori INOKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED ASSEMBLY COMPRISING RADIO-FREQUENCY INTERFACE BOARD
- Publication number 20230413420
- Publication date Dec 21, 2023
- AGC Glass Europe
- Mohsen YOUSEFBEIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND MANUFACTURING METHOD FOR ELECTRONIC STRAIN SENSOR
- Publication number 20230400369
- Publication date Dec 14, 2023
- SLEEPTITE PTY LTD
- Cameron VAN DEN DUNGEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WI...
- Publication number 20230391939
- Publication date Dec 7, 2023
- Kohta IWANAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED...
- Publication number 20230391940
- Publication date Dec 7, 2023
- Naoyoshi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHOMOGENEOUS DIELECTRIC MEDIUM HIGH-SPEED STRIPLINE TRACE SYSTEM
- Publication number 20230389174
- Publication date Nov 30, 2023
- Dell Products L.P.
- Arun Reddy Chada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...
- Publication number 20230371176
- Publication date Nov 16, 2023
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, ME...
- Publication number 20230357558
- Publication date Nov 9, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Yiqun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM PROVIDED WITH RESIN, METAL FOIL PR...
- Publication number 20230323104
- Publication date Oct 12, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Rihoko WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D FILTER AND FABRICATION METHOD THEREOF
- Publication number 20230299450
- Publication date Sep 21, 2023
- QuantumZ Inc.
- Gang-Lin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230291091
- Publication date Sep 14, 2023
- LG Innotek Co., Ltd.
- Young Joon SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN,...
- Publication number 20230250282
- Publication date Aug 10, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Rihoko WATANABE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

consisting of two or more materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuits with embedded resistive thermal devices

Patterned article including electrically conductive elements

Resin multilayer substrate and method for manufacturing resin multi...

Resin composition, prepreg, film with resin, metal foil with resin,...

Metal-coated liquid-crystal polymer film

Covering film, and circuit board and manufacturing method

Patterned conductive article

Compositions and methods thereof

Boron nitride nanotube coated substrates for sintering of metallic...

Systems using composite materials

Printed circuits with embedded resistive thermal devices

Resin composition, prepreg, resin-equipped film, resin-equipped met...

Wiring member having bending property and electronic device compris...

Circuit board for use at 5G frequencies

Interlayer insulating material and multilayer printed wiring board

Circuit substrate and method for manufacturing the same

Circuit board with embedded electronic component and method for man...

Base material for printed circuit board and printed circuit board

Inhomogeneous dielectric medium high-speed stripline trace system

Thermosetting resin composition, cured product thereof, and printed...

Resin composition, prepreg, metal foil with resin, laminate, printe...

Component carrier with low shrinkage dielectric material

Method of routing in a singular direction first traces that are ele...

Method for manufacturing FCCL capable of controlling flexibility an...

Resin substrate and method for manufacturing resin substrate

Metal body formed on a component carrier by additive manufacturing

Method of processing liquid crystal polymer film

Electronic device with self-healing properties

Interconnect substrate and method of making the same

Method of processing liquid crystal polymer film and device of proc...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...

METAL-RESIN COMPOSITE, SURFACE TREATMENT METHOD, AND SUBSTRATE OF C...

COMPOSITIONS AND METHODS THEREOF

PATTERNED CONDUCTIVE ARTICLE

GAS DETECTOR FABRICATION METHOD, GAS DETECTOR, AND RAY DETECTION DE...

PRINTED WIRING BOARD

ANODE FOR HIGH-ENERGY BATTERIES

ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE

RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, ME...

Circuit Board for Use at 5G Frequencies

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

LOW-DIELECTRIC BOARD MATERIAL

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

Flexible printed circuit, ink and method for obtaining flexible pri...

INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HA...

BIAXIALLY STRETCHED FILM, FILM WITH CURED RESIN LAYER, AND METAL LA...

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...

HEAT-CURABLE RESIN COMPOSITION

LAMINATED ASSEMBLY COMPRISING RADIO-FREQUENCY INTERFACE BOARD

DEVICE, SYSTEM AND MANUFACTURING METHOD FOR ELECTRONIC STRAIN SENSOR

RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WI...

MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED...

INHOMOGENEOUS DIELECTRIC MEDIUM HIGH-SPEED STRIPLINE TRACE SYSTEM

BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...

RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, ME...

RESIN COMPOSITION, PREPREG, FILM PROVIDED WITH RESIN, METAL FOIL PR...

3D FILTER AND FABRICATION METHOD THEREOF

CIRCUIT BOARD

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN,...