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H05K1/0353
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00
Printed circuits
Current Industry
H05K1/0353
consisting of two or more materials
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Patents Grants
last 30 patents
Information
Patent Grant
Systems using composite materials
Patent number
11,974,396
Issue date
Apr 30, 2024
Advanced American Technologies, LLC
Robert E. Grigsby
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuits with embedded resistive thermal devices
Patent number
11,971,760
Issue date
Apr 30, 2024
Apple Inc.
Anne M. Mason
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Resin composition, prepreg, resin-equipped film, resin-equipped met...
Patent number
11,958,951
Issue date
Apr 16, 2024
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Masashi Koda
B32 - LAYERED PRODUCTS
Information
Patent Grant
Wiring member having bending property and electronic device compris...
Patent number
11,943,888
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Eunseok Hong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board for use at 5G frequencies
Patent number
11,917,753
Issue date
Feb 27, 2024
Ticona LLC
Xiaowei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interlayer insulating material and multilayer printed wiring board
Patent number
11,873,398
Issue date
Jan 16, 2024
Sekisui Chemical Co., Ltd.
Tatsushi Hayashi
B32 - LAYERED PRODUCTS
Information
Patent Grant
Circuit substrate and method for manufacturing the same
Patent number
11,856,694
Issue date
Dec 26, 2023
National Taiwan University of Science and Technology
Chen-Hao Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Circuit board with embedded electronic component and method for man...
Patent number
11,778,752
Issue date
Oct 3, 2023
Avary Holding (Shenzhen) Co., Limited.
Hsiao-Ting Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Base material for printed circuit board and printed circuit board
Patent number
11,752,734
Issue date
Sep 12, 2023
Sumitomo Electric Industries, Ltd.
Motohiko Sugiura
B32 - LAYERED PRODUCTS
Information
Patent Grant
Inhomogeneous dielectric medium high-speed stripline trace system
Patent number
11,758,647
Issue date
Sep 12, 2023
Dell Products L.P.
Arun Reddy Chada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting resin composition, cured product thereof, and printed...
Patent number
11,746,227
Issue date
Sep 5, 2023
TAIYO HOLDINGS CO., LTD.
Tomotaka Noguchi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Resin composition, prepreg, metal foil with resin, laminate, printe...
Patent number
11,691,389
Issue date
Jul 4, 2023
Resonac Corporation
Yuya Hirayama
B32 - LAYERED PRODUCTS
Information
Patent Grant
Component carrier with low shrinkage dielectric material
Patent number
11,688,668
Issue date
Jun 27, 2023
AT&S (China) Co. Ltd.
Mikael Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing FCCL capable of controlling flexibility an...
Patent number
11,665,828
Issue date
May 30, 2023
SAMWON ACT CO., LTD.
Kyung Yul Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of routing in a singular direction first traces that are ele...
Patent number
11,662,854
Issue date
May 30, 2023
Sensel, Inc.
Ilya Daniel Rosenberg
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Resin substrate and method for manufacturing resin substrate
Patent number
11,659,652
Issue date
May 23, 2023
Murata Manufacturing Co., Ltd.
Ryosuke Takada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal body formed on a component carrier by additive manufacturing
Patent number
11,659,648
Issue date
May 23, 2023
AT&S Austria Technologie & Systemtechnik AG
Marco Gavagnin
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method of processing liquid crystal polymer film
Patent number
11,649,332
Issue date
May 16, 2023
AZOTEK CO., LTD.
Li-Hua Wang
B32 - LAYERED PRODUCTS
Information
Patent Grant
Electronic device with self-healing properties
Patent number
11,643,525
Issue date
May 9, 2023
Korea University Research and Business Foundation
Jeongsook Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect substrate and method of making the same
Patent number
11,617,264
Issue date
Mar 28, 2023
Shinko Electric Industries Co., Ltd.
Yuji Yukiiri
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of processing liquid crystal polymer film and device of proc...
Patent number
11,597,806
Issue date
Mar 7, 2023
AZOTEK CO., LTD.
Li-Hua Wang
B32 - LAYERED PRODUCTS
Information
Patent Grant
Molded product, metal-clad laminate, printed wiring board, and meth...
Patent number
11,535,015
Issue date
Dec 27, 2022
AGC Inc.
Wataru Kasai
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method of manufacturing metal-clad laminate and uses of the same
Patent number
11,529,797
Issue date
Dec 20, 2022
Taiwan Union Technology Corporation
Wen-Ren Chen
B32 - LAYERED PRODUCTS
Information
Patent Grant
Dielectric composition, dielectric thin film, dielectric element, a...
Patent number
11,524,897
Issue date
Dec 13, 2022
TDK Corporation
Toshio Asahi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-fabricated electrode arrays with flexible substrate for highl...
Patent number
11,497,913
Issue date
Nov 15, 2022
Bionic Eye Technologies, Inc.
Douglas Bourne Shire
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Wiring board
Patent number
11,490,518
Issue date
Nov 1, 2022
Ricoh Company, Ltd.
Kyohei Matsumura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ceramic and polymer composite, methods of making, and uses thereof
Patent number
11,490,510
Issue date
Nov 1, 2022
Corning Incorporated
Weiguo Miao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Phosphorated anhydride containing epoxy resin
Patent number
11,479,638
Issue date
Oct 25, 2022
Blue Cube IP LLC
Simon Ye
B32 - LAYERED PRODUCTS
Information
Patent Grant
Metal-clad laminate, metal foil with resin, and wiring board
Patent number
11,477,883
Issue date
Oct 18, 2022
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Kosuke Tsuda
B32 - LAYERED PRODUCTS
Information
Patent Grant
Printed circuit board and antenna module comprising the same
Patent number
11,445,598
Issue date
Sep 13, 2022
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Tae Hong Min
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Flexible printed circuit, ink and method for obtaining flexible pri...
Publication number
20240147618
Publication date
May 2, 2024
UNIVERSIDADE DE COIMBRA
Mahmoud TAVAKOLI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HA...
Publication number
20240130041
Publication date
Apr 18, 2024
Dell Products L.P.
Peng Lip Goh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
BIAXIALLY STRETCHED FILM, FILM WITH CURED RESIN LAYER, AND METAL LA...
Publication number
20240076489
Publication date
Mar 7, 2024
MITSUBISHI CHEMICAL CORPORATION
Taiki Tsuruoka
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
Publication number
20240032204
Publication date
Jan 25, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
Yueh-Kai TANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...
Publication number
20240032209
Publication date
Jan 25, 2024
Chihiro HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT-CURABLE RESIN COMPOSITION
Publication number
20230407082
Publication date
Dec 21, 2023
Shin-Etsu Chemical Co., Ltd.
Yoshinori INOKUCHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAMINATED ASSEMBLY COMPRISING RADIO-FREQUENCY INTERFACE BOARD
Publication number
20230413420
Publication date
Dec 21, 2023
AGC Glass Europe
Mohsen YOUSEFBEIKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, SYSTEM AND MANUFACTURING METHOD FOR ELECTRONIC STRAIN SENSOR
Publication number
20230400369
Publication date
Dec 14, 2023
SLEEPTITE PTY LTD
Cameron VAN DEN DUNGEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WI...
Publication number
20230391939
Publication date
Dec 7, 2023
Kohta IWANAGA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED...
Publication number
20230391940
Publication date
Dec 7, 2023
Naoyoshi SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INHOMOGENEOUS DIELECTRIC MEDIUM HIGH-SPEED STRIPLINE TRACE SYSTEM
Publication number
20230389174
Publication date
Nov 30, 2023
Dell Products L.P.
Arun Reddy Chada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...
Publication number
20230371176
Publication date
Nov 16, 2023
Sumitomo Electric Industries, Ltd.
Takuto HIDANI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, ME...
Publication number
20230357558
Publication date
Nov 9, 2023
Panasonic Intellectual Property Management Co., Ltd.
Yiqun WANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RESIN COMPOSITION, PREPREG, FILM PROVIDED WITH RESIN, METAL FOIL PR...
Publication number
20230323104
Publication date
Oct 12, 2023
Panasonic Intellectual Property Management Co., Ltd.
Rihoko WATANABE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
3D FILTER AND FABRICATION METHOD THEREOF
Publication number
20230299450
Publication date
Sep 21, 2023
QuantumZ Inc.
Gang-Lin ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD
Publication number
20230291091
Publication date
Sep 14, 2023
LG Innotek Co., Ltd.
Young Joon SON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN,...
Publication number
20230250282
Publication date
Aug 10, 2023
Panasonic Intellectual Property Management Co., Ltd.
Rihoko WATANABE
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN,...
Publication number
20230250281
Publication date
Aug 10, 2023
Panasonic Intellectual Property Management Co., Ltd.
Jun YASUMOTO
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
METHOD OF MANUFACTURING CONDUCTIVE MEMBER FOR TOUCH PANEL AND CONDU...
Publication number
20230229276
Publication date
Jul 20, 2023
FUJIFILM CORPORATION
Takato SUZUKI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
RESIN COMPOSITION FOR WIRING BOARD MATERIAL, AND PREPREG, RESIN-COA...
Publication number
20230212392
Publication date
Jul 6, 2023
Panasonic Intellectual Property Management Co., Ltd.
Lin LIN
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
METHOD FOR PRODUCING COMPOSITE BODY
Publication number
20230141729
Publication date
May 11, 2023
Denka Company Limited
Yoshitaka MINAKATA
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information
Patent Application
METAL-COATED LIQUID-CRYSTAL POLYMER FILM
Publication number
20230076995
Publication date
Mar 9, 2023
Kuraray Co., Ltd
Kikuo ARIMOTO
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
COVERING FILM, AND CIRCUIT BOARD AND MANUFACTURING METHOD
Publication number
20230038731
Publication date
Feb 9, 2023
Avary Holding (Shenzhen) Co., Limited.
HSIAO-TING HSU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD, LENS DRIVING DEVICE, AND CAMERA MODULE INCLUDING THE...
Publication number
20230017158
Publication date
Jan 19, 2023
LG Innotek Co., Ltd.
Na Kyung KWON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...
Publication number
20230007781
Publication date
Jan 5, 2023
FUJIKURA LTD.
Kazutoshi Koshimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING LCP FILM FOR CIRCUIT SUBSTRATE AND T-DIE M...
Publication number
20220418111
Publication date
Dec 29, 2022
Denka Company Limited
Naoki OGAWA
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
LAYERED BODY, MOLDED ARTICLE, PRINTED-WIRING BOARD AND ELECTROMAGNE...
Publication number
20220363852
Publication date
Nov 17, 2022
DIC CORPORATION
Wataru Fujikawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Component Carrier
Publication number
20220346229
Publication date
Oct 27, 2022
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abderrazzaq IFIS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
Publication number
20220326746
Publication date
Oct 13, 2022
Apple Inc.
Anne M. Mason
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...
Publication number
20220312598
Publication date
Sep 29, 2022
Avary Holding (Shenzhen) Co., Limited.
HSIAO-TING HSU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR