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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L39/00Devices using superconductivity Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof

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Patents Grantslast 30 patents

Information Patent Grant
Vacuum encapsulated Josephson junction
- Patent number 11,678,591
- Issue date Jun 13, 2023
- International Business Machines Corporation
- Isaac Lauer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board assembly for edge-coupling to an integrated c...
- Patent number 11,678,433
- Issue date Jun 13, 2023
- D-Wave Systems Inc.
- Richard D. Neufeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined Dolan bridge and quantum dot Josephson junction in series
- Patent number 11,665,981
- Issue date May 30, 2023
- International Business Machines Corporation
- Steven J. Holmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microwave integrated quantum circuits with vias and methods for mak...
- Patent number 11,574,230
- Issue date Feb 7, 2023
- Rigetti & Co, LLC
- Chad Tyler Rigetti
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Spinel superconducting tunnel junction for quantum devices
- Patent number 11,568,299
- Issue date Jan 31, 2023
- Google LLC
- David Kirtland Fork
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Superconducting qubit device packages
- Patent number 11,569,428
- Issue date Jan 31, 2023
- Santa Clara
- Jeanette M. Roberts
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Epitaxial Josephson junction transmon device
- Patent number 11,563,162
- Issue date Jan 24, 2023
- International Business Machines Corporation
- Steven J. Holmes
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 11,558,955
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reducing dissipation and frequency noise in quantum devices using a...
- Patent number 11,545,608
- Issue date Jan 3, 2023
- Google LLC
- Anthony Edward Megrant
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quantum processor design to increase control footprint
- Patent number 11,538,976
- Issue date Dec 27, 2022
- Google LLC
- Evan Jeffrey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reducing dissipation and frequency noise in quantum devices using a...
- Patent number 11,508,895
- Issue date Nov 22, 2022
- Google LLC
- Anthony Edward Megrant
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabricating transmon qubit flip-chip structures for quantum computi...
- Patent number 11,489,103
- Issue date Nov 1, 2022
- International Business Machines Corporation
- Jerry M. Chow
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ion implantation method and ion implanter for performing the same
- Patent number 11,482,401
- Issue date Oct 25, 2022
- Shanghai Huali Integrated Circuit Mfg. Co. Ltd.
- Chaorong Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using thermalizing material in an enclosure for cooling quantum com...
- Patent number 11,425,841
- Issue date Aug 23, 2022
- International Business Machines Corporation
- Sean Hart
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Frequency multiplexing for qubit readout
- Patent number 11,417,822
- Issue date Aug 16, 2022
- International Business Machines Corporation
- Nicholas Torleiv Bronn
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Forming a bumpless superconductor device by bonding two substrates...
- Patent number 11,417,819
- Issue date Aug 16, 2022
- Microsoft Technology Licensing, LLC
- Christopher A. Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset embedded ground plane cutout
- Patent number 11,411,158
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated readout card
- Patent number 11,411,159
- Issue date Aug 9, 2022
- Google LLC
- Theodore Charles White
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Dielectric holder for quantum devices
- Patent number 11,349,060
- Issue date May 31, 2022
- International Business Machines Corporation
- Patryk Gumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip chip assembly of quantum computing devices
- Patent number 11,195,773
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flux-biasing superconducting quantum processors
- Patent number 11,177,428
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Oblesh Jinka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrating Josephson amplifiers or Josephson mixers into printed c...
- Patent number 11,178,771
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Baleegh Abdo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cold-welded flip chip interconnect structure
- Patent number 11,165,010
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Permanent wafer handlers with through silicon vias for thermalizati...
- Patent number 11,158,781
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 11,121,302
- Issue date Sep 14, 2021
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux-biasing superconducting quantum processors
- Patent number 11,050,010
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Oblesh Jinka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated quantum circuit assemblies for cooling apparatus
- Patent number 11,011,693
- Issue date May 18, 2021
- Intel Corporation
- Lester Lampert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrating Josephson amplifiers or Josephson mixers into printed c...
- Patent number 11,006,527
- Issue date May 11, 2021
- International Business Machines Corporation
- Baleegh Abdo
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
GENERATING DC OFFSETS IN FLUX-TUNABLE TRANSMONS WITH PERSISTENT CUR...
- Publication number 20240095564
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Devin Underwood
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES
- Publication number 20230363295
- Publication date Nov 9, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TE...
- Publication number 20230363294
- Publication date Nov 9, 2023
- International Business Machines Corporation
- David Abraham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH DENSITY INTERCONNECTS FOR ARRAYS OF JOSEPHSON TRAVELING WAVE P...
- Publication number 20230337552
- Publication date Oct 19, 2023
- International Business Machines Corporation
- Corrado P. Mancini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...
- Publication number 20230210023
- Publication date Jun 29, 2023
- Intel Corporation
- Hubert C. George
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUPERCONDUCTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230165168
- Publication date May 25, 2023
- NEC Corporation
- Ayami YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL JOSEPHSON JUNCTION TRANSMON DEVICE
- Publication number 20230122482
- Publication date Apr 20, 2023
- International Business Machines Corporation
- Steven J. Holmes
- B82 - NANO-TECHNOLOGY
Information Patent Application
QUBIT ASSEMBLY, QUBIT ASSEMBLY PREPARATION METHOD, CHIP, AND DEVICE
- Publication number 20230115860
- Publication date Apr 13, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Chenji ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DISSIPATION AND FREQUENCY NOISE IN QUANTUM DEVICES USING A...
- Publication number 20230057880
- Publication date Feb 23, 2023
- Google LLC
- Anthony Edward Megrant
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TWO-DIMENSIONAL SCALABLE SUPERCONDUCTING QUBIT STRUCTURE AND METHOD...
- Publication number 20220416145
- Publication date Dec 29, 2022
- UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
- Shiyu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTOR COMPOSITES AND DEVICES COMPRISING SAME
- Publication number 20220376162
- Publication date Nov 24, 2022
- Technion Research & Development Foundation Limited
- Yachin IVRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING DEVICE
- Publication number 20220367780
- Publication date Nov 17, 2022
- NEC Corporation
- Kunihiko ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS SUPERCONDUCTOR DEVICE
- Publication number 20220352453
- Publication date Nov 3, 2022
- Microsoft Technology Licensing, LLC
- Christopher A. CANTALOUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING OF SUPERCONDUCTING WIRES
- Publication number 20220343052
- Publication date Oct 27, 2022
- Microsoft Technology Licensing, LLC
- Michael B. GOULDING
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM DEVICE
- Publication number 20220344562
- Publication date Oct 27, 2022
- NEC Corporation
- Katsumi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AIR BRIDGE, AIR BRIDGE STRUCTURE, AND SUPERC...
- Publication number 20220216390
- Publication date Jul 7, 2022
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Wenlong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET EMBEDDED GROUND PLANE CUTOUT
- Publication number 20220199886
- Publication date Jun 23, 2022
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS
- Publication number 20220199507
- Publication date Jun 23, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED SUBSTRATE STRUCTURES WITH ALIGNED OPTICAL ACCESS TO ELECTRI...
- Publication number 20220158068
- Publication date May 19, 2022
- International Business Machines Corporation
- Stephen M. Gates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND DISCONTINUITIES FOR THERMAL ISOLATION
- Publication number 20220159822
- Publication date May 19, 2022
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS, DEVICES, AND METHODS FOR RESISTANCE METROLOGY USING GRAPHE...
- Publication number 20220146597
- Publication date May 12, 2022
- University of Maryland, College Park
- Randolph ELMQUIST
- G01 - MEASURING TESTING
Information Patent Application
QUBIT CIRCUITS WITH DEEP, IN-SUBSTRATE COMPONENTS
- Publication number 20220121978
- Publication date Apr 21, 2022
- Massachusetts Institute of Technology
- Wayne Woods
- B82 - NANO-TECHNOLOGY
Information Patent Application
SUPERCONDUCTING CIRCUIT PROVIDED ON AN ENCAPSULATED VACUUM CAVITY
- Publication number 20220102613
- Publication date Mar 31, 2022
- International Business Machines Corporation
- Isaac Lauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WITH BIFUNCTIONAL ROUTING AND ASSOCIATED METHOD OF MANUFACTURING
- Publication number 20220093501
- Publication date Mar 24, 2022
- Commissariat à L'énergie atomique et aux énergies alternatives,
- Candice THOMAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20220020715
- Publication date Jan 20, 2022
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DEVICE
- Publication number 20210408354
- Publication date Dec 30, 2021
- NEC Corporation
- Katsumi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20210408355
- Publication date Dec 30, 2021
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210399194
- Publication date Dec 23, 2021
- NEC Corporation
- Kenji NANBA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM DEVICE
- Publication number 20210399195
- Publication date Dec 23, 2021
- NEC Corporation
- Katsumi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Containers Mountings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vacuum encapsulated Josephson junction

Printed circuit board assembly for edge-coupling to an integrated c...

Combined Dolan bridge and quantum dot Josephson junction in series

Microwave integrated quantum circuits with vias and methods for mak...

Spinel superconducting tunnel junction for quantum devices

Superconducting qubit device packages

Epitaxial Josephson junction transmon device

Ground discontinuities for thermal isolation

Reducing dissipation and frequency noise in quantum devices using a...

Quantum processor design to increase control footprint

Reducing dissipation and frequency noise in quantum devices using a...

Fabricating transmon qubit flip-chip structures for quantum computi...

Ion implantation method and ion implanter for performing the same

Using thermalizing material in an enclosure for cooling quantum com...

Frequency multiplexing for qubit readout

Forming a bumpless superconductor device by bonding two substrates...

Offset embedded ground plane cutout

Integrated readout card

Dielectric holder for quantum devices

Flip chip assembly of quantum computing devices

Flux-biasing superconducting quantum processors

Integrating Josephson amplifiers or Josephson mixers into printed c...

Cold-welded flip chip interconnect structure

Permanent wafer handlers with through silicon vias for thermalizati...

Superconducting bump bonds

Superconducting bump bonds

System and method for superconducting multi-chip module

Flux-biasing superconducting quantum processors

Integrated quantum circuit assemblies for cooling apparatus

Integrating Josephson amplifiers or Josephson mixers into printed c...

Patents Applicationslast 30 patents

GENERATING DC OFFSETS IN FLUX-TUNABLE TRANSMONS WITH PERSISTENT CUR...

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES

ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TE...

HIGH DENSITY INTERCONNECTS FOR ARRAYS OF JOSEPHSON TRAVELING WAVE P...

TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...

SUPERCONDUCTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

EPITAXIAL JOSEPHSON JUNCTION TRANSMON DEVICE

QUBIT ASSEMBLY, QUBIT ASSEMBLY PREPARATION METHOD, CHIP, AND DEVICE

REDUCING DISSIPATION AND FREQUENCY NOISE IN QUANTUM DEVICES USING A...

TWO-DIMENSIONAL SCALABLE SUPERCONDUCTING QUBIT STRUCTURE AND METHOD...

SUPERCONDUCTOR COMPOSITES AND DEVICES COMPRISING SAME

SUPERCONDUCTING DEVICE

BUMPLESS SUPERCONDUCTOR DEVICE

ROUTING OF SUPERCONDUCTING WIRES

QUANTUM DEVICE

METHOD FOR FABRICATING AIR BRIDGE, AIR BRIDGE STRUCTURE, AND SUPERC...

OFFSET EMBEDDED GROUND PLANE CUTOUT

MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS

LAYERED SUBSTRATE STRUCTURES WITH ALIGNED OPTICAL ACCESS TO ELECTRI...

GROUND DISCONTINUITIES FOR THERMAL ISOLATION

SYSTEMS, DEVICES, AND METHODS FOR RESISTANCE METROLOGY USING GRAPHE...

QUBIT CIRCUITS WITH DEEP, IN-SUBSTRATE COMPONENTS

SUPERCONDUCTING CIRCUIT PROVIDED ON AN ENCAPSULATED VACUUM CAVITY

CHIP WITH BIFUNCTIONAL ROUTING AND ASSOCIATED METHOD OF MANUFACTURING

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

QUANTUM DEVICE

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

QUANTUM DEVICE AND METHOD OF MANUFACTURING THE SAME

QUANTUM DEVICE