Patent Application
20250048762
The present disclosure relates to a semiconductor device, an electronic apparatus, and a manufacturing method of a semiconductor device.
As a semiconductor device including an imaging element such as a CMOS image sensor and a semiconductor element such as a light-emitting element such as a semiconductor laser, there has been a device including the following package structure in the past. That is, a package structure in which a transparent member such as a plate-like glass is provided so as to cover a semiconductor element mounted on a substrate from an upper side (front surface side) and a sealing resin part is provided around the semiconductor element and the transparent member on the substrate has been provided (see, for example, PTL 1).
In a manufacturing process of a semiconductor device, a semiconductor chip is generally picked up by a suction collet when the semiconductor chip is conveyed. In the case of the semiconductor chip having the package structure as described above, the semiconductor chip is subjected to suction by the collet on a side where the transparent member is provided to the semiconductor element.
In the package structure described above, a front surface (upper surface) of the transparent member becomes the uppermost surface in the package structure. Therefore, when being picked up by the collet, the semiconductor chip is subjected to a suction action by the collet on the front surface of the transparent member.
When the semiconductor chip is subjected to the suction action of the flat collet on the front surface of the transparent member, there is a risk that the collet interferes with the transparent member to scratch the transparent member or stains of the collet adhere to the transparent member to contaminate the transparent member. Occurrence of scratches and contamination in the transparent member causes a reduction in manufacturing yield. Therefore, in order to allow the collet to exert the suction action on regions other than the transparent member, a countermeasure of using a dedicate collet according to the type of package structure or the like is conceivable, and such a countermeasure is not preferable from the viewpoint of cost and the like.
An object of the present technique is to provide a semiconductor device, an electronic apparatus, and a manufacturing method of a semiconductor device that can suppress the occurrence of scratches and stains on a transparent member provided so as to cover a semiconductor element from the front surface side and can stabilize the manufacturing yield.
A semiconductor device according to the present technique includes a substrate, a semiconductor element that is provided on the substrate, a transparent member that is provided on the semiconductor element through a support part, and a sealing resin part that is formed around the semiconductor element and the transparent member on the substrate, and the sealing resin part has a protrusion part having an upper surface thereof perpendicular to a plate thickness direction of the substrate, the upper surface being positioned above a front surface of the transparent member in the plate thickness direction.
In another aspect of the semiconductor device according to the present technique, in the semiconductor device, a dimension between the front surface of the transparent member and the upper surface of the protrusion part is 10 to 200 μm in the plate thickness direction.
In still another aspect of the semiconductor device according to the present technique, in the semiconductor device, the transparent member has a rectangular plate-like outer shape with one plate surface as the front surface, the protrusion part is formed in a frame shape by four side parts along a rectangular outer shape of the transparent member in plan view, and a width of each side part of the protrusion part is 100 μm or more.
In yet another aspect of the semiconductor device according to the present technique, in the semiconductor device, the protrusion part has a transparent member covering part extending on the front surface of the transparent member so as to cover an edge part of the front surface of the transparent member.
In further aspect of the semiconductor device according to the present technique, in the semiconductor device, a sealing resin receiving part that is provided at an edge part on the front surface of the transparent member and is in contact with the protrusion part on an outer side surface is provided.
An electronic apparatus according to the present technique includes a semiconductor device including a substrate, a semiconductor element that is provided on the substrate, a transparent member that is provided on the semiconductor element through a support part, and a sealing resin part that is formed around the semiconductor element and the transparent member on the substrate, and the sealing resin part has a protrusion part having an upper surface thereof perpendicular to a plate thickness direction of the substrate, the upper surface being positioned above a front surface of the transparent member in the plate thickness direction.
A manufacturing method of a semiconductor device according to the present technique includes a step of mounting a semiconductor element on a substrate, a step of providing, on the semiconductor element through a support part, a transparent member with at least a peripheral edge part of a front surface covered with a protective material, and a step of forming a sealing resin part around the semiconductor element and the transparent member on the substrate by use of a mold.
In another aspect of the manufacturing method of a semiconductor device according to the present technique, in the manufacturing method of a semiconductor device, as the protective material, a film-like member that wholly covers the front surface of the transparent member or partially covers the front surface except the peripheral edge part of the front surface is used, and a step of removing the protective material is included after the step of forming the sealing resin part.
In still another aspect of the manufacturing method of a semiconductor device according to the present technique, in the manufacturing method of a semiconductor device, the transparent member has a rectangular plate-like outer shape with one plate surface as the front surface, and, as the protective material, a material having a substantially rectangular outer shape corresponding to the front surface of the transparent member in plan view, and having at least any one of recess parts formed on four side parts and R-shaped parts formed at four corner parts in the outer shape in plan view is used.
In yet another aspect of the manufacturing method of a semiconductor device according to the present technique, in the manufacturing method of a semiconductor device, as the protective material, a material having a base material formed by a predetermined material and an adhesive layer for pasting the base material to the transparent member is used.
In further aspect of the manufacturing method of a semiconductor device according to the present technique, in the manufacturing method of a semiconductor device, the transparent member has a rectangular plate-like outer shape with one plate surface as the front surface, as the protective material, a material having a substantially rectangular outer shape corresponding to the front surface of the transparent member in plan view, having recess parts formed on four side parts in the outer shape in plan view, and having a base material formed by a predetermined material and an adhesive layer for pasting the base material to the transparent member is used, and a recess amount of each of the recess parts with respect to a virtual straight line along a rectangular shape in the outer shape in plan view is 0.7 to 1.3 times a thickness of the adhesive layer.
In still further aspect of the manufacturing method of a semiconductor device according to the present technique, in the manufacturing method of a semiconductor device, the predetermined material for forming the base material includes PET, and the adhesive layer is formed by use of an acrylic resin adhesive.
In yet further aspect of the manufacturing method of a semiconductor device according to the present technique, in the manufacturing method of a semiconductor device, in the step of forming the sealing resin part, a resin material in a liquid state at normal temperature is used as a resin material for forming the sealing resin part.
The present technique is intended to suppress the occurrence of scratches and stains on a transparent member in a manufacturing process of a semiconductor device and to reduce the cost by devising the shape of a sealing resin part formed around a semiconductor element and the transparent member on a substrate, a method of forming the sealing resin part, and the like. Hereinafter, modes (hereinafter, referred to as “embodiments”) for carrying out the present technique will be described with reference to the drawings. In the embodiments described below, an example of an imaging device (solid-state imaging device) including a solid-state imaging element that is an example of a semiconductor element will be described as a semiconductor device. It should be noted that the drawings are schematic, and the proportion and the like of dimensions of each part do not necessarily match the actual ones. In addition, it is obvious that parts that are different in relation and proportion of the dimensions from each other are included among the drawings. The embodiments will be described in the following order.
A configuration example of an imaging device according to a first embodiment of the present technique will be described with reference to
As depicted in
The imaging device 1 includes a hollow package structure in which the glass 4 is mounted on the image sensor 3 through the support part 6 and a cavity 8 is formed between the image sensor 3 and the glass 4. In the imaging device 1, the glass 4 is supported against the image sensor 3 by the support part 6 provided on a front surface 3a that is the surface on a light receiving side of the image sensor 3 so as to be opposed to the front surface 3a. The periphery between the image sensor 3 and the glass 4 is sealed by the support part 6, and the void-like cavity 8 is formed.
The substrate 2 is an organic substrate including an organic material such as plastic as a base material and is a circuit substrate in which a predetermined circuit pattern formed by use of a metal material is formed. However, the substrate 2 may be another kind of substrate such as a ceramic substrate formed by use of ceramics or the like as a material.
The substrate 2 has a rectangular plate-like outer shape and has a front surface 2a on which the image sensor 3 is mounted, a rear surface 2b that is a plate surface on the opposite side thereof, and four side surfaces 2c. The image sensor 3 is die-bonded to the front surface 2a side of the substrate 2. The image sensor 3 is bonded to the front surface 2a of the substrate 2 by a joint layer 9 including a die bond material such as an insulating or conductive adhesive.
The image sensor 3 is a semiconductor element including a semiconductor substrate including silicon (Si) as an example of a semiconductor. The image sensor 3 is a rectangular plate-like chip, the front surface 3a side that is the upper (one) plate surface is the light receiving surface side, and the opposite (the other) plate surface is a rear surface 3b. The image sensor 3 has four side surfaces 3c. A plurality of light receiving elements (photoelectric conversion elements) is formed on the front surface 3a side of the image sensor 3. The image sensor 3 is a CMOS (Complementary Metal Oxide Semiconductor) type image sensor. However, the image sensor 3 may be another imaging element such as a CCD (Charge Coupled Device) type image sensor.
The image sensor 3 has, as a light receiving part on the front surface 3a side, a pixel region 12 including a large number of pixels 11 formed in a predetermined array such as, for example, a Bayer array, and a region around the pixel region 12 is a peripheral region. A predetermined peripheral circuit is formed in the peripheral region. The pixels 11 each have a photodiode as a photoelectric conversion part having a photoelectric conversion function and a plurality of pixel transistors.
On the front surface 3a side of the image sensor 3, color filters and on-chip lenses are formed on the semiconductor substrate in such a manner as to correspond to the respective pixels 11 through an anti-reflection film including an oxide film or the like, a flattened film including an organic material, and the like. Light incident on the on-chip lens is received by the photodiode through the color filter, the flattened film, and the like. It should be noted that the configuration of the image sensor 3 according to the present technique is not particularly limited.
The glass 4 is an example of a transparent member serving as an optical window and is provided on the image sensor 3 through the support part 6. The glass 4 has a rectangular plate-like outer shape with one plate surface as a front surface 4a and has substantially the same outer dimension as the image sensor 3 in plan view. The glass 4 is provided on the front surface 3a side of the image sensor 3 so as to substantially match the outer shape of the image sensor 3 in plan view and to be separated at a predetermined interval in parallel with the image sensor 3. The glass 4 has a front surface 4a that is an upper surface, a rear surface 4b that is the other plate surface on the opposite side and is a lower surface facing the image sensor 3, and four side surfaces 4c. The glass 4 is supported against the image sensor 3 by the support part 6 in a fixed state.
The glass 4 transmits various types of light incident from the front surface 4a side through an optical system such as a lens positioned above the glass 4. The light transmitted through the glass 4 reaches the light receiving surface of the image sensor 3 through the cavity 8. The glass 4 has a function of protecting the light receiving surface side of the image sensor 3. It should be noted that, as a transparent member according to the present technique, for example, a plastic plate, a silicon plate that transmits only infrared light, or the like can be used instead of the glass 4.
In the present embodiment, the glass 4 has an outer shape slightly larger than the image sensor 3 in plan view. That is, the glass 4 has an outer dimension with a little larger size than the image sensor 3 in plan view and is provided so as to position its four rectangular edges outside four edges of the image sensor 3. However, the size relation between the glass 4 and the image sensor 3 is not particularly limited.
The support part 6 is interposed between the image sensor 3 and the glass 4 and is bonded in a state where they are separated from each other, so that the cavity 8 that is a sealed space is formed between the image sensor 3 and the glass 4. The support part 6 is provided in the peripheral region so as to surround the pixel region 12 on the front surface 3a of the image sensor 3. The lower side of the support part 6 is connected to the front surface 3a of the image sensor 3, and the upper side thereof is connected to the rear surface 4b of the glass 4. The support part 6 functions as a sealing part for hermetically sealing the periphery of the cavity 8, and blocks, together with the glass 4, the intrusion of moisture (water vapor), dust, or the like from the outside into the cavity 8.
The support part 6 is provided over the whole circumference along the outer shape of each of the image sensor 3 and the glass 4 in plan view and is formed with no ends so as to form a rectangular frame in plan view. The support part 6 is provided at a position within the range of the outer shape of the glass 4 so as to follow the outer edge of the glass 4 in plan view. The support part 6 is provided at a position slightly inside the side surfaces 4c of the glass 4. However, the support part 6 may be provided such that the outer surface thereof is substantially flush with the side surfaces 4c of the glass 4.
The support part 6 is formed including an insulating material. Specifically, the material forming the support part 6 is, for example, a photosensitive adhesive such as a UV (ultraviolet) curable resin that is an acrylic resin, a thermosetting resin such as an epoxy resin, or a mixture thereof. The support part 6 is formed on the front surface 3a of the image sensor 3 by coating with a dispenser, patterning using photolithography, or the like. It should be noted that the support part according to the present technique is not limited to those including resin, and may be provided by pasting, for example, a structure including an inorganic material such as ceramics such as glass, metal, or silicon to the image sensor 3 and the glass 4 with an adhesive or the like.
The bonding wire 7 is a conductive wire for electrically connecting the substrate 2 and the image sensor 3 to each other. The bonding wire 7 is, for example, a thin metal wire including Au (gold), Cu (copper), Al (aluminum), or the like. The bonding wire 7 electrically connects a lead terminal 13 formed on the front surface 2a of the substrate 2 to an electrode pad 14 formed on the front surface 3a of the image sensor 3 as a terminal for transmitting and receiving signals to/from the outside.
A plurality of lead terminals 13 is formed on the front surface 2a of the substrate 2 in a predetermined array at regions outside the mounting part of the image sensor 3 and receives connection on the one end sides of the bonding wires 7. A plurality of electrode pads 14 is formed on the front surface 3a of the image sensor 3 in a predetermined array at regions outside the support part 6 and receives connection on the other end sides of the bonding wires 7. The electrode pads 14 and connection parts of the bonding wires 7 to the electrode pads 14 are covered with the support part 6. However, the arrangement positions of the electrode pads 14 and the support part 6 are not particularly limited.
As the material of the lead terminals 13 and the electrode pads 14, for example, an aluminum material or the like is used. Specifically, the lead terminals 13 and the electrode pads 14 are formed by coating a layer part of, for example, copper (Cu), tungsten (W), titanium (Ti), or the like with a plating layer of nickel (Ni) and a plating layer of gold (Au). The lead terminals 13 and the electrode pads 14 are formed by appropriately using plating, sputtering, printing, or other film forming methods.
The plurality of lead terminals 13 of the substrate 2 is electrically connected to a plurality of terminal electrodes formed on the rear surface 2b side of the substrate 2 through a predetermined wiring part formed in the substrate 2. Each terminal electrode is provided with a solder ball 15. For example, the solder balls 15 are formed in two-dimensional lattice point-like arrangement so as to follow the rectangular outer shape of the image sensor 3 and configure BGA (ball grid array). The solder balls 15 serve as terminals for making an electrical connection to the circuit substrate on which the imaging device 1 is mounted in an electronic apparatus on which the imaging device 1 is mounted.
In the imaging device 1 having the above configuration, light transmitted through the glass 4 passes through the inside of the cavity 8 and is received and detected by a light receiving element configuring each pixel 11 arranged in the pixel region 12 of the image sensor 3.
The sealing resin part 5 is formed around the image sensor 3 and the glass 4 on the peripheral part of the substrate 2. The sealing resin part 5 is a resin part that covers the bonding wires 7 and the connection parts of the bonding wires 7 to the substrate 2. That is, the periphery of the bonding wires 7 that is outside the cavity 8 on the substrate 2 is covered and sealed with the sealing resin part 5.
The sealing resin part 5 covers and seals the whole circumference around the image sensor 3 and the glass 4 on the substrate 2. Specifically, the sealing resin part 5 entirely covers the peripheral part of the front surface 2a of the substrate 2 on which the lead terminals 13 are formed, the side surfaces 3c of the image sensor 3, the side surfaces on the outer side of the support part 6, and the peripheral part of the rear surface 4b and the side surfaces 4c of the glass 4, in a state where parts of the bonding wires 7 extending outward from the support part 6 are embedded.
The sealing resin part 5 is formed in a frame shape along the rectangular outer shape of the substrate 2 in plan view and has four side parts 5a along the respective sides of the rectangular outer shape of the substrate 2 as depicted in
The sealing resin part 5 is formed by curing a resin material around the image sensor 3 on the substrate 2 and the glass 4 in a configuration in which the image sensor 3 is mounted on the substrate 2, these are connected to each other by the bonding wires 7, and the glass 4 is mounted on the image sensor 3 through the support part 6. The sealing resin part 5 is formed into a predetermined shape by injection molding using, for example, a molding mold. However, the sealing resin part 5 may be a part formed by a potting process using, for example, a dispenser. In this case, the resin material serving as the sealing resin part 5 is applied to a predetermined region while being discharged from the nozzle of the dispenser, and then cured to form the sealing resin part 5.
The material of the sealing resin part 5 is, for example, a thermosetting resin containing silicon oxide as a main component or a filler such as alumina. As the resin material for forming the sealing resin part 5, for example, a thermosetting resin such as a phenolic resin, a silicon-based resin, an acrylic resin, an epoxy resin, a urethane resin, a silicon resin, or a polyetheramide resin, a thermoplastic resin such as polyamide-imide, polypropylene, or liquid crystal polymer, a photosensitive resin such as a UV curable resin that is an acrylic resin, rubber, and other known resin materials are used singly or in combination. In addition, the sealing resin part 5 may be a part formed including a resin material in a liquid state at normal temperature by compression molding or the like. It should be noted that the sealing resin part 5 has an insulating property.
In the present embodiment, the sealing resin part 5 is formed including a material having a light shielding property. Specifically, as a material of the sealing resin part 5, a black resin material containing a black pigment such as carbon black or titanium black is used. Accordingly, the sealing resin part 5 becomes a black part, and the sealing resin part 5 can function as a light shielding part.
As described above, the sealing resin part 5 provided at the peripheral part on the substrate 2 in the imaging device 1 has a protrusion part 20. The protrusion part 20 is formed as a part of the sealing resin part 5 by, for example, injection molding, and an upper surface 21 is positioned above the front surface 4a of the glass 4 in the vertical direction that is the plate thickness direction of the substrate 2. That is, the protrusion part 20 is a part in the sealing resin part 5 protruding upward from the front surface 4a of the glass 4.
The upper surface 21 of the protrusion part 20 is a surface perpendicular to the vertical direction. The protrusion part 20 is positioned on a common horizontal virtual plane Al. The protrusion part 20 has a constant or substantially constant protrusion height h1 from the front surface 4a of the glass 4.
The protrusion part 20 is formed so as to surround the whole circumference of the glass 4 along the plan view outer shape of the sealing resin part 5. Thus, the protrusion part 20 has four side parts 20a along the rectangular outer shape of the glass 4 in plan view and is formed in a frame shape in plan view by these side parts 20a (see
The protrusion part 20 is formed at a position slightly outside the four side surfaces 4c of the glass 4. Thus, the protrusion part 20 has an inner peripheral-side upper surface part 22 that is continuous with the front surface 4a of the glass 4 in such a manner as to be flush therewith and an inner surface part 23 that is an opposite surface of each of the four side surface parts 5c in the sealing resin part 5. However, it is not necessary to form the inner peripheral-side upper surface part 22.
Regarding the dimension of the protrusion part 20, the protrusion height h1, which is the dimension between the front surface 4a of the glass 4 and the upper surface 21 of the protrusion part 20, in the vertical direction is, for example, 10 to 200 μm. It should be noted that the thickness of the glass 4 is approximately 400 μm to 500 μm, as an example.
In addition, regarding the dimension of the protrusion part 20, the width w1 of each side part 20a of the protrusion part 20 is, for example, 100 μm or more. Thus, the width w1 of the side part 20a is, for example, a value within the range of 100 to 150 μm, a value within the range of 100 to 200 μm, a value within the range of 100 to 250 μm, or a value within the range of 100 to 300 μm. It should be noted that, as the chip size of the imaging device 1, one side of the square has, for example, 6 to 10 mm.
An example of a manufacturing method of the imaging device 1 according to the first embodiment of the present technique will be described with reference to
In the manufacturing method of the imaging device 1, first, a step of preparing the substrate 2 is performed. The substrate 2 is obtained, for example, by dicing and singulating a substrate member in which a plurality of substrate parts serving as the substrate 2 in the imaging device 1 is two-dimensionally connected. The plurality of lead terminals 13 is formed on the front surface 2a of the substrate 2.
In addition, a step of preparing the image sensor 3 as an imaging element mounted on the substrate 2 is performed. On the front surface 3a of the image sensor 3, the plurality of electrode pads 14 is formed through plating or the like.
In addition, a step of preparing the glass 4 as a transparent member mounted on the image sensor 3 is performed. The glass 4 is obtained, for example, by cutting a glass plate having a predetermined shape into a rectangular shape by dicing.
Subsequently, an assembly step is performed. In the assembly step, as depicted in
Next, as depicted in
Next, a step of providing the glass 4 on the image sensor 3 through the support part 6 is performed. Specifically, first, as depicted in
Next, as depicted in
Subsequently, as depicted in
As the protective sheet 40, for example, a sheet having adhesiveness and heat resistance such that the covering state of the front surface 4a for the glass 4 can be maintained in injection molding for forming the sealing resin part 5 is used. In addition, as the protective sheet 40, a sheet having a thickness equal to the dimension of the protrusion height h1 (see
An example of the structure of the protective sheet 40 will be described. As depicted in
A predetermined material for forming the base material 41 is, for example, an organic-based film material. Specifically, for example, PET (polyethylene terephthalate) is used as a material of the base material 41. As a material of the adhesive layer 42, a material that can adhere to the base material 41 and can easily clean, even in a case where a glue residue (residue of an adhesive) occurs on the glass 4 as an adherend, the residue with an organic solvent or the like is used. Specifically, for example, an acrylic resin adhesive is used as a material of the adhesive layer 42.
In the present embodiment, the base material 41 is assumed to be formed by PET, and the adhesive layer 42 is assumed to be formed by an acrylic resin adhesive. However, the layer structure of the protective sheet 40 and the material of each layer are not limited. For example, in a case where the material of the adhesive layer 42 is a thermosetting resin, a step of curing the adhesive layer 42 is performed to fix the protective sheet 40 to the front surface 4a of the glass 4. In addition, the protective sheet 40 may have a single layer or a laminated structure of three or more layers.
As described above, the steps including the step of providing the glass 4 on the image sensor 3 and the step of pasting the protective sheet 40 to the front surface 4a of the glass 4 are the step of providing, on the image sensor 3 through the support part 6, the glass 4 with the front surface 4a covered with the protective sheet 40.
It should be noted that a method of mounting, on the image sensor 3, the glass 4 with the protective sheet 40 pasted to the front surface 4a in advance may be used. In this case, in the step of preparing the glass 4, the glass 4 with the protective sheet 40 is prepared. For example, the glass 4 with the protective sheet 40 is obtained in such a manner that the protective sheet is wholly pasted to the front surface of a glass plate in a wafer state before being singulated into the glass 4 in a chip state and the glass plate is then singulated together with the protective sheet. Here, as the protective sheet to be pasted to the front surface of the glass plate in a wafer state, the two-layer structure of the base material 41 formed by PET and the adhesive layer 42 of an acrylic resin adhesive as described above, or, for example, a DAF material (DAF: die attach film) used for bonding a semiconductor chip to a substrate, or the like can be used.
In a case where the glass 4 with the protective sheet 40 is used, the step of providing, on the image sensor 3 through the support part 6, the glass 4 with the front surface 4a covered with the protective sheet 40 is as follows. That is, after the rib resin 31 is applied onto the front surface 3a of the image sensor 3 as depicted in
As depicted in
As depicted in
The mold 50 is a transfer mold and has a pot (not depicted) in which a tablet that is a solid resin of a molding material is set, and a plunger (not depicted) driven in the pot. The space in the pot communicates with the cavity 53 through a gate or the like serving as a passage for the resin material.
The molding surface 51a of the upper mold 51 is wholly covered with a film 55 formed by an elastic or plastic material. The film 55 is what is generally called a release film, and is, for example, automatically supplied from a supply device attached to the mold 50 and comes into close contact with the molding surface 51a of the upper mold 51 by vacuum suction or the like. For example, the film 55 is peeled off from the molding surface of the upper mold 51 each time the mold 50 is opened and the molded article is taken out, and is supplied for each shot of injection molding. According to the film 55, a resin material 5X forming the sealing resin part 5 is prevented from adhering to the molding surface 51a of the upper mold 51. The thickness of the film 55 is, for example, approximately 200 μm.
A workpiece subjected to the formation of the sealing resin part 5 is set to such a mold 50. It should be noted that the workpiece has the configuration depicted in
After the workpiece is set to the mold 50, the mold 50 becomes a mold closed state (mold clamped state), so that the cavity 53 is formed. In the mold closed state of the mold 50, the workpiece becomes a clamped state in which it is vertically sandwiched between the lower mold 52 and the upper mold 51. In the mold closed state of the mold 50, the film 55 is pressed against the protective sheet 40 on the glass 4, and the protective sheet 40 comes into close contact with the film 55. That is, the protective sheet 40 is pressed against the molding surface 51a of the upper mold 51 from an upper surface 40a side through the film 55. Accordingly, the protective sheet 40 is compressed in the thickness direction according to the thickness thereof and slightly expanded in the surface direction.
As depicted in
When the filling of the resin material 5X into the cavity 53 is completed, the resin material 5X is cured by performing a predetermined process such as heating or cooling the resin material 5X. Accordingly, a resin part serving as the sealing resin part 5 is formed. Thereafter, the clamp by the mold 50 is released, the mold 50 is opened, and the workpiece subjected to injection molding is taken out.
As depicted in
As depicted in
By removing the protective sheet 40, the front surface 4a of the glass 4 whose periphery is surrounded by the sealing resin part 5 is exposed. Then, in the sealing resin part 5, the part surrounding the periphery of the protective sheet 40 serves as the protrusion part 20. That is, the horizontal molding surface 51a is filled with the resin material 5X above the front surface 4a of the glass 4 by the thickness of the protective sheet 40, and the part above the front surface 4a of the glass 4 serves as the protrusion part 20 in the sealing resin part 5. Thus, the protrusion height h1 (see
In a state where the protective sheet 40 is removed, the glass 4 and the sealing resin part 5 form a recess part having the front surface 4a of the glass 4 and the inner peripheral-side upper surface part 22 as a bottom surface part and the four inner surface parts 23 as side surfaces. In the injection molding, the peripheral part of the lower surface 40b of the protective sheet 40 serves as a surface forming the inner peripheral-side upper surface part 22, and the side surfaces 40c of the protective sheet 40 serve as surfaces forming the inner surface parts 23.
Then, as depicted in
By the manufacturing process as described above, the imaging device 1 as depicted in
In the manufacturing method of the imaging device 1 as described above, a sheet having the following configuration is used as the protective sheet 40 pasted to the glass 4. As depicted in
The recess part 46 is a curved recess part with respect to a rectangular virtual outer shape V1 corresponding to the outer shape of the glass 4 in plan view. The recess part 46 is formed in the middle part excluding both ends in each side part 45 of the protective sheet 40. The recess part 46 is formed so as to form, for example, an arc shape.
The protective sheet 40 has a shape constricted by the recess parts 46 on four sides facing each other in the longitudinal direction (the lateral direction in
The protective sheet 40 is formed such that a recess amount D1 of the recess part 46 with respect to a virtual straight line V1a that is each side of the virtual outer shape V1 has a predetermined dimension. The recess amount D1 is a distance between each virtual straight line V1a and a vertex P1 positioned in the center of the recess part 46 in each direction of the longitudinal direction and the short-length direction of the protective sheet 40.
The recess amount D1 of the recess part 46 can be determined on the basis of, for example, the layer thickness T2 (see
In addition, the recess amounts D1 on the long side and the short side of the protective sheet 40 may be different from each other. Specifically, for example, the recess amount D1 of the recess part 46 (46B) on the short side of the protective sheet 40 may be set longer than the recess amount D1 of the recess part 46 (46A) on the long side. In addition, the shape of the recess part 46 is not limited to an arc shape, and is only required to be a shape in which the protective sheet 40 is constricted in the longitudinal direction and the short-length direction as a pair of recess parts 46 of the protective sheet 40 facing each other in the longitudinal direction or the short-length direction.
The R-shaped part 48 is a rounded shape part formed to have an arc-shaped curve with respect to the right-angled corner part in the virtual outer shape V1. The protective sheet 40 is formed such that a curvature radius R1 of the arc formed by the R-shaped part 48 becomes a predetermined value.
The curvature radius R1 of the R-shaped part 48 is set to a value of, for example, approximately 0.2 mm. However, the magnitude of the curvature radius R1 is not particularly limited. In addition, the curvature radiuses R1 of the four corner parts 47 in the protective sheet 40 may be different in magnitude for each corner part 47.
In the present embodiment, the protective sheet 40 has the recess parts 46 and the R-shaped parts 48, and the protective sheet 40 may be only required to have at least any one of the recess parts 46 and the R-shaped parts 48. In addition, the recess parts 46 may be formed only on a part of the side parts 45 among the four side parts 45 of the protective sheet 40, such as, for example, being formed only on a set of side parts 45 facing each other in the protective sheet 40. In addition, the R-shaped parts 48 may be formed only at a part of the corner parts 47 among the four corner parts 47 of the protective sheet 40.
According to the imaging device 1 and the manufacturing method thereof according to the present embodiment as described above, it is possible to suppress the occurrence of scratches and stains on the glass 4 provided so as to cover the image sensor 3 from the front surface 3a side and to stabilize the manufacturing yield. Since the imaging device 1 has the protrusion part 20 in the sealing resin part 5, the protrusion part 20 can be a part subjected to the suction action by the collet when being picked up by the collet, so that it is possible to suppress the occurrence of scratches and stains on the glass 4 by the collet.
For example, as depicted in
Therefore, as depicted in
As depicted in
Therefore, as depicted in
Thus, it is possible to prevent the suction surface 61a of the collet 60 from interfering with the glass 4. Accordingly, it is possible to suppress scratching of the glass 4 caused by interference of the collet 60 and contamination of the glass 4 by stains of the collet 60 adhering to the glass 4, and as a result, the manufacturing yield can be stabilized or improved.
In addition, according to the imaging device 1, a flat collet such as the collet 60 depicted in
Regarding the dimension of the protrusion part 20 of the sealing resin part 5, the dimension of the protrusion height h1 (see
In addition, if the protrusion height h1 of the protrusion part 20 exceeds 200 μm, the shrinkage stress of the sealing resin part 5 increases, and the shrinkage stress may cause an adverse effect on other configurations configuring the imaging device 1. In addition, if the protrusion height h1 of the protrusion part 20 exceeds 200 μm, the amount of the resin material forming the sealing resin part 5 increases, and thus there is a problem of increasing the cost.
In addition, if the protrusion height h1 of the protrusion part 20 exceeds 200 μm, the protrusion part 20 existing around the glass 4 becomes high, and thus, the incident light to the glass 4 easily hits the protrusion part 20. In a case where the incident light hits the inner surface part 23 of the protrusion part 20, the reflected light from the inner surface part 23 enters the image sensor 3, and thus, there is a possibility that the flare is generated or deteriorated. In addition, if the protrusion part 20 becomes high, there is a possibility of causing a problem that the incident light to the image sensor 3 is blocked by the protrusion part 20.
In addition, regarding the dimension of the protrusion part 20 of the sealing resin part 5, the width w1 (see
In addition, the manufacturing method of the imaging device according to the present embodiment includes the step of providing, on the upper side of the image sensor 3, the glass 4 with the front surface 4a covered with the protective sheet 40 in the step of injection molding for forming the sealing resin part 5. That is, the manufacturing method according to the present embodiment uses the protective sheet 40 covering the front surface 4a of the glass 4 to form the protrusion part 20 in the sealing resin part 5.
According to such a manufacturing method, by using the protective sheet 40, it is not necessary to form the mold in a complicated shape in order to form the protrusion part 20 in the sealing resin part 5, and the protrusion part 20 can be formed by using the existing mold having the flat molding surface 51a. Accordingly, the manufacturing cost of the imaging device 1 can be suppressed.
In addition, by using the protective sheet 40, it is possible to suppress the occurrence of stains and scratches on the front surface 4a of the glass 4 by injection molding for forming the sealing resin part 5. Accordingly, it is possible to stabilize the manufacturing yield. In addition, by using the protective sheet 40, the resin material can be dammed by the protective sheet 40 in injection molding, and it is possible to suppress the occurrence of burrs due to riding of the resin material on the front surface 4a of the glass 4. That is, it is possible to suppress the occurrence of burrs and bleeds caused by the infiltration of the resin material between the front surface 4a of the glass 4 and the film 55 on the upper mold 51 side due to variations in the flatness of the glass 4 or the like in a case where the protective sheet 40 is not used. In addition, by using the protective sheet 40 that is peeled off and removed in the manufacturing process, even in a case where burrs or the like occur on the protective sheet 40, it is possible to remove the burrs or the like together with the protective sheet 40 at the same time when the protective sheet 40 is peeled off. In addition, by using the protective sheet 40, damage to the glass 4 or the like caused by the clamping pressure of the mold 50 can be avoided. Thus, the manufacturing yield can be stabilized even by enabling suppression of the occurrence of burrs and the like and avoidance of damage to the glass 4 or the like as described above.
In addition, the manufacturing method of the imaging device according to the present embodiment includes the step of removing the protective sheet 40 after the step of injection molding for forming the sealing resin part 5 using the protective sheet 40 as a film-like member. According to such a manufacturing method, the front surface 4a of the glass 4 can be maintained in a clean state, and the performance of the imaging device 1 can be secured.
In addition, the manufacturing method of the imaging device according to the present embodiment uses the protective sheet 40 having the recess parts 46 formed on the four side parts 45 and the R-shaped parts 48 formed at the four corners. According to such a manufacturing method, for the protective sheet 40 that is compressed in the thickness direction by clamping the workpiece to the mold 50 and becomes a collapsed state, the shape of the mold 50 after deformation by clamping can be approximated to a rectangular shape corresponding to the shape of the glass 4 in plan view.
Specifically, as depicted in
Therefore, according to the protective sheet 40 having the shape in plan view as depicted in
In addition, the recess amount D1 of the recess part 46 is preferably within the range of 0.7 to 1.3 times the layer thickness T2 of the adhesive layer 42. Accordingly, the shape of the protective sheet 40 in the deformed state by clamping of the mold 50 can effectively be approximated to a rectangular shape (virtual outer shape V1). In addition, by allowing the curvature radius R1 of the R-shaped part 48 to be approximately 0.2 mm, the shape of the protective sheet 40 in the deformed state can effectively be approximated to a rectangular shape.
In addition, the manufacturing method of the imaging device according to the present embodiment uses a two-layer structure of the base material 41 and the adhesive layer 42 as the protective sheet 40. According to such a manufacturing method, the protective sheet 40 can have a simple and inexpensive configuration.
In particular, as a preferred configuration of the protective sheet 40, a configuration in which the material of the base material 41 is PET and the material of the adhesive layer 42 is an acrylic resin adhesive is employed. Accordingly, it is possible to obtain excellent adhesion of the adhesive layer 42 to the base material 41, and to easily and safely clean the adhesive layer 42 remaining on the front surface 4a of the glass 4 after peeling off the protective sheet 40 by using an organic solvent. That is, it is possible to obtain excellent adhesiveness and removability of the protective sheet 40 to the front surface 4a of the glass 4.
A configuration example of an imaging device 71 according to a second embodiment of the present technique will be described with reference to
As depicted in
The glass covering part 25 is a part of the protrusion part 20 that extends inward along the front surface 4a of the glass 4 while maintaining the height of the upper surface 21 from the main body part of the protrusion part 20. The dimension (thickness) of the glass covering part 25 in the vertical direction is constant or substantially constant as a whole.
The glass covering part 25 is formed over the whole circumference of the edge part of the front surface 4a of the glass 4 along the outer shape of the glass 4 in plan view. Thus, the glass covering part 25 has four side parts 25a along the outer shape of the glass 4 in plan view and is formed in a frame shape in plan view by these side parts 25a (see
The glass covering part 25 is formed in a region outside the pixel region 12 so as not to overlap the pixel region 12 of the image sensor 3 in plan view. That is, the glass covering part 25 is formed such that the end surface 25c on the inner peripheral side is positioned outside the pixel region 12.
An example of a manufacturing method of the imaging device 71 according to the second embodiment will be described with reference to
In the manufacturing method of the imaging device 71, as in the case of the first embodiment, die bonding and wire bonding are performed (see
In the present embodiment, as depicted in
Next, as depicted in
After the step of forming the sealing resin part 5, a step of removing the protective sheet 40 is performed as depicted in
According to the imaging device 71 of the second embodiment, in addition to the effect obtained by the first embodiment, the following effect can be obtained. That is, with a configuration in which the protrusion part 20 of the sealing resin part 5 has the glass covering part 25 covering the glass 4, the sealing resin part 5 can have a function as a light shielding film for cutting unnecessary light.
Thus, in the configuration having the glass covering part 25, the sealing resin part 5 is preferably formed by a material having a light shielding property such as a black resin material containing a black pigment. By allowing the sealing resin part 5 to have a function as a light shielding film by the glass covering part 25, a light shielding function can be obtained in the glass 4 without using, for example, a glass with a relatively expensive light shielding film. Accordingly, the member cost can be suppressed.
A configuration example of an imaging device 81 according to a third embodiment of the present technique will be described with reference to
As depicted in
The sealing resin receiving part 82 is provided at the edge part on the front surface 4a of the glass 4 and is in contact with the protrusion part 20 at an outer surface 83 that is an outer side surface. The sealing resin receiving part 82 is formed over the whole circumference of the edge part of the front surface 4a of the glass 4 along the outer shape of the glass 4 in plan view. Thus, the sealing resin receiving part 82 has four side parts 82a along the outer shape of the glass 4 in plan view and is formed in a frame shape in plan view by these side parts 82a (see
The sealing resin receiving part 82 has, for example, a rectangular transverse cross-sectional shape at each side part 82a. In a case where the transverse cross-sectional shape of each side part 82a is rectangular, the sealing resin receiving part 82 has the outer surface 83, an inner surface 84 that is a side surface on the opposite side (inner side) of the outer surface 83, an upper surface 85, and a lower surface 86 that a contact surface with the front surface 4a of the glass 4. The upper surface 85 of the sealing resin receiving part 82 is flush with the upper surface 21 of the sealing resin part 5.
The sealing resin receiving part 82 is formed in a region outside the pixel region 12 so as not to overlap the pixel region 12 of the image sensor 3 in plan view. That is, the sealing resin receiving part 82 is formed such that the inner surface 84 is positioned outside the pixel region 12.
In the examples depicted in
The material for forming the sealing resin receiving part 82 is not particularly limited, and is, for example, a photosensitive adhesive such as a UV (ultraviolet) curable resin that is an acrylic resin, a thermosetting resin such as an epoxy resin, or a mixture thereof. In addition, the material for forming the sealing resin receiving part 82 is preferably a material having a light shielding property such as a black resin material containing a black pigment such as carbon black. The sealing resin receiving part 82 is formed on the front surface 4a of the glass 4 by coating with a dispenser, patterning through photolithography, or the like.
In addition, the sealing resin receiving part 82 may be formed by pasting the protective sheet 40 used in the first embodiment and the like to the front surface 4a of the glass 4 as a frame shape. It should be noted that the sealing resin receiving part 82 is not limited to those including resin, and may be provided by pasting, for example, a structure including ceramics such as glass or an inorganic material such as metal or silicon to the glass 4 with an adhesive or the like.
An example of a manufacturing method of the imaging device 81 according to the third embodiment will be described with reference to
In the manufacturing method of the imaging device 81, as in the case of the first embodiment, die bonding and wire bonding are performed (see
Thereafter, as depicted in
Next, a step of curing the rib resin 82X on the front surface 4a of the glass 4 is performed. In a case where the rib resin 82X has thermosetting property, a heating step (cure) for curing the rib resin 82X is performed in a state where the rib resin 82X is applied to the front surface 4a of the glass 4. When the rib resin 82X is cured, the sealing resin receiving part 82 is formed on the glass 4 by the rib resin 82X.
The sealing resin receiving part 82 is formed at a region slightly inside the edge of the front surface 4a of the glass 4. Therefore, the exposed part 4d is present on the front surface 4a of the glass 4 outside the sealing resin receiving part 82, and the exposed part 4d serves as a formation region of the glass covering part 25. However, the sealing resin receiving part 82 may be provided at the edge of the front surface 4a of the glass 4 such that the exposed part 4d of the front surface 4a of the glass 4 is not present outside the sealing resin receiving part 82. In addition, a portion on the front surface 4a of the glass 4 inside the sealing resin receiving part 82 is exposed.
As the sealing resin receiving part 82, for example, a sheet having heat resistance such that the fixing state to the front surface 4a of the glass 4 can be maintained in injection molding for forming the sealing resin part 5 is used. In addition, as the sealing resin receiving part 82, a sheet having a thickness equal to the dimension of the protrusion height h1 (see
As described above, the steps including the step of providing the glass 4 on the image sensor 3 and the step of providing the sealing resin receiving part 82 on the front surface 4a of the glass 4 are the step of providing, on the image sensor 3 through the support part 6, the glass 4 with the peripheral edge part of the front surface 4a covered with the sealing resin receiving part 82.
It should be noted that a method of mounting, on the image sensor 3, the glass 4 with the sealing resin receiving part 82 provided on the front surface 4a in advance may be used. In this case, in the step of preparing the glass 4, the glass 4 with the sealing resin receiving part 82 is prepared. For example, the glass 4 with the sealing resin receiving part 82 is obtained in such a manner that, on the front surface of a glass plate in a wafer state before being singulated into chip-shaped glasses, the sealing resin receiving part 82 is provided for each region corresponding to each glass 4 and the glass plate is then singulated.
In a case where the glass 4 with the sealing resin receiving part 82 is used, the step of providing, on the image sensor 3 through the support part 6, the glass 4 with the peripheral edge part of the front surface 4a covered with the sealing resin receiving part 82 is as follows. That is, after the rib resin 31 is applied onto the front surface 3a of the image sensor 3 (see
Next, as depicted in
After the step of forming the sealing resin part 5 is performed, the workpiece taken out from the mold 50 has a configuration having the sealing resin part 5 including the protrusion part 20 and the sealing resin receiving part 82 as depicted in
According to the imaging device 81 of the third embodiment and the manufacturing method thereof, in addition to the effects obtained by the first embodiment and the second embodiment, the following effect can be obtained. That is, by using the sealing resin receiving part 82 as a protective material provided on the front surface 4a of the glass 4 in order to form the protrusion part 20, the step of removing the protective material after forming the sealing resin part 5 can be omitted. Accordingly, the steps can be simplified.
In addition, with the configuration having the sealing resin receiving part 82, the sealing resin receiving part 82 can have a function as a light shielding film for cutting unnecessary light. Thus, the sealing resin receiving part 82 is preferably formed by a material having a light shielding property such as a black resin material containing a black pigment. By allowing the sealing resin receiving part 82 to have a function as a light shielding film, a light shielding function can be obtained in the glass 4 without using, for example, a glass with a relatively expensive light shielding film. Accordingly, the member cost can be suppressed.
A fourth embodiment of the present technique will be described with reference to
In the manufacturing method of the imaging device 1 of the present embodiment, in the step of forming the sealing resin part 5, a liquid resin 5Y that is a resin material in a liquid state at normal temperature is used as a resin material for forming the sealing resin part 5. As the liquid resin 5Y, for example, a resin such as a UV (ultraviolet) curable resin or a thermosetting resin that can be cured by post-treatment is used.
As depicted in
The upper mold 91 has a rectangular recess part 91a for holding a workpiece 97 on the molding surface side. The recess part 91a has a shape and a dimension substantially the same as those of the substrate 2 in terms of the outer shape in plan view and has a depth substantially the same as the thickness of the substrate 2. The workpiece 97 is held under suction by the upper mold 91 in a state where the substrate 2 is fitted into the recess part 91a. In the upper mold 91, an intake passage opened against the recess part 91a is provided, and the suction action by a suction device, which is not depicted, is obtained. The periphery of the recess part 91a is a flat mold alignment surface 91b with respect to the lower mold 92.
The lower mold 92 has a rectangular recess part 92a at a position opposite to the recess part 91a of the upper mold 91 on the molding surface side. The recess part 92a has a shape and a dimension substantially the same as those of the recess part 91a of the upper mold 91 in terms of the outer shape in plan view and has a depth substantially the same as the height of the sealing resin part 5. The periphery of the recess part 92a is a flat mold alignment surface 92b with respect to the upper mold 91.
The recess part 92a and the mold alignment surface 92b of the lower mold 92 are wholly covered with a buffer sheet 95 formed by an elastic or plastic material. The buffer sheet 95 functions as a buffer member and a release film, is automatically supplied from, for example, a supply device attached to the mold 90, and comes into close contact with the recess part 92a and the mold alignment surface 92b of the lower mold 92 by vacuum suction or the like. For example, the buffer sheet 95 is peeled off from the molding surface of the lower mold 92 each time the mold 90 is opened and the molded article is taken out and is supplied for each shot of injection molding. According to the buffer sheet 95, the liquid resin 5Y forming the sealing resin part 5 is prevented from adhering to the recess part 92a and the mold alignment surface 92b of the lower mold 92. The thickness of the buffer sheet 95 is, for example, approximately 200 μm.
The manufacturing method of the imaging device 1 according to the present embodiment is performed by the following procedure. First, as depicted in
Next, as depicted in
Next, as depicted in
Then, in the mold clamping state of the mold 90, as depicted in
After the mold clamping of the mold 90 is performed, a step of curing the liquid resin 5Y by UV irradiation, heating, or the like is performed, and the sealing resin part 5 is formed. Thereafter, the mold 90 is opened, and the workpiece 97 subjected to injection molding is taken out.
As depicted in
Thereafter, a step of removing the protective sheet 40 is performed. In this step, for example, as depicted by the two-dot chain lines in
When the protective sheet 40 is removed, as depicted in
According to the manufacturing method of the imaging device of the fourth embodiment, since a resin material in a liquid state at normal temperature can be used as a material of the sealing resin part 5, it is possible to use a resin material having a physical property that is difficult to obtain with a solid resin such as a tablet used in, for example, injection molding. Specifically, as a material of the sealing resin part 5, it is possible to use a resin having physical properties such as low elasticity, low Tg (Tg: glass transition temperature), and transparency.
In addition, according to the manufacturing method of the imaging device of the fourth embodiment, the level difference G1 can be formed between the upper surface 40a of the protective sheet 40 and the upper surface 21 of the sealing resin part 5. Accordingly, since the protective sheet 40 can easily be peeled off, an excellent peeling property of the protective sheet 40 can be obtained, and the step of removing the protective sheet 40 can easily be performed.
An example of application of the imaging device according to the above-described embodiments to an electronic apparatus will be described with reference to
The imaging device (solid-state imaging device) according to the present technique can be applied to an electronic apparatus in general that uses a solid-state imaging element for an image capturing part (photoelectric conversion part), such as a camera device, such as a digital still camera or a video camera, a portable terminal device having an imaging function, or a copying machine that uses a solid-state imaging element for an image reading part. The imaging device may be of a configuration formed as a single chip or may be of a module-like configuration having an imaging function in which an imaging part and a signal processing part or an optical system are packaged together.
As depicted in
The optical part 202 includes a plurality of lenses, takes in incident light (image light) from an object, and forms an image on the imaging surface of the imaging device 201. The imaging device 201 converts the light quantity of the incident light formed on the imaging surface into an electric signal in pixel units by the optical part 202 and outputs it as a pixel signal.
The display part 205 includes, for example, a panel type display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel and displays a moving or still image captured by the imaging device 201. The recording part 206 records the moving or still image captured by the imaging device 201 on a recording medium such as a hard disk or a semiconductor memory.
The operation part 207 issues operation commands on various functions of the camera device 200 under the operation by the user. The power supply part 208 appropriately supplies various power sources as operating power sources for the DSP circuit 203, the frame memory 204, the display part 205, the recording part 206, and the operation part 207 to these supply targets.
According to the camera device 200 described above, regarding the imaging device 201, it is possible to suppress the occurrence of scratches and stains on the glass 4 provided so as to cover the image sensor 3 from the front surface 3a side, and to stabilize the manufacturing yield.
The description of the embodiments described above is an example of the present technique, and the present technique is not limited to the embodiments described above. Therefore, it is obvious that various changes can be made depending on the design and the like even in cases other than the embodiments described above, as long as the technical concept according to the present disclosure is not deviated. In addition, the effects described in the present disclosure are only illustrative and not limited, and there may be other effects. In addition, the configurations of each embodiment described above can appropriately be used in combination.
Note that the present technique can take the following configurations.
(1)
A semiconductor device including:
The semiconductor device according to (1) above,
The semiconductor device according to (1) above or (2) above,
The semiconductor device according to any one of (1) to (3) above,
The semiconductor device according to any one of (1) to (4) above,
An electronic apparatus including:
A manufacturing method of a semiconductor device, the method including:
The manufacturing method of a semiconductor device according to (7) above,
The manufacturing method of a semiconductor device according to (8) above,
The manufacturing method of a semiconductor device according to (8) above or (9) above,
The manufacturing method of a semiconductor device according to (8) above,
The manufacturing method of a semiconductor device according to (10) above or (11) above,
The manufacturing method of a semiconductor device according to any one of (7) to (12) above,
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-202008 | Dec 2021 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2022/040535 | 10/28/2022 | WO |
