containing also titanates

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CPC
H01G4/1245

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/1245containing also titanates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer capacitor including a rare earth element and zirconium
- Patent number 12,322,552
- Issue date Jun 3, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Je Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device, dielectric material, and manufacturing m...
- Patent number 12,266,475
- Issue date Apr 1, 2025
- Taiyo Yuden Co., Ltd.
- Yasuyuki Inomata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component including multilayer extern...
- Patent number 12,100,558
- Issue date Sep 24, 2024
- Murata Manufacturing Co., Ltd.
- Taisuke Kanzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-performance capacitor packaging for next generation power elec...
- Patent number 12,100,560
- Issue date Sep 24, 2024
- UT-Battelle, LLC
- Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 12,080,481
- Issue date Sep 3, 2024
- Taiyo Yuden Co., Ltd.
- Satoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant multilayer ceramic capacitors
- Patent number 12,040,135
- Issue date Jul 16, 2024
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic capacitor and method of producing the same prel...
- Patent number 12,020,870
- Issue date Jun 25, 2024
- Taiyo Yuden Co., Ltd.
- Yoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature transmission lines and related circuit components
- Patent number 11,990,266
- Issue date May 21, 2024
- nanoHenry, Inc.
- Osman Ersed Akcasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,972,900
- Issue date Apr 30, 2024
- Murata Manufacturing Co., Ltd.
- Yoshiyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor
- Patent number 11,942,278
- Issue date Mar 26, 2024
- TDK Corporation
- Michihiro Kumagae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer capacitor
- Patent number 11,929,211
- Issue date Mar 12, 2024
- TDK ELECTRONICS AG
- Thorsten Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and dielectric material
- Patent number 11,776,752
- Issue date Oct 3, 2023
- Taiyo Yuden Co., Ltd.
- Yasuhiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power capacitor for downhole electrocrushing drilling
- Patent number 11,746,599
- Issue date Sep 5, 2023
- Halliburton Energy Services, Inc.
- William M. Moeny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor having ultra-broadband performance
- Patent number 11,721,488
- Issue date Aug 8, 2023
- KYOCERA AVX Components Corporation
- Jeffrey A. Horn
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,721,489
- Issue date Aug 8, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,721,483
- Issue date Aug 8, 2023
- Taiyo Yuden Co., Ltd.
- Hideya Teraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor having a dielectric layer having a through hole...
- Patent number 11,676,767
- Issue date Jun 13, 2023
- TDK Corporation
- Yuuki Aburakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Label and related method
- Patent number 11,664,168
- Issue date May 30, 2023
- AVERY DENNISON RETAIL INFORMATION SERVICES LLC
- Mathieu De Backer
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Dielectric ceramic composition and ceramic capacitor using the same
- Patent number 11,646,156
- Issue date May 9, 2023
- KEMET Electronics Corporation
- Hanzheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component including multilayer extern...
- Patent number 11,636,982
- Issue date Apr 25, 2023
- Murata Manufacturing Co., Ltd.
- Taisuke Kanzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multilayer ceramic capacitor
- Patent number 11,621,127
- Issue date Apr 4, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant multilayer ceramic capacitors
- Patent number 11,621,126
- Issue date Apr 4, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic capacitor and method of producing the same
- Patent number 11,569,040
- Issue date Jan 31, 2023
- Taiyo Yuden Co., Ltd.
- Yoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a multi-layer ceramic electronic component
- Patent number 11,551,873
- Issue date Jan 10, 2023
- Taiyo Yuden Co., Ltd.
- Takayuki Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric composition and capacitor component using the same
- Patent number 11,551,871
- Issue date Jan 10, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Sung Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric material, method of preparing the same, and device compr...
- Patent number 11,538,632
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Hyeon Cheol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component including an insulating layer
- Patent number 11,538,634
- Issue date Dec 27, 2022
- Murata Manufacturing Co., Ltd.
- Shinobu Chikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device, mounting substrate, package body of cera...
- Patent number 11,532,434
- Issue date Dec 20, 2022
- Taiyo Yuden Co., Ltd.
- Atsushi Imai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20250210267
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyunjun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION FOR MULTILAYERED CERAMIC CAPACITOR,MULTILAYE...
- Publication number 20240249884
- Publication date Jul 25, 2024
- AMOTECH CO., LTD.
- Sung Jin HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIRAL INDUCTORS, TRANSFORMERS AND BALUNS FORMED FROM FLEXIBLE DIEL...
- Publication number 20240242874
- Publication date Jul 18, 2024
- nanoHenry, Inc.
- Osman Ersed Akcasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240096553
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Ryota ASO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL FOR A HIGH VOLTAGE CAPACITOR
- Publication number 20230395326
- Publication date Dec 7, 2023
- 3M Innovative Properties Company
- Gunther A.J. STOLLWERCK
- G01 - MEASURING TESTING
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20230317591
- Publication date Oct 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC DEVICE, DIELECTRIC MATERIAL, AND MANUFACTURING M...
- Publication number 20230298821
- Publication date Sep 21, 2023
- Taiyo Yuden Co., Ltd.
- Yasuyuki INOMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING MULTILAYER EXTERN...
- Publication number 20230215657
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Taisuke KANZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20230207203
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Je Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resonant Multilayer Ceramic Capacitors
- Publication number 20230187134
- Publication date Jun 15, 2023
- KEMET Electronics Corporation
- John Bultitude
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...
- Publication number 20230154681
- Publication date May 18, 2023
- Taiyo Yuden Co., Ltd.
- Yasuhiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
- Publication number 20230114467
- Publication date Apr 13, 2023
- Taiyo Yuden Co., Ltd.
- Satoshi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURE INDUCTORS AND RELATED CIRCUIT COMPONENT AND METHODS OF MA...
- Publication number 20230069135
- Publication date Mar 2, 2023
- nanoHenry, Inc.
- Osman Ersed Akcasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE CAPACITOR PACKAGING FOR NEXT GENERATION POWER ELEC...
- Publication number 20220375691
- Publication date Nov 24, 2022
- UT-Battelle, LLC
- Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CAPACITOR
- Publication number 20220336153
- Publication date Oct 20, 2022
- TDK Electronics AG
- Thorsten Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL, METHOD OF PREPARING THE SAME, AND DEVICE COMPR...
- Publication number 20220246353
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Hyeon Cheol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTCC Dielectric Compositions And Devices Having High Q Factors
- Publication number 20220135484
- Publication date May 5, 2022
- FERRO CORPORATION
- Peter Marley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Ceramic Composition and Ceramic Capacitor Using the Same
- Publication number 20220076886
- Publication date Mar 10, 2022
- Kemet Electronics Corporation
- Hanzheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND DIELECTRIC MATERIAL
- Publication number 20210383973
- Publication date Dec 9, 2021
- Taiyo Yuden Co., Ltd.
- Yasuhiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20210327648
- Publication date Oct 21, 2021
- MURATA MANUFACTURING CO., LTD.
- Taisuke KANZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20210272753
- Publication date Sep 2, 2021
- Murata Manufacturing Co., Ltd.
- Shinobu CHIKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LABEL AND RELATED METHOD
- Publication number 20210257163
- Publication date Aug 19, 2021
- Avery Dennison Retail Information Services, LLC
- Mathieu DE BACKER
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210233715
- Publication date Jul 29, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Dong Joon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210233716
- Publication date Jul 29, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Dong Joon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION AND ELECTRONIC DEVICE
- Publication number 20210202169
- Publication date Jul 1, 2021
- TDK Corporation
- Toshihiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Ceramic Capacitor Having Ultra-Broadband Performance
- Publication number 20210193392
- Publication date Jun 24, 2021
- AVX CORPORATION
- Jeffrey A. Horn
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Application
HIGH-POWER CAPACITOR FOR DOWNHOLE ELECTROCRUSHING DRILLING
- Publication number 20210180407
- Publication date Jun 17, 2021
- Halliburton Energy Services, Inc.
- William M. Moeny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
- Publication number 20210183573
- Publication date Jun 17, 2021
- TDK Corporation
- Toshihiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210151254
- Publication date May 20, 2021
- TAIYO YUDEN CO., LTD.
- Hideya TERAOKA
- H01 - BASIC ELECTRIC ELEMENTS

containing also titanates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer capacitor including a rare earth element and zirconium

Ceramic electronic device, dielectric material, and manufacturing m...

Multilayer ceramic electronic component including multilayer extern...

High-performance capacitor packaging for next generation power elec...

Multi-layer ceramic electronic component and circuit board

Bonded structures with integrated passive component

Resonant multilayer ceramic capacitors

Multi-layer ceramic capacitor and method of producing the same prel...

Miniature transmission lines and related circuit components

Multilayer ceramic capacitor

Thin film capacitor

Multi-layer capacitor

Multilayer ceramic capacitor and dielectric material

High-power capacitor for downhole electrocrushing drilling

Multilayer ceramic capacitor having ultra-broadband performance

Multilayer ceramic capacitor

Multilayer ceramic capacitor

Thin film capacitor having a dielectric layer having a through hole...

Label and related method

Dielectric ceramic composition and ceramic capacitor using the same

Multilayer ceramic electronic component including multilayer extern...

Bonded structures with integrated passive component

Method of manufacturing a multilayer ceramic capacitor

Resonant multilayer ceramic capacitors

Multi-layer ceramic capacitor and method of producing the same

Method of producing a multi-layer ceramic electronic component

Dielectric composition and capacitor component using the same

Dielectric material, method of preparing the same, and device compr...

Multilayer ceramic electronic component including an insulating layer

Ceramic electronic device, mounting substrate, package body of cera...

Patents Applicationslast 30 patents

MULTILAYER CAPACITOR

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

DIELECTRIC COMPOSITION FOR MULTILAYERED CERAMIC CAPACITOR,MULTILAYE...

SPIRAL INDUCTORS, TRANSFORMERS AND BALUNS FORMED FROM FLEXIBLE DIEL...

MULTILAYER CERAMIC CAPACITOR

DIELECTRIC MATERIAL FOR A HIGH VOLTAGE CAPACITOR

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

CERAMIC ELECTRONIC DEVICE, DIELECTRIC MATERIAL, AND MANUFACTURING M...

MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING MULTILAYER EXTERN...

MULTILAYER CAPACITOR

Resonant Multilayer Ceramic Capacitors

MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

MINIATURE INDUCTORS AND RELATED CIRCUIT COMPONENT AND METHODS OF MA...

HIGH-PERFORMANCE CAPACITOR PACKAGING FOR NEXT GENERATION POWER ELEC...

MULTI-LAYER CAPACITOR

DIELECTRIC MATERIAL, METHOD OF PREPARING THE SAME, AND DEVICE COMPR...

LTCC Dielectric Compositions And Devices Having High Q Factors

Dielectric Ceramic Composition and Ceramic Capacitor Using the Same

MULTILAYER CERAMIC CAPACITOR AND DIELECTRIC MATERIAL

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT

LABEL AND RELATED METHOD

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

DIELECTRIC COMPOSITION AND ELECTRONIC DEVICE

Multilayer Ceramic Capacitor Having Ultra-Broadband Performance

HIGH-POWER CAPACITOR FOR DOWNHOLE ELECTROCRUSHING DRILLING

DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD OF THE SAME