containing carbon

Industry

CPC
H01L23/53276

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53276containing carbon

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Graphene BEOL integration interconnection structures
- Patent number 12,170,248
- Issue date Dec 17, 2024
- DESTINATION 2D
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-assisted low-resistance interconnect structures and method...
- Patent number 12,113,021
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,068,254
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with two-dimensional conductive structures
- Patent number 12,068,253
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of bi-layer pixel isolation in advanced LCOS b...
- Patent number 12,055,821
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal routing trench by additive processing
- Patent number 11,996,343
- Issue date May 28, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and electronic device employing the same
- Patent number 11,978,704
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,972,997
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having vertical conductive graphene and met...
- Patent number 11,948,837
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnection using graphene
- Patent number 11,876,050
- Issue date Jan 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,979
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Jang Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 11,749,608
- Issue date Sep 5, 2023
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene layer for reduced contact resistance
- Patent number 11,721,627
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-assisted low-resistance interconnect structures and method...
- Patent number 11,710,700
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having nanocrystalline graphene cap layer an...
- Patent number 11,682,622
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Kyung-Eun Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having graphene-containing-structures
- Patent number 11,682,623
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,670,595
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable nanotube fabrics and methods for making same
- Patent number 11,643,763
- Issue date May 9, 2023
- Zeon Corporation
- Rahul Sen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods of forming interconnection structure including conductive g...
- Patent number 11,640,940
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with porous insulating...
- Patent number 11,616,022
- Issue date Mar 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,594,483
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature graphene growth
- Patent number 11,515,163
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Jialiang Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Customized smart devices and touchscreen devices and cleanspace man...
- Patent number 11,462,437
- Issue date Oct 4, 2022
- Frederick A. Flitsch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming graphene and metallic cap and barrier layers for...
- Patent number 11,462,470
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and manufacturing method therefor
- Patent number 11,462,609
- Issue date Oct 4, 2022
- Shenzhen Goodix Technology Co., Ltd.
- Bin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with porous insulating layers and method for f...
- Patent number 11,424,187
- Issue date Aug 23, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit and method for producing same
- Patent number 11,328,953
- Issue date May 10, 2022
- Kaneka Corporation
- Mutsuaki Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating CU interconnection using graphene
- Patent number 11,328,994
- Issue date May 10, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with graphene-based element and method for fab...
- Patent number 11,309,214
- Issue date Apr 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240387251
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME
- Publication number 20240379430
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...
- Publication number 20240379559
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379558
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379560
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363538
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...
- Publication number 20240355499
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- CHANG SEOK LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GRAPHENE BEOL INTEGRATION INTERCONNECTION STRUCTURES
- Publication number 20240339407
- Publication date Oct 10, 2024
- Destination 2D Inc.
- Klaus SCHUEGRAF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
- Publication number 20240312862
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...
- Publication number 20240304697
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER
- Publication number 20240304696
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-CAPPED COPPER IN DUAL DAMASCENE INTERCONNECT
- Publication number 20240213159
- Publication date Jun 27, 2024
- LAM RESEARCH CORPORATION
- Asish Parbatani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...
- Publication number 20240203789
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240178144
- Publication date May 30, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240088042
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240038665
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...
- Publication number 20230411299
- Publication date Dec 21, 2023
- Lodestar Licensing Group, LLC
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-CLAD METAL INTERCONNECT
- Publication number 20230402385
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-METAL HYBRID INTERCONNECT
- Publication number 20230402384
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE
- Publication number 20230387018
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT
- Publication number 20230387019
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230378067
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsu-Chun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230378053
- Publication date Nov 23, 2023
- Macronix International Co., Ltd.
- Cheng-Hsien LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...
- Publication number 20230369225
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...
- Publication number 20230335497
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...
- Publication number 20230317605
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Graphene-Containing-Structures
- Publication number 20230307367
- Publication date Sep 28, 2023
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230275027
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphite-Based Interconnects And Methods Of Fabrication Thereof
- Publication number 20230275024
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230268274
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS

containing carbon

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Graphene BEOL integration interconnection structures

Semiconductor device structure and methods of forming the same

Graphene-assisted low-resistance interconnect structures and method...

Interconnection structure and methods of forming the same

Semiconductor structure with two-dimensional conductive structures

Structure and method of bi-layer pixel isolation in advanced LCOS b...

Thermal routing trench by additive processing

Wiring structure and electronic device employing the same

Semiconductor device

Semiconductor structure having vertical conductive graphene and met...

Method for fabricating interconnection using graphene

Semiconductor device

Device packages including redistribution layers with carbon-based c...

Graphene layer for reduced contact resistance

Graphene-assisted low-resistance interconnect structures and method...

Interconnect structure having nanocrystalline graphene cap layer an...

Integrated assemblies having graphene-containing-structures

Semiconductor device structure and methods of forming the same

Scalable nanotube fabrics and methods for making same

Methods of forming interconnection structure including conductive g...

Method for fabricating semiconductor device with porous insulating...

Semiconductor structure

Low temperature graphene growth

Customized smart devices and touchscreen devices and cleanspace man...

Method of forming graphene and metallic cap and barrier layers for...

Capacitor and manufacturing method therefor

Semiconductor device with porous insulating layers and method for f...

Wiring circuit and method for producing same

Method for fabricating CU interconnection using graphene

Semiconductor device with graphene-based element and method for fab...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME

GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...

GRAPHENE BEOL INTEGRATION INTERCONNECTION STRUCTURES

THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING

SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH CAPPING LAYER

GRAPHENE-CAPPED COPPER IN DUAL DAMASCENE INTERCONNECT

SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF

INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME

DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...

GRAPHENE-CLAD METAL INTERCONNECT

GRAPHENE-METAL HYBRID INTERCONNECT

GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE

INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT

SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...

INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...

Integrated Assemblies Having Graphene-Containing-Structures

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Graphite-Based Interconnects And Methods Of Fabrication Thereof

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME