containing N

Industry

CPC
H05K1/0346

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0346containing N

Industries

Patents Grantslast 30 patents

Information Patent Grant
Film-closure apparatus for plastic film material, printed circuit b...
- Patent number 12,145,324
- Issue date Nov 19, 2024
- Green Light Packaging Limited
- Mark Bonning
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, metal foil-clad laminate, resin sheet,...
- Patent number 12,091,542
- Issue date Sep 17, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Saori Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Polymers for use in electronic devices
- Patent number 12,049,542
- Issue date Jul 30, 2024
- DUPONT ELECTRONICS, INC.
- Brian C. Auman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polyimide resin precursor, polyimide resin, metal-clad laminated bo...
- Patent number 11,976,171
- Issue date May 7, 2024
- Arisawa Mfg. Co., Ltd.
- Yoshinori Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board assembly
- Patent number 11,956,894
- Issue date Apr 9, 2024
- SIGNIFY HOLDING, B.V.
- Pieter Joseph Clara Van Der Wel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device including the same
- Patent number 11,956,899
- Issue date Apr 9, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, and prepreg, resin-coated film, resin-coated met...
- Patent number 11,945,910
- Issue date Apr 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Umehara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Capacitive leadwire for physiological patient monitoring
- Patent number 11,931,177
- Issue date Mar 19, 2024
- General Electric Company
- Jussi Halinen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Display device
- Patent number 11,882,736
- Issue date Jan 23, 2024
- Samsung Display Co., Ltd.
- Changmoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyamic acid solutions, polyimide films and electronic devices
- Patent number 11,834,561
- Issue date Dec 5, 2023
- DUPONT ELECTRONICS, INC.
- Ming-Siao Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit and display device
- Patent number 11,765,830
- Issue date Sep 19, 2023
- Chengdu Boe Optoelectronics Technology Co., Ltd.
- Lianbin Liu
- G01 - MEASURING TESTING
Information Patent Grant
Polyimide resin precursor
- Patent number 11,760,838
- Issue date Sep 19, 2023
- Arisawa Mfg. Co., Ltd.
- Hiroyuki Matsuyama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic apparatus and inspection method
- Patent number 11,751,326
- Issue date Sep 5, 2023
- Sharp Kabushiki Kaisha
- Mitsuaki Morimoto
- G01 - MEASURING TESTING
Information Patent Grant
Resin composition and use thereof
- Patent number 11,702,507
- Issue date Jul 18, 2023
- Shikoku Chemicals Corporation
- Akihito Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring structure, display subtrate and display device
- Patent number 11,696,395
- Issue date Jul 4, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhifeng Zhan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connection structure and display device
- Patent number 11,690,175
- Issue date Jun 27, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triazole silane compound, method for synthesizing said compound and...
- Patent number 11,680,076
- Issue date Jun 20, 2023
- Shikoku Chemicals Corporation
- Takayuki Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide films and electronic devices
- Patent number 11,643,514
- Issue date May 9, 2023
- DUPONT ELECTRONICS, INC.
- Ming-Siao Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally curable resin composition and film obtained therefrom
- Patent number 11,603,469
- Issue date Mar 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin film for interlayer insulating layer with support, multilayer...
- Patent number 11,553,593
- Issue date Jan 10, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takayuki Suzukawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive leadwire for physiological patient monitoring
- Patent number 11,547,355
- Issue date Jan 10, 2023
- General Electric Company
- Juha Petri Virtanen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Bendable circuit board, expandable circuit board, and electronic de...
- Patent number 11,542,377
- Issue date Jan 3, 2023
- Mitsui Chemicals, Inc.
- Tadahiro Sunaga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and article made therefrom
- Patent number 11,518,882
- Issue date Dec 6, 2022
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
- Teng Xu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal substrate and method of manufacturing the same
- Patent number 11,483,934
- Issue date Oct 25, 2022
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 11,447,658
- Issue date Sep 20, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Shunsuke Katagiri
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, and prepreg, metal-clad laminate, and printed ci...
- Patent number 11,414,532
- Issue date Aug 16, 2022
- Taiwan Union Technology Corporation
- Chih-Wei Liao
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...
- Publication number 20240389227
- Publication date Nov 21, 2024
- JSR Corporation
- Ryouji TATARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM...
- Publication number 20240343866
- Publication date Oct 17, 2024
- TAMURA CORPORATION
- Taiki ENDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOIMAGABLE DIELECTRICS
- Publication number 20240317940
- Publication date Sep 26, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Nora Sabina Radu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20240309127
- Publication date Sep 19, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Shunsuke KATAGIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20240287219
- Publication date Aug 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune KUMAZAWA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20240279432
- Publication date Aug 22, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune KUMAZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, METAL-CLAD LAMINATED BO...
- Publication number 20240270907
- Publication date Aug 15, 2024
- Arisawa Mfg. Co., Ltd.
- Yoshinori Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING COMPOSITION
- Publication number 20240262984
- Publication date Aug 8, 2024
- DAIKIN INDUSTRIES, LTD.
- Kyouhei SAWAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240254328
- Publication date Aug 1, 2024
- AJINOMOTO CO., INC.
- Shohei FUJISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251508
- Publication date Jul 25, 2024
- Sumitomo Electric Industries, Ltd.
- Masamichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUORINE-CONTAINING POLYAMIDE COMPOUND AND FLUORINE-CONTAINING POLY...
- Publication number 20240209153
- Publication date Jun 27, 2024
- DAIKIN INDUSTRIES, LTD.
- Yoshiyuki OISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20240206065
- Publication date Jun 20, 2024
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING POLYIMIDE RESIN POWDER
- Publication number 20240199810
- Publication date Jun 20, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yuuki SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-DIELECTRIC BOARD MATERIAL
- Publication number 20240206059
- Publication date Jun 20, 2024
- NITTO DENKO CORPORATION
- Taku IMAIZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...
- Publication number 20240191030
- Publication date Jun 13, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD,...
- Publication number 20240174809
- Publication date May 30, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Neurotrophic Electrode Array
- Publication number 20240156385
- Publication date May 16, 2024
- Neural Logistics LLC
- Philip R. Kennedy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE AND ELECTRONIC DEVICE
- Publication number 20240049386
- Publication date Feb 8, 2024
- FUJIFILM CORPORATION
- Akio KATAYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPO...
- Publication number 20240026069
- Publication date Jan 25, 2024
- JSR Corporation
- Naoyuki KAWASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE SUBSTRATE, AND METHOD FOR MANUFACTURING STRETCHABLE SUB...
- Publication number 20240008173
- Publication date Jan 4, 2024
- KOREA PHOTONICS TECHNOLOGY INSTITUTE
- Gi Dong SA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND METAL CLAD SUBSTRATE
- Publication number 20240002653
- Publication date Jan 4, 2024
- ITEQ CORPORATION
- SHENG-YEN WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYIMIDE PRECURSOR, POLYIMIDE, AND FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20230391955
- Publication date Dec 7, 2023
- Tomoaki MAENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP ROUTING CIRCUITS WITH DIELECTRIC FILMS
- Publication number 20230371172
- Publication date Nov 16, 2023
- Intel Corporation
- Alberto Carrillo Vazquez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20230331944
- Publication date Oct 19, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Hirosuke SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, METAL-CLAD LAMINATED BO...
- Publication number 20230312828
- Publication date Oct 5, 2023
- Arisawa Mfg. Co., Ltd.
- Yoshinori Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM, WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20230265246
- Publication date Aug 24, 2023
- FUJIFILM CORPORATION
- Shohei YAMAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE, DISPLAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20230269871
- Publication date Aug 24, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhifeng ZHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLYIMIDE FILM, AND METAL-CLAD LAMINATE
- Publication number 20230227609
- Publication date Jul 20, 2023
- NITTO DENKO CORPORATION
- Kei MISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

containing N

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Film-closure apparatus for plastic film material, printed circuit b...

Resin multilayer substrate and method for manufacturing resin multi...

Resin composition, prepreg, metal foil-clad laminate, resin sheet,...

Method for manufacturing microelectrode film

Polymers for use in electronic devices

Polyimide resin precursor, polyimide resin, metal-clad laminated bo...

Flexible printed circuit board assembly

Display panel and display device including the same

Resin composition, and prepreg, resin-coated film, resin-coated met...

Capacitive leadwire for physiological patient monitoring

Display device

Polyamic acid solutions, polyimide films and electronic devices

Flexible printed circuit and display device

Polyimide resin precursor

Electronic apparatus and inspection method

Resin composition and use thereof

Wiring structure, display subtrate and display device

Connection structure and display device

Triazole silane compound, method for synthesizing said compound and...

Polyimide films and electronic devices

Flexible circuit electrode array and method of manufacturing the same

Thermally curable resin composition and film obtained therefrom

Resin film for interlayer insulating layer with support, multilayer...

Capacitive leadwire for physiological patient monitoring

Bendable circuit board, expandable circuit board, and electronic de...

Resin composition and article made therefrom

Application specific electronics packaging systems, methods and dev...

Metal substrate and method of manufacturing the same

Resin composition, resin sheet, multilayer printed wiring board, an...

Resin composition, and prepreg, metal-clad laminate, and printed ci...

Patents Applicationslast 30 patents

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...

POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM...

PHOTOIMAGABLE DIELECTRICS

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, METAL-CLAD LAMINATED BO...

COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING COMPOSITION

RESIN COMPOSITION

PRINTED WIRING BOARD

FLUORINE-CONTAINING POLYAMIDE COMPOUND AND FLUORINE-CONTAINING POLY...

DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME

METHOD FOR PRODUCING POLYIMIDE RESIN POWDER

LOW-DIELECTRIC BOARD MATERIAL

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...

RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD,...

Neurotrophic Electrode Array

LAMINATE AND ELECTRONIC DEVICE

POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPO...

STRETCHABLE SUBSTRATE, AND METHOD FOR MANUFACTURING STRETCHABLE SUB...

RESIN COMPOSITION AND METAL CLAD SUBSTRATE

POLYIMIDE PRECURSOR, POLYIMIDE, AND FLEXIBLE PRINTED CIRCUIT BOARD

MICROSTRIP ROUTING CIRCUITS WITH DIELECTRIC FILMS

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, METAL-CLAD LAMINATED BO...

FILM, WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD

WIRING STRUCTURE, DISPLAY SUBSTRATE AND DISPLAY DEVICE

POLYIMIDE FILM, AND METAL-CLAD LAMINATE