containing oxygen in the form of ether bonds in the main chain

Industry

CPC
C08G73/127

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Parent Industries

CCHEMISTRY METALLURGY C08Organic compounds C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00

Current Industry

C08G73/127containing oxygen in the form of ether bonds in the main chain

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Modified allyl compound, modified bismaleimide prepolymer
- Patent number 12,139,582
- Issue date Nov 12, 2024
- GUANGDONG HINNO-TECH CO., LTD.
- Yongjun Guo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Lightly crosslinked polyimides with phenylethynyl pendants for shap...
- Patent number 11,992,995
- Issue date May 28, 2024
- United States of America as represented by the Secretary of the Air Force
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multiphenylethynyl-containing and lightly crosslinked polyimides ca...
- Patent number 11,975,477
- Issue date May 7, 2024
- United States of America as represented by the Secretary of the Air Force
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Poly(etherimide-phthalonitrile) adhesives and related methods
- Patent number 11,795,357
- Issue date Oct 24, 2023
- The Boeing Company
- Kevin James Drummey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for fabricating multiphenylethynyl-containing and lightly cr...
- Patent number 11,577,448
- Issue date Feb 14, 2023
- United States of America as represented by the Secretary of the Air Force
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transparent polyimide film
- Patent number 11,530,297
- Issue date Dec 20, 2022
- TAIMIDE TECH. INC.
- Yi-Hsueh Ho
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for fabricating lightly crosslinked polyimides with phenylet...
- Patent number 11,504,899
- Issue date Nov 22, 2022
- United States of America as represented by the Secretary of the Air Force
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Vinyl-modified maleimide, composition and article made thereby
- Patent number 11,066,520
- Issue date Jul 20, 2021
- ELITE MATERIAL CO., LTD.
- Chen-Yu Hsieh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, prepreg, laminate and multilayer printed wiring...
- Patent number 11,041,045
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Nagai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Liquid crystal aligning agent, liquid crystal alignment film and li...
- Patent number 10,761,375
- Issue date Sep 1, 2020
- Nissan Chemical Industries, Ltd.
- Kanako Suzuki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Tetracarboxylic acid diester compound, polyimide precursor polymer...
- Patent number 10,216,085
- Issue date Feb 26, 2019
- Shin-Etsu Chemical Co., Ltd.
- Katsuya Takemura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Fluorine-containing modified bismaleimide resin
- Patent number 9,663,617
- Issue date May 30, 2017
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Chain extended epoxy to improve adhesion of conductive die attach film
- Patent number 9,200,184
- Issue date Dec 1, 2015
- Henkel IP & Holding GmbH
- Junbo Gao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive polyimides
- Patent number 8,932,801
- Issue date Jan 13, 2015
- Eternal Chemical Co., Ltd.
- Meng-Yen Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyimide oligomers
- Patent number 8,901,274
- Issue date Dec 2, 2014
- Lonza Group, Ltd.
- Sajal Das
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Positive-type photosensitive resin composition
- Patent number 8,158,324
- Issue date Apr 17, 2012
- Toray Industries, Inc.
- Yoji Fujita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polyimides
- Patent number 8,105,752
- Issue date Jan 31, 2012
- Eternal Chemical Co., Ltd.
- Meng-Yen Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for preparing an electrically conductive polymer
- Patent number 6,072,027
- Issue date Jun 6, 2000
- The Dow Chemical Company
- Carey L. Scortichini
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,725,948
- Issue date Mar 10, 1998
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
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Information Patent Grant
Carbon fiber-reinforced polimide resin composition
- Patent number 5,650,463
- Issue date Jul 22, 1997
- Mitsui Toatsu Chemicals, Inc.
- Masahiro Ohta
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Bisimide compounds, polyimide resin composition prepared therefrom,...
- Patent number 5,554,765
- Issue date Sep 10, 1996
- Mitsui Toatsu Chemicals, Inc.
- Masahiro Ohta
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Wire coatings and processes for their preparation
- Patent number 5,536,791
- Issue date Jul 16, 1996
- BASF Lacke + Farben, AG
- Michael Schink
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Information Patent Grant
Bisimide compounds, polyimide resin composition prepared therefrom,...
- Patent number 5,457,154
- Issue date Oct 10, 1995
- Mitsui Toatsu Chemicals, Inc.
- Masahiro Ohta
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Prepolymers having imide groups
- Patent number 5,403,907
- Issue date Apr 4, 1995
- Ciba-Geigy Corporation
- Daniel Beziers
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting imide oligomer and manufacturing method of heat resis...
- Patent number 5,397,419
- Issue date Mar 14, 1995
- Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- Hiroyuki Furutani
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hardenable compositions comprising bismaleimides, alkenylphenols an...
- Patent number 5,359,020
- Issue date Oct 25, 1994
- Ciba-Geigy Corporation
- Rudolf Brunner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally stable bisimido copolymerizates
- Patent number 5,221,723
- Issue date Jun 22, 1993
- Ciba-Geigy Corporation
- Rene Arpin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
N,N'-bis(maleimide)/hindered diamine copolymerizate
- Patent number 5,206,338
- Issue date Apr 27, 1993
- Ciba-Geigy Corporation
- Pascal Barthelemy
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally stable bisimido/p-allylaniline copolymers
- Patent number 5,198,516
- Issue date Mar 30, 1993
- Ciba-Geigy Corporation
- Yves Camberlin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin compositions
- Patent number 5,182,351
- Issue date Jan 26, 1993
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
PHOTOIMAGABLE DIELECTRICS
- Publication number 20240317940
- Publication date Sep 26, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Nora Sabina Radu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION
- Publication number 20240084075
- Publication date Mar 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLY(ETHERIMIDE-PHTHALONITRILE) ADHESIVES AND RELATED METHODS
- Publication number 20230103527
- Publication date Apr 6, 2023
- The Boeing Company
- Kevin James Drummey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN SHEET
- Publication number 20230097896
- Publication date Mar 30, 2023
- LINTEC CORPORATION
- Yasutaka WATANABE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
VINYL-MODIFIED MALEIMIDE, COMPOSITION AND ARTICLE MADE THEREBY
- Publication number 20180362715
- Publication date Dec 20, 2018
- ELITE MATERIAL CO., LTD.
- Chen-Yu Hsieh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID CRYSTAL ALIGNING AGENT, LIQUID CRYSTAL ALIGNMENT FILM AND LI...
- Publication number 20180267367
- Publication date Sep 20, 2018
- Nissan Chemical Industries, Ltd.
- Kanako SUZUKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER...
- Publication number 20180024434
- Publication date Jan 25, 2018
- Shin-Etsu Chemical Co., Ltd.
- Katsuya TAKEMURA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Polyimide oligomers
- Publication number 20140058057
- Publication date Feb 27, 2014
- Sajal Das
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film
- Publication number 20130306916
- Publication date Nov 21, 2013
- Henkel Corporation
- Junbo Gao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120228784
- Publication date Sep 13, 2012
- Tatsu Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
- Publication number 20100099041
- Publication date Apr 22, 2010
- Yoji Fujita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE POLYIMIDES
- Publication number 20100086871
- Publication date Apr 8, 2010
- ETERNAL CHEMICAL CO., LTD.
- MENG-YEN CHOU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE POLYIMIDES
- Publication number 20090181324
- Publication date Jul 16, 2009
- ETERNAL CHEMICAL CO., LTD.
- MENG-YEN CHOU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

containing oxygen in the form of ether bonds in the main chain

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modified allyl compound, modified bismaleimide prepolymer

Lightly crosslinked polyimides with phenylethynyl pendants for shap...

Multiphenylethynyl-containing and lightly crosslinked polyimides ca...

Poly(etherimide-phthalonitrile) adhesives and related methods

Method for fabricating multiphenylethynyl-containing and lightly cr...

Transparent polyimide film

Method for fabricating lightly crosslinked polyimides with phenylet...

Vinyl-modified maleimide, composition and article made thereby

Resin composition, prepreg, laminate and multilayer printed wiring...

Liquid crystal aligning agent, liquid crystal alignment film and li...

Tetracarboxylic acid diester compound, polyimide precursor polymer...

Fluorine-containing modified bismaleimide resin

Chain extended epoxy to improve adhesion of conductive die attach film

Photosensitive polyimides

Polyimide oligomers

Positive-type photosensitive resin composition

Photosensitive polyimides

Process for preparing an electrically conductive polymer

Adhesive tape for electronic parts and liquid adhesive

Carbon fiber-reinforced polimide resin composition

Bisimide compounds, polyimide resin composition prepared therefrom,...

Wire coatings and processes for their preparation

Bisimide compounds, polyimide resin composition prepared therefrom,...

Prepolymers having imide groups

Thermosetting imide oligomer and manufacturing method of heat resis...

Hardenable compositions comprising bismaleimides, alkenylphenols an...

Thermally stable bisimido copolymerizates

N,N'-bis(maleimide)/hindered diamine copolymerizate

Thermally stable bisimido/p-allylaniline copolymers

Thermosetting resin compositions

Patents Applicationslast 30 patents

PHOTOIMAGABLE DIELECTRICS

HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION

POLY(ETHERIMIDE-PHTHALONITRILE) ADHESIVES AND RELATED METHODS

RESIN SHEET

VINYL-MODIFIED MALEIMIDE, COMPOSITION AND ARTICLE MADE THEREBY

LIQUID CRYSTAL ALIGNING AGENT, LIQUID CRYSTAL ALIGNMENT FILM AND LI...

TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER...

Polyimide oligomers

Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film

SEMICONDUCTOR DEVICE

POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION

PHOTOSENSITIVE POLYIMIDES

PHOTOSENSITIVE POLYIMIDES