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H01L2224/03312
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/03312
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Patents Grants
last 30 patents
Information
Patent Grant
Methods for registration of circuit dies and electrical interconnects
Patent number
12,020,951
Issue date
Jun 25, 2024
3M Innovative Properties Company
Ankit Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bump structure and manufacturing method thereof and driving s...
Patent number
11,715,715
Issue date
Aug 1, 2023
Unimicron Technology Corp.
Tzyy-Jang Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package devices and method for forming semiconductor...
Patent number
11,393,784
Issue date
Jul 19, 2022
Infineon Technologies AG
Roland Rupp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Control device
Patent number
11,327,468
Issue date
May 10, 2022
Omron Corporation
Wakahiro Kawai
G05 - CONTROLLING REGULATING
Information
Patent Grant
Adhesive substrate, transfer device having adhesive substrate, and...
Patent number
10,818,618
Issue date
Oct 27, 2020
Shin-Etsu Chemical Co., Ltd.
Hiroyuki Iguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of processing a porous conductive structure in connection to...
Patent number
10,373,868
Issue date
Aug 6, 2019
Infineon Technologies Austria AG
Martin Mischitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices with semiconductor die attached with sintered me...
Patent number
9,875,987
Issue date
Jan 23, 2018
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Environmental hardened packaged integrated circuit
Patent number
9,711,480
Issue date
Jul 18, 2017
Global Circuit Innovations Incorporated
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
Patent number
9,589,860
Issue date
Mar 7, 2017
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanically anchored backside C4 pad
Patent number
9,478,509
Issue date
Oct 25, 2016
GLOBALFOUNDRIES, INC.
Ronald G. Filippi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Soldering device, soldering method, and substrate and electronic co...
Patent number
9,289,841
Issue date
Mar 22, 2016
TANIGUROGUMI CORPORATION
Katsumori Taniguro
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stack type semiconductor package
Patent number
9,230,876
Issue date
Jan 5, 2016
Samsung Electronics Co., Ltd.
Jang-Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solderless die attach to a direct bonded aluminum substrate
Patent number
9,111,782
Issue date
Aug 18, 2015
IXYS Corporation
Nathan Zommer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solderless die attach to a direct bonded aluminum substrate
Patent number
8,716,864
Issue date
May 6, 2014
IXYS Corporation
Nathan Zommer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
Patent number
8,653,667
Issue date
Feb 18, 2014
IXYS Corporation
Nathan Zommer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
Patent number
8,586,480
Issue date
Nov 19, 2013
IXYS Corporation
Nathan Zommer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
Publication number
20240282592
Publication date
Aug 22, 2024
3M Innovative Properties Company
Ankit Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method For Producing A Solder Contact Surface On A Chip By Producin...
Publication number
20240203913
Publication date
Jun 20, 2024
Pac Tech - Packaging Technologies GmbH
Matthias Fettke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...
Publication number
20240096825
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
Publication number
20220293558
Publication date
Sep 15, 2022
INFINEON TECHNOLOGIES AG
Roland Rupp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...
Publication number
20220238471
Publication date
Jul 28, 2022
Unimicron Technology Corp.
Tzyy-Jang Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
Publication number
20220189790
Publication date
Jun 16, 2022
3M Innovative Properties Company
Ankit Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE
Publication number
20170207123
Publication date
Jul 20, 2017
Infineon Technologies Austria AG
Martin MISCHITZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
Publication number
20140374902
Publication date
Dec 25, 2014
Jang-Woo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
Publication number
20140225267
Publication date
Aug 14, 2014
IXYS Corporation
Nathan Zommer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...
Publication number
20140212678
Publication date
Jul 31, 2014
TANIGUROGUMI CORPORATION
Katsumori Taniguro
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...
Publication number
20140183716
Publication date
Jul 3, 2014
IXYS Corporation
Nathan Zommer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20140145343
Publication date
May 29, 2014
SK HYNIX INC.
Jong Hoon KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
Publication number
20140042624
Publication date
Feb 13, 2014
IXYS Corporation
Nathan Zommer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
Publication number
20130328204
Publication date
Dec 12, 2013
IXYS Corporation
Nathan Zommer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...
Publication number
20130323884
Publication date
Dec 5, 2013
The Charles Stark Draper Laboratory
Maurice Samuel Karpman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...
Publication number
20130316497
Publication date
Nov 28, 2013
The Charles Stark Draper Laboratory
Maurice Samuel Karpman
H01 - BASIC ELECTRIC ELEMENTS