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H01L2224/27312

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27312Continuous flow

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die bonder incorporating rotatable adhesive dispenser head
- Patent number 11,289,445
- Issue date Mar 29, 2022
- ASM Technology Singapore Pte. Ltd.
- Wan Yin Yau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,914,992
- Issue date Feb 9, 2021
- Samsung Display Co., Ltd.
- Minseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, method for manufacturing the display panel, and disp...
- Patent number 10,818,634
- Issue date Oct 27, 2020
- HKC CORPORATION LIMITED
- Shishuai Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,725,351
- Issue date Jul 28, 2020
- Samsung Display Co., Ltd.
- Minseok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer frame packages for integrated circuits having a magnetic...
- Patent number 10,643,954
- Issue date May 5, 2020
- EVERSPIN TECHNOLOGIES, INC.
- Angelo V. Ugge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid ejection device
- Patent number 10,632,491
- Issue date Apr 28, 2020
- Sekisui Chemical Co., Ltd.
- Michihisa Ueda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic assembly with enhanced thermal dissipation
- Patent number 10,461,021
- Issue date Oct 29, 2019
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed three-dimensional (3D) functional part and method of making
- Patent number 10,462,907
- Issue date Oct 29, 2019
- President and Fellows of Harvard College
- Jennifer A. Lewis
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,383,572
- Issue date Aug 20, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
- Patent number 10,332,858
- Issue date Jun 25, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,258,279
- Issue date Apr 16, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,254,603
- Issue date Apr 9, 2019
- Samsung Display Co., Ltd.
- Minseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method thereof
- Patent number 10,163,820
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
- Publication number 20230307407
- Publication date Sep 28, 2023
- Tohru YASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200292864
- Publication date Sep 17, 2020
- SAMSUNG DISPLAY CO., LTD.
- Minseok KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDER INCORPORATING ROTATABLE ADHESIVE DISPENSER HEAD
- Publication number 20200203305
- Publication date Jun 25, 2020
- ASM Technology Singapore Pte Ltd
- Wan Yin YAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, METHOD FOR MANUFACTURING THE DISPLAY PANEL, AND DISP...
- Publication number 20200111762
- Publication date Apr 9, 2020
- HKC Corporation Limited
- Shishuai Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190204653
- Publication date Jul 4, 2019
- SAMSUNG DISPLAY CO., LTD.
- Minseok KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE PASTE AND DIE BONDING METHOD
- Publication number 20190139930
- Publication date May 9, 2019
- KAKEN TECH CO., LTD.
- Shigeo Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180344245
- Publication date Dec 6, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...
- Publication number 20180331065
- Publication date Nov 15, 2018
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR PACKAGE DEVICE
- Publication number 20180204818
- Publication date Jul 19, 2018
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180173042
- Publication date Jun 21, 2018
- SAMSUNG DISPLAY CO., LTD.
- Minseok KIM
- G02 - OPTICS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARAT...
- Publication number 20180047884
- Publication date Feb 15, 2018
- LUMENS CO., LTD
- Seung-Hyun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER AND METHOD THEREOF
- Publication number 20180040573
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- FRANK PUESCHNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE WITH A SUPPORT WITH A PALLADIUM/OXYGEN DIF...
- Publication number 20180040580
- Publication date Feb 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Frank KRÜGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180005982
- Publication date Jan 4, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150270207
- Publication date Sep 24, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silver-To-Silver Bonded IC Package Having Two Ceramic Substrates Ex...
- Publication number 20150162304
- Publication date Jun 11, 2015
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A CHIP TO A SUBSTRATE
- Publication number 20150062248
- Publication date Mar 5, 2015
- OCE-TECHNOLOGIES B.V.
- Norbert H. W. LAMERS
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION
- Publication number 20150050781
- Publication date Feb 19, 2015
- lintel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS
- Publication number 20140242323
- Publication date Aug 28, 2014
- Albert M. Giorgini
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING
- Publication number 20140191380
- Publication date Jul 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...
- Publication number 20140183716
- Publication date Jul 3, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20140175678
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140151873
- Publication date Jun 5, 2014
- SONY CORPORATION
- Takayuki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Continuous flow

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fingerprint sensor and manufacturing method thereof

Semiconductor devices and methods of making the same

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Fingerprint sensor and manufacturing method thereof

Die bonder incorporating rotatable adhesive dispenser head

Display apparatus and method of manufacturing the same

Semiconductor packaging structure and process

Display panel, method for manufacturing the display panel, and disp...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Display apparatus and method of manufacturing the same

Semiconductor devices and methods of making the same

Wafer level flat no-lead semiconductor packages and methods of manu...

Engineered polymer-based electronic materials

Multilayer frame packages for integrated circuits having a magnetic...

Liquid ejection device

Method for producing a substrate arrangement, substrate arrangement...

Conductive paste and die bonding method

Electronic assembly with enhanced thermal dissipation

Printed three-dimensional (3D) functional part and method of making

Fingerprint sensor and manufacturing method thereof

Die attach methods and semiconductor devices manufactured based on...

Via and trench filling using injection molded soldering

Electronic sandwich structure with two parts joined together by mea...

Fingerprint sensor and manufacturing method thereof

Wafer level flat no-lead semiconductor packages and methods of manu...

Via and trench filling using injection molded soldering

Display apparatus and method of manufacturing the same

Chip carrier and method thereof

Patents Applicationslast 30 patents

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

DIE BONDER INCORPORATING ROTATABLE ADHESIVE DISPENSER HEAD

DISPLAY PANEL, METHOD FOR MANUFACTURING THE DISPLAY PANEL, AND DISP...

Die Attach Methods and Semiconductor Devices Manufactured based on...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE PASTE AND DIE BONDING METHOD

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...

MANUFACTURING METHOD FOR PACKAGE DEVICE

CLIP AND RELATED METHODS

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARAT...

CHIP CARRIER AND METHOD THEREOF

POWER ELECTRONICS MODULE WITH A SUPPORT WITH A PALLADIUM/OXYGEN DIF...

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

Semiconductor Packaging Structure and Process

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

SEMICONDUCTOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Silver-To-Silver Bonded IC Package Having Two Ceramic Substrates Ex...

METHOD FOR BONDING A CHIP TO A SUBSTRATE

SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION

REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS

Solderless Die Attach to a Direct Bonded Aluminum Substrate

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING

SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...

Semiconductor Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD