Continuously deformed conductors

Industry

CPC
H05K2201/0382

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0382Continuously deformed conductors

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board with a bent connecting section and method for...
- Patent number 11,067,622
- Issue date Jul 20, 2021
- Vitesco Technologies GmbH
- Detlev Bagung
- G01 - MEASURING TESTING
Information Patent Grant
Image pickup apparatus and method for manufacturing image pickup ap...
- Patent number 10,381,393
- Issue date Aug 13, 2019
- Olympus Corporation
- Takuro Suyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit assembly, electrical junction box, and manufacturing method...
- Patent number 10,194,523
- Issue date Jan 29, 2019
- AutoNetworks Technologies, Ltd.
- Tatsuya Sumida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High current switch
- Patent number 10,070,514
- Issue date Sep 4, 2018
- Ellenberger & Poensgen GmbH
- Wolfgang Ullermann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of preparing metal pattern having 3D structure
- Patent number 10,034,385
- Issue date Jul 24, 2018
- LG Chem, Ltd.
- Jin Mi Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust multi-layer wiring elements and assemblies with embedded mic...
- Patent number 10,032,646
- Issue date Jul 24, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, manufacturing method therefor, and sub...
- Patent number 9,961,768
- Issue date May 1, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup apparatus and image pickup apparatus manufacturing method
- Patent number 9,929,201
- Issue date Mar 27, 2018
- Olympus Corporation
- Jumpei Yoneyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for making conductive pattern and conductive pattern
- Patent number 9,832,882
- Issue date Nov 28, 2017
- INKTEC CO., LTD.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device embedded substrate and manufacturing method thereof
- Patent number 9,743,525
- Issue date Aug 22, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Bong-Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 9,706,643
- Issue date Jul 11, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomoko Iwama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave shielding film and method for producing a circ...
- Patent number 9,609,792
- Issue date Mar 28, 2017
- GUANGZHOU FANG BANG ELECTRONICS CO., LTD.
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency signal transmission line and electronic device
- Patent number 9,538,638
- Issue date Jan 3, 2017
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing antenna sheet
- Patent number 9,436,905
- Issue date Sep 6, 2016
- Toppan Printing Co., Ltd.
- Hiroyoshi Gotou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board integrated interconnect
- Patent number 9,386,693
- Issue date Jul 5, 2016
- Lockheed Martin Corporation
- Tim Gruhl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device and manufacturing method for same
- Patent number 9,380,697
- Issue date Jun 28, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Tomita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards fabricated using congruent molds
- Patent number 9,247,649
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- Craig N. DeVarney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna sheet, data carrier with non-contact IC, and method for man...
- Patent number 9,183,488
- Issue date Nov 10, 2015
- Toppan Printing Co., Ltd.
- Hiroyoshi Gotou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical component of a motor vehicle
- Patent number 9,119,324
- Issue date Aug 25, 2015
- Brose Fahrzeugteile GmbH & Co. KG, Hallstadt
- Alexander Kifer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of light emitting diode and method to assemble thereof
- Patent number 8,987,770
- Issue date Mar 24, 2015
- Everlight Electronics Co., Ltd.
- Sheng-Jia Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,959,764
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure of electronic apparatus and display device usi...
- Patent number 8,724,070
- Issue date May 13, 2014
- NLT Technologies, Ltd.
- Youichirou Kamon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,651,877
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection box
- Patent number 8,416,575
- Issue date Apr 9, 2013
- Yazaki Corporation
- Hisashi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure of electronic apparatus and display device usi...
- Patent number 8,405,812
- Issue date Mar 26, 2013
- NLT Technologies, Ltd.
- Youichirou Kamon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor module and electromagnetic welding method
- Patent number 8,383,947
- Issue date Feb 26, 2013
- Yazaki Corporation
- Yoshitaka Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing semiconductor modules an...
- Patent number 8,378,229
- Issue date Feb 19, 2013
- Sanyo Electric Co., LTD
- Mayumi Nakasato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure of electronic component
- Patent number 8,227,914
- Issue date Jul 24, 2012
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing the circuit apparatus, method of manufactur...
- Patent number 8,166,643
- Issue date May 1, 2012
- Sanyo Electric Co., LTD
- Kiyoshi Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...
- Publication number 20180288867
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
HIGH CURRENT SWITCH
- Publication number 20170048971
- Publication date Feb 16, 2017
- ELLENBERGER & POENSGEN GMBH
- Wolfgang ULLERMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface-Treated Metal Material, Metal Foil With Carrier, Connector,...
- Publication number 20160212836
- Publication date Jul 21, 2016
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method for Making Conductive Pattern and Conductive Pattern
- Publication number 20150068787
- Publication date Mar 12, 2015
- INKTEC CO., LTD.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS FABRICATED USING CONGRUENT MOLDS
- Publication number 20140326483
- Publication date Nov 6, 2014
- International Business Machines Corporation
- Craig N. DeVarney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Surface Contact Plug Assemblies, Systems and Methods
- Publication number 20140273658
- Publication date Sep 18, 2014
- Ortronics, Inc.
- Robert A. Aekins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT CONNECTION STRUCTURE
- Publication number 20140240940
- Publication date Aug 28, 2014
- KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
- Hajime ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUSBAR CUTTING UNIT AND INTERIOR ILLUMINATION DEVICE FOR VEHICLE
- Publication number 20140137380
- Publication date May 22, 2014
- YAZAKI CORPORATION
- Manabu SAKAI
- B60 - VEHICLES IN GENERAL
Information Patent Application
Printed Circuit Boards with Deformations
- Publication number 20140055991
- Publication date Feb 27, 2014
- Forrest Starnes McCanless
- F21 - LIGHTING
Information Patent Application
CONNECTING STRUCTURE OF ELECTRONIC APPARATUS AND DISPLAY DEVICE USI...
- Publication number 20130162922
- Publication date Jun 27, 2013
- NLT TECHNOLOGIES, LTD.
- Youichirou KAMON
- G02 - OPTICS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20130072073
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT OF A MOTOR VEHICLE
- Publication number 20120319511
- Publication date Dec 20, 2012
- BROSE FAHRZEUGTEILE GMBH & CO. KG, HALLSTADT
- Alexander Kifer
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ANTENNA SHEET, DATA CARRIER WITH NON-CONTACT IC, AND METHOD FOR MA...
- Publication number 20120043386
- Publication date Feb 23, 2012
- Hiroyoshi Gotou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF
- Publication number 20110198663
- Publication date Aug 18, 2011
- EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD
- Sheng-Jia Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20110111647
- Publication date May 12, 2011
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING STRUCTURE OF ELECTRONIC APPARATUS AND DISPLAY DEVICE USI...
- Publication number 20110051068
- Publication date Mar 3, 2011
- NEC LCD Technologies, Ltd.
- YOUICHIROU KAMON
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110006420
- Publication date Jan 13, 2011
- SEIKO EPSON CORPORATION
- Shigehisa Tajimi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS
- Publication number 20100328903
- Publication date Dec 30, 2010
- PANASONIC CORPORATION
- Shotaro Nagaike
- G02 - OPTICS
Information Patent Application
METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND ME...
- Publication number 20100313416
- Publication date Dec 16, 2010
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit Board and Method for Manufacturing Semiconductor Modules an...
- Publication number 20100246140
- Publication date Sep 30, 2010
- Sanyo Electric Co., Ltd.
- Mayumi Nakasato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-BASED PRINT BOARD FORMED WITH RADIATORS
- Publication number 20100202112
- Publication date Aug 12, 2010
- Nakamura Seisakusho Kabushikigaisha
- Hideyuki MIYAHARA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING THE CIRCUIT APPARATUS, METHOD OF MANUFACTUR...
- Publication number 20100139088
- Publication date Jun 10, 2010
- Sanyo Electric Co., Ltd.
- Kiyoshi Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FITTING AN ELECTRICAL COMPONENT TO A CONTACTING ELEMENT...
- Publication number 20100084166
- Publication date Apr 8, 2010
- Norbert Knab
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
Conductor module and electromagnetic welding method
- Publication number 20100059254
- Publication date Mar 11, 2010
- YAZAKI CORPORATION
- Yoshitaka Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold for Wiring Substrate Formation and Process for Producing the S...
- Publication number 20090314525
- Publication date Dec 24, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Hitoshi Kajino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump bonding method
- Publication number 20090241337
- Publication date Oct 1, 2009
- DENSO CORPORATION
- Masaaki Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting structure and connecting method, liquid ejection head an...
- Publication number 20090211790
- Publication date Aug 27, 2009
- FUJIFILM CORPORATION
- Tsutomu Yokouchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD
- Publication number 20090122495
- Publication date May 14, 2009
- NEC Corporation
- Masahiro TAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Continuously deformed conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board with a bent connecting section and method for...

Image pickup apparatus and method for manufacturing image pickup ap...

Circuit assembly, electrical junction box, and manufacturing method...

High current switch

Method of preparing metal pattern having 3D structure

Robust multi-layer wiring elements and assemblies with embedded mic...

Multilayer wiring substrate, manufacturing method therefor, and sub...

Image pickup apparatus and image pickup apparatus manufacturing method

Method for making conductive pattern and conductive pattern

Electronic device embedded substrate and manufacturing method thereof

Electronic device and method for manufacturing the same

Electromagnetic wave shielding film and method for producing a circ...

High-frequency signal transmission line and electronic device

Method for manufacturing antenna sheet

Board integrated interconnect

Electronic device and manufacturing method for same

Printed circuit boards fabricated using congruent molds

Antenna sheet, data carrier with non-contact IC, and method for man...

Electrical component of a motor vehicle

Structure of light emitting diode and method to assemble thereof

Metallurgical clamshell methods for micro land grid array fabrication

Connecting structure of electronic apparatus and display device usi...

Metallurgical clamshell methods for micro land grid array fabrication

Electronic component mounting structure

Electrical connection box

Connecting structure of electronic apparatus and display device usi...

Conductor module and electromagnetic welding method

Circuit board and method for manufacturing semiconductor modules an...

Mounting structure of electronic component

Method of manufacturing the circuit apparatus, method of manufactur...

Patents Applicationslast 30 patents

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...

HIGH CURRENT SWITCH

Surface-Treated Metal Material, Metal Foil With Carrier, Connector,...

Method for Making Conductive Pattern and Conductive Pattern

PRINTED CIRCUIT BOARDS FABRICATED USING CONGRUENT MOLDS

Multi-Surface Contact Plug Assemblies, Systems and Methods

ELECTRONIC COMPONENT CONNECTION STRUCTURE

BUSBAR CUTTING UNIT AND INTERIOR ILLUMINATION DEVICE FOR VEHICLE

Printed Circuit Boards with Deformations

CONNECTING STRUCTURE OF ELECTRONIC APPARATUS AND DISPLAY DEVICE USI...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

ELECTRICAL COMPONENT OF A MOTOR VEHICLE

ANTENNA SHEET, DATA CARRIER WITH NON-CONTACT IC, AND METHOD FOR MA...

STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

CONNECTING STRUCTURE OF ELECTRONIC APPARATUS AND DISPLAY DEVICE USI...

SEMICONDUCTOR DEVICE

CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS

METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND ME...

Circuit Board and Method for Manufacturing Semiconductor Modules an...

METAL-BASED PRINT BOARD FORMED WITH RADIATORS

METHOD OF MANUFACTURING THE CIRCUIT APPARATUS, METHOD OF MANUFACTUR...

METHOD FOR FITTING AN ELECTRICAL COMPONENT TO A CONTACTING ELEMENT...

ELECTRONIC COMPONENT MOUNTING STRUCTURE

Conductor module and electromagnetic welding method

Mold for Wiring Substrate Formation and Process for Producing the S...

Bump bonding method

Connecting structure and connecting method, liquid ejection head an...

DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD