Cooling means

Follow

Industry

CPC
H01L2224/765

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/765Cooling means

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Ink leveling device and method of manufacturing display device usin...
- Patent number 12,113,047
- Issue date Oct 8, 2024
- Samsung Display Co., Ltd.
- Jung Hyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for cooling substrate
- Patent number 11,456,192
- Issue date Sep 27, 2022
- Semigear, Inc.
- Jonghoon Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Photoelectric conversion device and manufacturing method and appara...
- Patent number 10,950,391
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Shigehiko Mori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INK LEVELING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USIN...
- Publication number 20220223562
- Publication date Jul 14, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Reflow and Cleaning Process and Apparatus for Performing...
- Publication number 20130146647
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR