Cooling means

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H01L2224/775

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/775Cooling means

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Patents Grantslast 30 patents

Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...
- Publication number 20240379612
- Publication date Nov 14, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX BONDED INTEGRATED CIRCUITS
- Publication number 20230299035
- Publication date Sep 21, 2023
- META PLATFORMS, INC.
- Sandeep Rekhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
- Publication number 20230154889
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Manabu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS