Cooling

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CPC
H01L2224/85098

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85098Cooling

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated circuit device, method for producing or as...
- Patent number 5,031,821
- Issue date Jul 16, 1991
- Hitachi, Ltd.
- Tsuyoshi Kaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents