Cooling

Industry

CPC
H01L2224/81098

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81098Cooling

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 11,166,351
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Sin-Yeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic device
- Patent number 9,761,556
- Issue date Sep 12, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshitada Higashizawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical apparatus
- Patent number 9,640,508
- Issue date May 2, 2017
- Fujitsu Limited
- Taiki Uemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,282,650
- Issue date Mar 8, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint reflow process for reducing packaging failure rate
- Patent number 9,010,617
- Issue date Apr 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...
- Publication number 20240113068
- Publication date Apr 4, 2024
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20160211238
- Publication date Jul 21, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRICAL APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160133595
- Publication date May 12, 2016
- FUJITSU LIMITED
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...
- Publication number 20160035694
- Publication date Feb 4, 2016
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Yoshitada HIGASHIZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...
- Publication number 20130291378
- Publication date Nov 7, 2013
- Shinko Electric Industries Co., Ltd.
- Yoshitada HIGASHIZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Joint Reflow Process for Reducing Packaging Failure Rate
- Publication number 20120175403
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder reflow apparatus and method of manufacturing an electronic d...

Thermo-compression bonding system, subsystems, and methods of use

Method of manufacturing electronic device

Thermal compression bonding process cooling manifold

Electrical apparatus

Thermal compression bonding process cooling manifold

Solder joint reflow process for reducing packaging failure rate

Patents Applicationslast 30 patents

ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

ELECTRICAL APPARATUS AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...

Solder Joint Reflow Process for Reducing Packaging Failure Rate