Cooling

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H01L2224/83098

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83098Cooling

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240258267
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240063159
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASS...
- Publication number 20180308820
- Publication date Oct 25, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIE BONDING AND APPARATUS THEREOF
- Publication number 20140102616
- Publication date Apr 17, 2014
- Industrial Technology Research Institute
- Weng-Jung LU
- H01 - BASIC ELECTRIC ELEMENTS