Copper alloys

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H01L23/53233

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53233Copper alloys

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low capacitance through substrate via structures
- Patent number 12,112,995
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Deepak C. Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio via fill process employing selective metal deposi...
- Patent number 12,087,628
- Issue date Sep 10, 2024
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with conductive...
- Patent number 12,014,986
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Chin-Te Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress passivation layer
- Patent number 11,996,356
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch barrier for microelectronic packaging conductive structures
- Patent number 11,948,898
- Issue date Apr 2, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead package with wettable flanges
- Patent number 11,935,821
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, solid-state image pickup element, image picku...
- Patent number 11,923,395
- Issue date Mar 5, 2024
- Sony Group Corporation
- Yoshiaki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,868
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu3Sn via metallization in electrical devices for low-temperature 3...
- Patent number 11,854,879
- Issue date Dec 26, 2023
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device structures and double-sided electrical te...
- Patent number 11,854,894
- Issue date Dec 26, 2023
- Intel Corporation
- Valluri R. Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 11,764,176
- Issue date Sep 19, 2023
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 11,749,608
- Issue date Sep 5, 2023
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 11,735,477
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Feng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit with metal structure and manufacturing method
- Patent number 11,721,701
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 11,715,681
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal interconnection
- Patent number 11,715,689
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal configuration and semiconductor device
- Patent number 11,705,399
- Issue date Jul 18, 2023
- Rohm Co., Ltd.
- Hideaki Yanagida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress passivation layer
- Patent number 11,670,573
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned semiconductor package and related methods
- Patent number 11,646,267
- Issue date May 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive plugs of different a...
- Patent number 11,646,268
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Chin-Te Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate thermal layer for heat spreader connection
- Patent number 11,594,463
- Issue date Feb 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,574,864
- Issue date Feb 7, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,521,978
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Density-graded adhesion layer for conductors
- Patent number 11,508,676
- Issue date Nov 22, 2022
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE
- Publication number 20240332065
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Hong You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION
- Publication number 20240321636
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20240312885
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240234234
- Publication date Jul 11, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu3Sn VIA METALLIZATION IN ELECTRICAL DEVICES FOR LOW-TEMPERATURE 3...
- Publication number 20240203790
- Publication date Jun 20, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...
- Publication number 20240194533
- Publication date Jun 13, 2024
- Intel Corporation
- Valluri R. RAO
- G01 - MEASURING TESTING
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240136243
- Publication date Apr 25, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...
- Publication number 20230411299
- Publication date Dec 21, 2023
- Lodestar Licensing Group, LLC
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-METAL HYBRID INTERCONNECT
- Publication number 20230402384
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS
- Publication number 20230402515
- Publication date Dec 14, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION
- Publication number 20230395486
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20230395539
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395688
- Publication date Dec 7, 2023
- Japan Display Inc.
- Masanobu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230317608
- Publication date Oct 5, 2023
- Rohm Co., Ltd.
- Hideaki YANAGIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20230307333
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20230238327
- Publication date Jul 27, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS AND A SOLDER...
- Publication number 20230230908
- Publication date Jul 20, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...
- Publication number 20230129594
- Publication date Apr 27, 2023
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...
- Publication number 20230127904
- Publication date Apr 27, 2023
- SANDISK TECHNOLOGIES LLC
- Shingo TOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECTS WITH AN EMBEDDED DIELECTRIC CAP BETWEEN LINES
- Publication number 20230120199
- Publication date Apr 20, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20220415825
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20220406648
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...
- Publication number 20220336271
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220328407
- Publication date Oct 13, 2022
- Rohm Co., Ltd.
- Hideaki YANAGIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULE PACKAGE
- Publication number 20220262962
- Publication date Aug 18, 2022
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois BYRD
- H01 - BASIC ELECTRIC ELEMENTS

Copper alloys

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic apparatus including antennas and directors

Low capacitance through substrate via structures

High aspect ratio via fill process employing selective metal deposi...

Method for preparing semiconductor device structure with conductive...

Low-stress passivation layer

Doped selective metal caps to improve copper electromigration with...

Semiconductor device including a porous dielectric layer, and metho...

Methods and apparatus for forming dual metal interconnects

Etch barrier for microelectronic packaging conductive structures

Quad flat no-lead package with wettable flanges

Semiconductor device, solid-state image pickup element, image picku...

Semiconductor device

Cobalt based interconnects and methods of fabrication thereof

Cu3Sn via metallization in electrical devices for low-temperature 3...

Integrated circuit device structures and double-sided electrical te...

Semiconductor structure including buffer layer

Semiconductor device including bonding pad metal layer structure

Device packages including redistribution layers with carbon-based c...

Method of semiconductor integrated circuit fabrication

Semiconductor circuit with metal structure and manufacturing method

Fan-out package structure and method

Method of forming metal interconnection

Terminal configuration and semiconductor device

Low-stress passivation layer

Thinned semiconductor package and related methods

Semiconductor device structure with conductive plugs of different a...

Substrate thermal layer for heat spreader connection

Semiconductor device including a porous dielectric layer, and metho...

Semiconductor device and method for fabricating the same

Density-graded adhesion layer for conductors

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

SEMICONDUCTOR STRUCTURE

Power Semiconductor Devices Including Beryllium Metallization

INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE

METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION

LOW-STRESS PASSIVATION LAYER

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

Cu3Sn VIA METALLIZATION IN ELECTRICAL DEVICES FOR LOW-TEMPERATURE 3...

INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...

GRAPHENE-METAL HYBRID INTERCONNECT

METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS

BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION

Semiconductor Device Including Bonding Pad Metal Layer Structure

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR DEVICE

LOW-STRESS PASSIVATION LAYER

THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS

PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS AND A SOLDER...

HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...

HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...

COPPER INTERCONNECTS WITH AN EMBEDDED DIELECTRIC CAP BETWEEN LINES

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...

SEMICONDUCTOR DEVICE

OPTOELECTRONIC MODULE PACKAGE