Copper (Cu) as principal constituent

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H01L2224/45647

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45647Copper (Cu) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,532,590
- Issue date Dec 20, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper structure
- Patent number 10,937,720
- Issue date Mar 2, 2021
- Infineon Technologies Austria AG
- Silvia Larisegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding systems and related methods
- Patent number 10,535,623
- Issue date Jan 14, 2020
- Semiconductor Components Industries, LLC
- Wentao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,461,055
- Issue date Oct 29, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 10,374,136
- Issue date Aug 6, 2019
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire ball bonding in semiconductor devices
- Patent number 10,340,246
- Issue date Jul 2, 2019
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,236,272
- Issue date Mar 19, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 10,115,876
- Issue date Oct 30, 2018
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding systems and related methods
- Patent number 10,109,610
- Issue date Oct 23, 2018
- Semiconductor Components Industries, LLC
- Wentao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based alloy wire and methods for manufaturing the same
- Patent number 9,997,488
- Issue date Jun 12, 2018
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated bond wires for die packages and methods of manufacturing sai...
- Patent number 9,997,489
- Issue date Jun 12, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binding wire and semiconductor package structure using the same
- Patent number 9,960,141
- Issue date May 1, 2018
- Beijing FUNATE Innovation Technology Co., Ltd.
- Yu-Quan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding structure
- Patent number 9,799,624
- Issue date Oct 24, 2017
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 9,583,688
- Issue date Feb 28, 2017
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including a heat dissipating member
- Patent number 9,437,517
- Issue date Sep 6, 2016
- Panasonic Corporation
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating layer for a conductive structure
- Patent number 9,337,164
- Issue date May 10, 2016
- Freescale Semiconductors, Inc.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor module, method for producing a power semiconduc...
- Patent number 9,214,442
- Issue date Dec 15, 2015
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 8,901,569
- Issue date Dec 2, 2014
- Nippon Steel & Sumitomo Metal Corporation
- Hosei Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,610,291
- Issue date Dec 17, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the miniaturizable contacting of insulated wires
- Patent number 8,418,911
- Issue date Apr 16, 2013
- Thorsten Meiss
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, relay member, and mounting substrate, and method...
- Patent number 8,304,870
- Issue date Nov 6, 2012
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof for effecti...
- Patent number 8,242,594
- Issue date Aug 14, 2012
- Unimicron Technology Corp.
- Chung-Pan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,156,643
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and system for composite bond wires
- Patent number 8,134,073
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
- Publication number 20240258288
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI WIRING MATERIAL
- Publication number 20240105668
- Publication date Mar 28, 2024
- NIPPON MICROMETAL CORPORATION
- Yuto KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200328178
- Publication date Oct 15, 2020
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL WIRE
- Publication number 20190385969
- Publication date Dec 19, 2019
- The Charles Stark Draper Laboratory, Inc.
- Caprice Gray Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Copper Structure
- Publication number 20190304884
- Publication date Oct 3, 2019
- Silvia Larisegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BALL BONDING IN SEMICONDUCTOR DEVICES
- Publication number 20190221537
- Publication date Jul 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170271296
- Publication date Sep 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170125370
- Publication date May 4, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170117244
- Publication date Apr 27, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20170053888
- Publication date Feb 23, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20160307865
- Publication date Oct 20, 2016
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BINDING WIRE AND SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME
- Publication number 20150311174
- Publication date Oct 29, 2015
- BEIJING FUNATE INNOVATION TECHNOLOGY CO., LTD.
- YU-QUAN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS INCLUDING A HEAT DISSIPATING MEMBER
- Publication number 20150303125
- Publication date Oct 22, 2015
- PANASONIC CORPORATION
- TAKAO OCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING LAYER FOR A CONDUCTIVE STRUCTURE
- Publication number 20150214177
- Publication date Jul 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...
- Publication number 20140264783
- Publication date Sep 18, 2014
- Altera Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...
- Publication number 20140264426
- Publication date Sep 18, 2014
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME
- Publication number 20140209215
- Publication date Jul 31, 2014
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CORE WIRE
- Publication number 20130319726
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Chin Teck Siong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CONNECTING PLANAR POWER ELECTRONICS DEVICES
- Publication number 20130294042
- Publication date Nov 7, 2013
- Guo-Quan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20120305945
- Publication date Dec 6, 2012
- Hosei Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER CORE WIRE
- Publication number 20120073859
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE MINIATURIZABLE CONTACTING OF INSULATED WIRES
- Publication number 20110303341
- Publication date Dec 15, 2011
- Thorsten Meiss
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Copper (Cu) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with copper structure

Cu alloy core bonding wire with Pd coating for semiconductor device

Wire bonding systems and related methods

Cu alloy core bonding wire with Pd coating for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Light emitting apparatus

Wire ball bonding in semiconductor devices

Cu alloy core bonding wire with Pd coating for semiconductor device

Light emitting device mount, leadframe, and light emitting apparatus

Wire bonding systems and related methods

Copper-based alloy wire and methods for manufaturing the same

Coated bond wires for die packages and methods of manufacturing sai...

Binding wire and semiconductor package structure using the same

Wire bonding method and wire bonding structure

Light emitting device mount, leadframe, and light emitting apparatus

Semiconductor apparatus including a heat dissipating member

Coating layer for a conductive structure

Reliable wire method

Power semiconductor module, method for producing a power semiconduc...

Power semiconductor device, method of manufacturing the device and...

Power semiconductor device

Reliable wire structure and method

Copper alloy bonding wire for semiconductor device

Connecting wire and method for manufacturing same

Method for the miniaturizable contacting of insulated wires

Electronic device, relay member, and mounting substrate, and method...

Chip package structure and manufacturing method thereof for effecti...

Semiconductor device

Method and system for composite bond wires

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT

AI WIRING MATERIAL

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

COAXIAL WIRE

Semiconductor Device with Copper Structure

WIRE BALL BONDING IN SEMICONDUCTOR DEVICES

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

LIGHT EMITTING APPARATUS

WIRE BONDING SYSTEMS AND RELATED METHODS

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

WIRE BONDING SYSTEMS AND RELATED METHODS

BINDING WIRE AND SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

SEMICONDUCTOR APPARATUS INCLUDING A HEAT DISSIPATING MEMBER

COATING LAYER FOR A CONDUCTIVE STRUCTURE

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...

LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...

COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME

RELIABLE WIRE STRUCTURE AND METHOD

MULTI-CORE WIRE

METHODS AND APPARATUS FOR CONNECTING PLANAR POWER ELECTRONICS DEVICES

RELIABLE WIRE STRUCTURE AND METHOD

POWER SEMICONDUCTOR DEVICE

POLYMER CORE WIRE

METHOD FOR THE MINIATURIZABLE CONTACTING OF INSULATED WIRES