Copper [Cu] as principal constituent

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H01L2224/29247

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29247Copper [Cu] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,923,270
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Tatsuya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member connection method
- Patent number 11,887,960
- Issue date Jan 30, 2024
- Resonac Corporation
- Motohiro Negishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,856,828
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and substrate with dimple region
- Patent number 11,842,968
- Issue date Dec 12, 2023
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material and method for die attachment
- Patent number 11,842,974
- Issue date Dec 12, 2023
- Alpha Assembly Solutions Inc.
- Angelo Gulino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste
- Patent number 11,817,398
- Issue date Nov 14, 2023
- Namics Corporation
- Masashi Kajita
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal particle aggregates, method for producing same, paste-like me...
- Patent number 11,801,556
- Issue date Oct 31, 2023
- Mitsubishi Materials Corporation
- Tomohiko Yamaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module of double-faced cooling
- Patent number 11,735,557
- Issue date Aug 22, 2023
- LG MAGNA E-POWERTRAIN CO., LTD.
- Siho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal member made of plurality of metal layers between two heat...
- Patent number 11,710,709
- Issue date Jul 25, 2023
- Denso Corporation
- Ryoichi Kaizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,676,936
- Issue date Jun 13, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet and composite sheet
- Patent number 11,634,611
- Issue date Apr 25, 2023
- Nitto Denko Corporation
- Nao Kamakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,594,513
- Issue date Feb 28, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinter sheet, semiconductor device and manufacturing method thereof
- Patent number 11,557,563
- Issue date Jan 17, 2023
- Denso Corporation
- Tomohito Iwashige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 11,532,588
- Issue date Dec 20, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and bonding material
- Patent number 11,515,281
- Issue date Nov 29, 2022
- Panasonic Holdings Corporation
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure and nanoparticle mounting material
- Patent number 11,515,280
- Issue date Nov 29, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyohiro Hine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device, sintered metal sheet, and method for manufact...
- Patent number 11,437,338
- Issue date Sep 6, 2022
- Hitachi, Ltd.
- Tomohisa Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and manufacturing method for power semic...
- Patent number 11,342,281
- Issue date May 24, 2022
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of copper surfaces using copper sintering material
- Patent number 11,329,023
- Issue date May 10, 2022
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material for semiconductor device
- Patent number 11,145,615
- Issue date Oct 12, 2021
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,145,706
- Issue date Oct 12, 2021
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device package
- Patent number 11,094,865
- Issue date Aug 17, 2021
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Byung Yeon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-LED chips and methods for manufacturing the same and display...
- Patent number 11,081,632
- Issue date Aug 3, 2021
- CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
- Feng Zhai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20250084286
- Publication date Mar 13, 2025
- OSAKA SODA CO., LTD.
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230130647
- Publication date Apr 27, 2023
- DENSO CORPORATION
- Tetsuto YAMAGISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
- Publication number 20220254738
- Publication date Aug 11, 2022
- Mitsubishi Electric Corporation
- Kohei YABUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING MATERIAL FOR BONDING OVERLAPPING COMPONENTS OF POWER ELECTR...
- Publication number 20220230984
- Publication date Jul 21, 2022
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Ming Liu
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093485
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Tatsuya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220093719
- Publication date Mar 24, 2022
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diffusion Soldering with Contaminant Protection
- Publication number 20220084981
- Publication date Mar 17, 2022
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE
- Publication number 20220045026
- Publication date Feb 10, 2022
- NAMICS CORPORATION
- Masashi KAJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20220028820
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20210407953
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE
- Publication number 20210335691
- Publication date Oct 28, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL
- Publication number 20210320082
- Publication date Oct 14, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE OF DOUBLE-FACED COOLING
- Publication number 20210305193
- Publication date Sep 30, 2021
- LG ELECTRONICS INC.
- Siho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SINTERED METAL SHEET, AND METHOD FOR MANUFACT...
- Publication number 20210265298
- Publication date Aug 26, 2021
- Hitachi, Ltd
- Tomohisa SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210242165
- Publication date Aug 5, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20210143121
- Publication date May 13, 2021
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...
- Publication number 20210129245
- Publication date May 6, 2021
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210098418
- Publication date Apr 1, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PARTICLE AGGREGATES, METHOD FOR PRODUCING SAME, PASTE-LIKE ME...
- Publication number 20210050319
- Publication date Feb 18, 2021
- MITSUBISHI MATERIALS CORPORATION
- Tomohiko Yamaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200403054
- Publication date Dec 24, 2020
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200402944
- Publication date Dec 24, 2020
- DENSO CORPORATION
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND BONDING MATERIAL
- Publication number 20200335470
- Publication date Oct 22, 2020
- PANASONIC CORPORATION
- Akio FURUSAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20200303337
- Publication date Sep 24, 2020
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...
- Publication number 20200251641
- Publication date Aug 6, 2020
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
- Publication number 20200251423
- Publication date Aug 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Kohei YABUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20200203304
- Publication date Jun 25, 2020
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL
- Publication number 20200185347
- Publication date Jun 11, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIRO HINE
- B22 - CASTING POWDER METALLURGY

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Diffusion soldering with contaminant protection

Semiconductor device

Member connection method

Display device and method of manufacturing the same

Power semiconductor device and substrate with dimple region

Solder material and method for die attachment

Conductive paste

Semiconductor element bonding structure, method for producing semic...

Metal particle aggregates, method for producing same, paste-like me...

Semiconductor device including a solder compound containing a compo...

Power module of double-faced cooling

Terminal member made of plurality of metal layers between two heat...

Manufacturing method for semiconductor device

Electroconductive film, roll, connected structure, and process for...

Sheet and composite sheet

Method of manufacturing semiconductor having double-sided substrate

Diffusion soldering with contaminant protection

Manufacturing method for semiconductor device

Sinter sheet, semiconductor device and manufacturing method thereof

Copper paste for pressureless bonding, bonded body and semiconducto...

Bonded structure and bonding material

Mounting structure and nanoparticle mounting material

Metal paste for joints, assembly, production method for assembly, s...

Semiconductor device, sintered metal sheet, and method for manufact...

Power semiconductor device and manufacturing method for power semic...

Interconnection of copper surfaces using copper sintering material

Solder material for semiconductor device

Display device and method of manufacturing the same

Semiconductor device and semiconductor device package

Micro-LED chips and methods for manufacturing the same and display...

Patents Applicationslast 30 patents

ELECTROCONDUCTIVE ADHESIVE

POWER MODULE AND POWER CONVERSION APPARATUS

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

JOINING MATERIAL FOR BONDING OVERLAPPING COMPONENTS OF POWER ELECTR...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Diffusion Soldering with Contaminant Protection

CONDUCTIVE PASTE

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE

INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL

POWER MODULE OF DOUBLE-FACED COOLING

SEMICONDUCTOR DEVICE, SINTERED METAL SHEET, AND METHOD FOR MANUFACT...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

METAL PARTICLE AGGREGATES, METHOD FOR PRODUCING SAME, PASTE-LIKE ME...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SINTER SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BONDED STRUCTURE AND BONDING MATERIAL

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL