Copper [Cu] as principal constituent

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H01L2224/13447

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13447Copper [Cu] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particle and articles formed therefrom
- Patent number 10,507,551
- Issue date Dec 17, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal particle and electroconductive paste formed therefrom
- Patent number 10,478,924
- Issue date Nov 19, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particles having intermetallic compound nano-composite struct...
- Patent number 10,016,848
- Issue date Jul 10, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction and electrical connection
- Patent number 9,142,518
- Issue date Sep 22, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic conductive resin, and electronic device including elastic c...
- Patent number 7,875,807
- Issue date Jan 25, 2011
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM
- Publication number 20180311771
- Publication date Nov 1, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE AND ARTICLES FORMED THEREFROM
- Publication number 20180290243
- Publication date Oct 11, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE
- Publication number 20170282302
- Publication date Oct 5, 2017
- NAPRA CO., LTD.
- Shigenobu SEKINE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...
- Publication number 20070132098
- Publication date Jun 14, 2007
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Elastic conductive resin, and electronic device including elastic c...
- Publication number 20040108133
- Publication date Jun 10, 2004
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Engineered polymer-based electronic materials

Metal particle and articles formed therefrom

Metal particle and electroconductive paste formed therefrom

Structures and methods to enable a full intermetallic interconnect

Metal particles having intermetallic compound nano-composite struct...

Magnetic intermetallic compound interconnect

Junction and electrical connection

Elastic conductive resin, and electronic device including elastic c...

Patents Applicationslast 30 patents

METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM

METAL PARTICLE AND ARTICLES FORMED THEREFROM

METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE

FORMATION OF CONDUCTIVE CIRCUIT

ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...

Elastic conductive resin, and electronic device including elastic c...