Copper [Cu] as principal constituent

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CPC
H01L2224/29447

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29447Copper [Cu] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,024,439
- Issue date Jun 1, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,017,916
- Issue date May 25, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,546,831
- Issue date Jan 28, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device having the same
- Patent number 10,236,271
- Issue date Mar 19, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Yukie Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,865,558
- Issue date Jan 9, 2018
- Samsung SDI Co., Ltd.
- Young Ju Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 9,613,934
- Issue date Apr 4, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
- Patent number 9,536,851
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film including conductive adhesive layer and...
- Patent number 9,490,228
- Issue date Nov 8, 2016
- Cheil Industries, Inc.
- Kyoung Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film adhesive, dicing tape with film adhesive, method of manufactur...
- Patent number 9,484,240
- Issue date Nov 1, 2016
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive adhesive film
- Patent number 9,437,346
- Issue date Sep 6, 2016
- Cheil Industries, Inc.
- Kyoung Hun Shin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Light-reflective conductive particle, anisotropic conductive adhesi...
- Patent number 9,340,710
- Issue date May 17, 2016
- Dexerials Corporation
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connection device, method for manufacturing connection structure, m...
- Patent number 9,196,599
- Issue date Nov 24, 2015
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including thermal comp...
- Patent number 9,171,820
- Issue date Oct 27, 2015
- Cheil Industries, Inc.
- Kil Yong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Junction and electrical connection
- Patent number 9,142,518
- Issue date Sep 22, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and electronic device including the same
- Patent number 9,048,240
- Issue date Jun 2, 2015
- Cheil Industries, Inc.
- Young Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-reflective conductive particle, anisotropic conductive adhesi...
- Patent number 8,975,654
- Issue date Mar 10, 2015
- Dexerials Corporation
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Contacting means and method for contacting electrical components
- Patent number 8,925,789
- Issue date Jan 6, 2015
- Heraeus Materials Technology GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device bonded by an anisotropic conductive film
- Patent number 8,896,117
- Issue date Nov 25, 2014
- Cheil Industries, Inc.
- Youn Jo Ko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR METHOD AND APPARATUS
- Publication number 20240096745
- Publication date Mar 21, 2024
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant Electronic Component Interconnection
- Publication number 20220052012
- Publication date Feb 17, 2022
- Paricon Technologies Corporation
- Larre H. Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE
- Publication number 20180297154
- Publication date Oct 18, 2018
- Sekisui Chemical Co., Ltd
- Mai YAMAGAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Electrically Conductive Film and Connection Structure
- Publication number 20180301432
- Publication date Oct 18, 2018
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...
- Publication number 20170271299
- Publication date Sep 21, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- HONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...
- Publication number 20170004901
- Publication date Jan 5, 2017
- TRILLION SCIENCE, INC.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20140319684
- Publication date Oct 30, 2014
- Yukie SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...
- Publication number 20140231983
- Publication date Aug 21, 2014
- Yuki SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20140225144
- Publication date Aug 14, 2014
- DEXERIALS CORPORATION
- Hidetsugu NAMIKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179065
- Publication date Jun 26, 2014
- Kil Yong LEE
- G02 - OPTICS
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20140103266
- Publication date Apr 17, 2014
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM
- Publication number 20140097548
- Publication date Apr 10, 2014
- Kyoung Hun SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20130168847
- Publication date Jul 4, 2013
- Young Woo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMP...
- Publication number 20130154095
- Publication date Jun 20, 2013
- Arum YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BONDED BY AN ANISOTROPIC CONDUCTIVE FILM
- Publication number 20130127038
- Publication date May 23, 2013
- Youn Jo KO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20130105841
- Publication date May 2, 2013
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...
- Publication number 20120292087
- Publication date Nov 22, 2012
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20120175660
- Publication date Jul 12, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hidetsugu Namiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...
- Publication number 20120118480
- Publication date May 17, 2012
- Kyung-Wook PAIK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...
- Publication number 20120106111
- Publication date May 3, 2012
- JOSEPH MAZZOCHETTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for filling a contact hole in a chip package arrangement an...
- Publication number 20120061845
- Publication date Mar 15, 2012
- INFINEON TECHNOLOGIES AG
- Benjamin Alles
- H01 - BASIC ELECTRIC ELEMENTS

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transient liquid phase bonding compositions and power electronics a...

Hybrid bonding structures and semiconductor devices including the same

Anisotropic conductive film and display device using the same

Alternative compositions for high temperature soldering applications

Particles, connecting material and connection structure

Particles, connecting material and connection structure

Anisotropic electrically conductive film and connection structure

Anisotropic electrically conductive film and connection structure

Engineered polymer-based electronic materials

Nanoscale interconnect array for stacked dies

Anisotropic electrically conductive film and connection structure

Method for soldering surface-mount component and surface-mount comp...

Electronic device including soldered surface-mount component

Semiconductor device and electronic device having the same

Anisotropic conductive film and display device using the same

Semiconductor device connected by anisotropic conductive film

Interconnect structures with polymer core

Preform structure for soldering a semiconductor chip arrangement, a...

Anisotropic conductive film including conductive adhesive layer and...

Film adhesive, dicing tape with film adhesive, method of manufactur...

Semiconductor device connected by anisotropic conductive adhesive film

Light-reflective conductive particle, anisotropic conductive adhesi...

Connection device, method for manufacturing connection structure, m...

Method of manufacturing semiconductor device including thermal comp...

Junction and electrical connection

Anisotropic conductive film and electronic device including the same

Circuit component and method of making the same

Light-reflective conductive particle, anisotropic conductive adhesi...

Contacting means and method for contacting electrical components

Semiconductor device bonded by an anisotropic conductive film

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR METHOD AND APPARATUS

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

Compliant Electronic Component Interconnection

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

Anisotropic Electrically Conductive Film and Connection Structure

ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...

FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

INTERCONNECT STRUCTURES WITH POLYMER CORE

FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM

ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMP...

SEMICONDUCTOR DEVICE BONDED BY AN ANISOTROPIC CONDUCTIVE FILM

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...

Methods for filling a contact hole in a chip package arrangement an...