Copper [Cu] as principal constituent

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H01L2224/13947

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13947Copper [Cu] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,397,063
- Issue date Jul 19, 2016
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,030,001
- Issue date May 12, 2015
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 8,580,607
- Issue date Nov 12, 2013
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20140077351
- Publication date Mar 20, 2014
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20120025365
- Publication date Feb 2, 2012
- Tessera Research LLC
- Belgacem Haba
- B82 - NANO-TECHNOLOGY