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Copper [Cu] as principal constituent
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CPC
H01L2224/29747
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/29747
Copper [Cu] as principal constituent
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Patent Application
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
Publication number
20180315729
Publication date
Nov 1, 2018
NITTO DENKO CORPORATION
Yuki Sugo
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...