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Copper [Cu] as principal constituent
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CPC
H01L2224/13747
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/13747
Copper [Cu] as principal constituent
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last 30 patents
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Patent Grant
Chip packages with sintered interconnects formed out of pads
Patent number
10,777,496
Issue date
Sep 15, 2020
International Business Machines Corporation
Thomas J. Brunschwiler
H01 - BASIC ELECTRIC ELEMENTS