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Copper [Cu] as principal constituent

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  • CPC
  • H01L2224/37347
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/37347Copper [Cu] as principal constituent
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device
    • Patent number 10,840,166
    • Issue date Nov 17, 2020
    • Kabushiki Kaisha Toshiba
    • Kumiko Karouji
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents