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Copper (Cu) as principal constituent
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CPC
H01L2224/85547
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/85547
Copper (Cu) as principal constituent
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last 30 patents
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Patent Grant
Electronic device and method for fabricating an electronic device
Patent number
9,355,984
Issue date
May 31, 2016
Infineon Technologies AG
Irmgard Escher-Poeppel
H01 - BASIC ELECTRIC ELEMENTS