Copper [Cu] as principal constituent

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H01L2224/05447

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05447Copper [Cu] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Bottom up electroplating with release layer
- Patent number 10,957,628
- Issue date Mar 23, 2021
- Corning Incorporated
- Robert Alan Bellman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240145416
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Wonyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM UP ELECTROPLATING WITH RELEASE LAYER
- Publication number 20200111726
- Publication date Apr 9, 2020
- Corning Incorporated
- Robert Alan Bellman
- H01 - BASIC ELECTRIC ELEMENTS