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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14179Corner adaptations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint connection of corner non-critical to function (NCTF) ball for...
- Patent number 11,990,395
- Issue date May 21, 2024
- Intel Corporation
- Xiaoying Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum processor design to increase control footprint
- Patent number 11,991,934
- Issue date May 21, 2024
- Google LLC
- Evan Jeffrey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 11,791,252
- Issue date Oct 17, 2023
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 11,658,153
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad design for reliability enhancement in packages
- Patent number 11,600,587
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum processor design to increase control footprint
- Patent number 11,538,976
- Issue date Dec 27, 2022
- Google LLC
- Evan Jeffrey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
IC package design and methodology to compensate for die-substrate C...
- Patent number 11,495,568
- Issue date Nov 8, 2022
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 11,329,022
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device comprising forming an i...
- Patent number 11,244,910
- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 11,139,229
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package design and methodology to compensate for die-substrate C...
- Patent number 10,943,882
- Issue date Mar 9, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump structure for semiconductor package assemblies
- Patent number 10,879,203
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad design for reliability enhancement in packages
- Patent number 10,833,031
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,734,347
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 10,685,936
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,672,721
- Issue date Jun 2, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,729
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 10,381,297
- Issue date Aug 13, 2019
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light receiving element and light receiving device
- Patent number 10,319,778
- Issue date Jun 11, 2019
- Sumitomo Electric Industries, Ltd.
- Daisuke Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,290,600
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad design for reliability enhancement in packages
- Patent number 10,269,745
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,177,098
- Issue date Jan 8, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20230253370
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220392979
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sang Duk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME
- Publication number 20220336427
- Publication date Oct 20, 2022
- Seoul Viosys Co., Ltd.
- Jong Min JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT CONNECTION OF CORNER NON-CRITICAL TO FUNCTION (NCTF) BALL FOR...
- Publication number 20220122907
- Publication date Apr 21, 2022
- Intel Corporation
- Xiaoying TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...
- Publication number 20210151403
- Publication date May 20, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...
- Publication number 20210066227
- Publication date Mar 4, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20200286863
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Design For Reliability Enhancement in Packages
- Publication number 20190259720
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20190259724
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20190157238
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20190103368
- Publication date Apr 4, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RECEIVING ELEMENT AND LIGHT RECEIVING DEVICE
- Publication number 20180342545
- Publication date Nov 29, 2018
- Sumitomo Electric Industries, Ltd.
- Daisuke Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20180315689
- Publication date Nov 1, 2018
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTING SEMICONDUCTOR COMPONENTS
- Publication number 20180211935
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180033757
- Publication date Feb 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170092609
- Publication date Mar 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20170005067
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20160343690
- Publication date Nov 24, 2016
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Configured for Connection to a Board
- Publication number 20160329292
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE, WAFER LEVEL CHIP PACKAGE STRUCTURE AN...
- Publication number 20160315067
- Publication date Oct 27, 2016
- CHIPMOS TECHNOLOGIES INC.
- Shih-Wen Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LOW STRESS REGION FOR AN ELECTRONIC COMPONENT
- Publication number 20160204089
- Publication date Jul 14, 2016
- FREESCALE SEMICONDUCTOR, INC.
- PAIGE M. HOLM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT CRACK MONITOR CIRCUIT
- Publication number 20150276854
- Publication date Oct 1, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Stanley A. Cejka
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361430
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140306343
- Publication date Oct 16, 2014
- XINTEC INC.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Corner adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure

Package-on-package semiconductor assemblies and methods of manufact...

Joint connection of corner non-critical to function (NCTF) ball for...

Quantum processor design to increase control footprint

Package-on-package semiconductor assemblies and methods of manufact...

Forming recesses in molding compound of wafer to reduce stress

Pad design for reliability enhancement in packages

Quantum processor design to increase control footprint

IC package design and methodology to compensate for die-substrate C...

Chip package structure

Packages for semiconductor devices, packaged semiconductor devices,...

Method for fabricating an electronic device comprising forming an i...

Package-on-package semiconductor assemblies and methods of manufact...

Surface mounting semiconductor components

IC package design and methodology to compensate for die-substrate C...

Stud bump structure for semiconductor package assemblies

Mechanisms for forming hybrid bonding structures with elongated bumps

Chip package structure and method for forming the same

Pad design for reliability enhancement in packages

Dummy flip chip bumps for reducing stress

Forming recesses in molding compound of wafer to reduce stress

Method for fabricating an electronic device and a stacked electroni...

Semiconductor method for forming semiconductor structure having bum...

Semiconductor package

Package-on-package semiconductor assemblies and methods of manufact...

Light receiving element and light receiving device

Semiconductor structure having bump on tilting upper corner surface

Dummy flip chip bumps for reducing stress

Pad design for reliability enhancement in packages

Method for fabricating an electronic device and a stacked electroni...

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

Forming Recesses in Molding Compound of Wafer to Reduce Stress

DISPLAY DEVICE

CHIP PACKAGE STRUCTURE

UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

JOINT CONNECTION OF CORNER NON-CRITICAL TO FUNCTION (NCTF) BALL FOR...

IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...

CHIP PACKAGE STRUCTURE

IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...

Forming Recesses in Molding Compound of Wafer to Reduce Stress

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Pad Design For Reliability Enhancement in Packages

Dummy Flip Chip Bumps for Reducing Stress

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

LIGHT RECEIVING ELEMENT AND LIGHT RECEIVING DEVICE

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

Semiconductor Package Configured for Connection to a Board

MULTI-CHIP PACKAGE STRUCTURE, WAFER LEVEL CHIP PACKAGE STRUCTURE AN...

PACKAGE WITH LOW STRESS REGION FOR AN ELECTRONIC COMPONENT

INTEGRATED CIRCUIT INTERCONNECT CRACK MONITOR CIRCUIT

SEMICONDUCTOR DEVICE

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME