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  • H01L2224/33179
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/33179Corner adaptations
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240371742
    • Publication date Nov 7, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chin-Hua Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE WITH PROTECTIVE LID
    • Publication number 20240250055
    • Publication date Jul 25, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Tsung KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230115745
    • Publication date Apr 13, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chin-Hua Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220310501
    • Publication date Sep 29, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chin-Hua Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
    • Publication number 20220278069
    • Publication date Sep 1, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Tsung KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...
    • Publication number 20200043887
    • Publication date Feb 6, 2020
    • MITSUBISHI ELECTRIC CORPORATION
    • Shohei OGAWA
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
    • Publication number 20160284958
    • Publication date Sep 29, 2016
    • G-SMATT CO., LTD.
    • Hak Ryul SHIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
    • Publication number 20120111617
    • Publication date May 10, 2012
    • PANASONIC CORPORATION
    • Koji Motomura
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...