covering only portions of the surface to be connected

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H01L2224/06134

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06134covering only portions of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated circuit device including opposite facing I...
- Patent number 11,990,464
- Issue date May 21, 2024
- SOCIONEXT INC.
- Toru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,374
- Issue date Apr 11, 2023
- Renesas Electronics Corporation
- Tatsuaki Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power island segmentation for selective bond-out
- Patent number 11,211,329
- Issue date Dec 28, 2021
- Kioxia Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,964,659
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,818,623
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on glass package assembly
- Patent number 10,692,815
- Issue date Jun 23, 2020
- Novatek Microelectronics Corp.
- Wei-Kuo Mai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power island segmentation for selective bond-out
- Patent number 10,629,533
- Issue date Apr 21, 2020
- TOSHIBA MEMORY CORPORATION
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,475,760
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die interface configuration and methods of use thereof
- Patent number 10,424,921
- Issue date Sep 24, 2019
- QUALCOMM Incorporated
- Kenneth Dubowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for a microelectronic device
- Patent number 10,366,968
- Issue date Jul 30, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,325,871
- Issue date Jun 18, 2019
- Samsung Display Co., Ltd.
- Hae-Kwan Seo
- G02 - OPTICS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,249,586
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,831,205
- Issue date Nov 28, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with low stress region for an electronic component
- Patent number 9,818,712
- Issue date Nov 14, 2017
- NXP USA, INC.
- Paige M. Holm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level device and method with cantilever pillar structure
- Patent number 9,806,047
- Issue date Oct 31, 2017
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 9,543,231
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Yun-seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting and driving load using transistor
- Patent number 9,515,650
- Issue date Dec 6, 2016
- Renesas Electronics Corporation
- Sakae Nakajima
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,437,490
- Issue date Sep 6, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,437,586
- Issue date Sep 6, 2016
- Samsung Electronics Co., Ltd.
- Min gi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods of forming the same
- Patent number 9,324,668
- Issue date Apr 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Luan C. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting and driving load using MOS transistor
- Patent number 9,300,279
- Issue date Mar 29, 2016
- Renesas Electronics Corporation
- Sakae Nakajima
- G01 - MEASURING TESTING
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die fracture detection and humidity protection with double guard ri...
- Patent number 9,070,683
- Issue date Jun 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jason R. Fender
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package and physical layer interface arrangement
- Patent number 8,912,656
- Issue date Dec 16, 2014
- Via Technologies, Inc.
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package
- Patent number 8,829,648
- Issue date Sep 9, 2014
- Fuji Xerox Co., Ltd.
- Daisuke Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of fabricating a pad structure for a semicondu...
- Patent number 8,581,250
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having offset passivation to reduce electro...
- Patent number 8,487,447
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of a semiconductor package including chips bonded to die...
- Patent number 5,965,947
- Issue date Oct 12, 1999
- Samsung Electronics Co., Ltd.
- Shi-baek Nam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240274582
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
- Publication number 20240071998
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVE CHIP AND DISPLAY PANEL
- Publication number 20240038700
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Semiconductor Device And Method For Forming The Same
- Publication number 20220277127
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Han Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT
- Publication number 20200227353
- Publication date Jul 16, 2020
- Toshiba Memory Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200075525
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JIE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20190333886
- Publication date Oct 31, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT
- Publication number 20190287906
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON GLASS PACKAGE ASSEMBLY
- Publication number 20190057938
- Publication date Feb 21, 2019
- NOVATEK MICROELECTRONICS CORP.
- Wei-Kuo Mai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED UBM AND MIXED PITCH ON A SINGLE DIE
- Publication number 20180331056
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-to-Die Interface Configuration and Methods of Use Thereof
- Publication number 20180233907
- Publication date Aug 16, 2018
- QUALCOMM Incorporated
- Kenneth Dubowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20180096970
- Publication date Apr 5, 2018
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180082970
- Publication date Mar 22, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JIE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Fracture Detection and Humidity Protection with Double Guard Ri...
- Publication number 20140375341
- Publication date Dec 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jason R. Fender
- G01 - MEASURING TESTING
Information Patent Application
Bonding Structures and Methods of Forming the Same
- Publication number 20140252635
- Publication date Sep 11, 2014
- Luan C. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20130228895
- Publication date Sep 5, 2013
- FUJI XEROX CO., LTD
- Daisuke IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SEMICONDUCTOR PACKAGE
- Publication number 20130020690
- Publication date Jan 24, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Shunan QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTRO...
- Publication number 20120292779
- Publication date Nov 22, 2012
- International Business Machines Corporation
- MARIO J. INTERRANTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF FABRICATING A PAD STRUCTURE FOR A SEMICONDU...
- Publication number 20120161129
- Publication date Jun 28, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT
- Publication number 20120126398
- Publication date May 24, 2012
- VIA TECHNOLOGIES, INC.
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window-type ball grid array semiconductor package
- Publication number 20040061222
- Publication date Apr 1, 2004
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS

covering only portions of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor integrated circuit device including opposite facing I...

Semiconductor device

Mixed UBM and mixed pitch on a single die

Power island segmentation for selective bond-out

Semiconductor device

Mixed UBM and mixed pitch on a single die

Chip on glass package assembly

Power island segmentation for selective bond-out

Semiconductor device

Die-to-die interface configuration and methods of use thereof

Interconnect structure for a microelectronic device

Display device

Mixed UBM and mixed pitch on a single die

Semiconductor device and manufacturing method thereof

Package with low stress region for an electronic component

Wafer level device and method with cantilever pillar structure

Stacked semiconductor package

Detecting and driving load using transistor

Semiconductor device and manufacturing method thereof

Semiconductor package and method of fabricating the same

Bonding structures and methods of forming the same

Detecting and driving load using MOS transistor

Chip-on-wafer bonding method and bonding device, and structure comp...

Die fracture detection and humidity protection with double guard ri...

Integrated circuit package and physical layer interface arrangement

Package substrate and semiconductor package

Method and apparatus of fabricating a pad structure for a semicondu...

Semiconductor structure having offset passivation to reduce electro...

Structure of a semiconductor package including chips bonded to die...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

DRIVE CHIP AND DISPLAY PANEL

Bonded Semiconductor Device And Method For Forming The Same

POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT

CHIP ON GLASS PACKAGE ASSEMBLY

MIXED UBM AND MIXED PITCH ON A SINGLE DIE

Die-to-Die Interface Configuration and Methods of Use Thereof

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

Die Fracture Detection and Humidity Protection with Double Guard Ri...

Bonding Structures and Methods of Forming the Same

PACKAGE SUBSTRATE AND SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

STACKED DIE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTRO...

METHOD AND APPARATUS OF FABRICATING A PAD STRUCTURE FOR A SEMICONDU...

INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT

Window-type ball grid array semiconductor package