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CPC
H01L2224/06144
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/06144
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Patents Grants
last 30 patents
Information
Patent Grant
Electrical test structure applying 3D-ICS bonding technology for st...
Patent number
8,546,952
Issue date
Oct 1, 2013
National Chiao Tung University
Kuan-Neng Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRICAL TEST STRUCTURE APPLYING 3D-ICS BONDING TECHNOLOGY FOR ST...
Publication number
20130062776
Publication date
Mar 14, 2013
NATIONAL CHIAO-TUNG UNIVERSITY
Kuan-Neng Chen
H01 - BASIC ELECTRIC ELEMENTS