covering only portions of the surface to be connected

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H01L2224/09134

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/09134covering only portions of the surface to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor storage device
- Patent number 12,132,040
- Issue date Oct 29, 2024
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor storage device
- Patent number 11,710,727
- Issue date Jul 25, 2023
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 10,748,871
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Seong Hwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packages having a connection joint group
- Patent number 9,324,688
- Issue date Apr 26, 2016
- SK Hynix Inc.
- Ki Jun Sung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20210082897
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Nobuaki OKADA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20190295986
- Publication date Sep 26, 2019
- Samsung Electronics Co., Ltd.
- SEONG HWAN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20180096970
- Publication date Apr 5, 2018
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGES HAVING A CONNECTION JOINT GROUP
- Publication number 20150179608
- Publication date Jun 25, 2015
- SK HYNIX INC.
- Ki Jun SUNG
- H01 - BASIC ELECTRIC ELEMENTS